X11DPS-RE

NVMe
3 UPI
Intel Quick Assist Technology

Key Features


  1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
    Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
  2. Intel® C627
  3. Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
    Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
  4. 2 PCI-E 3.0 x16 (Low Profile),
    4 PCI-E 3.0 x16
    M.2 Interface: 2 PCI-E 3.0 x2
    M.2 Form Factor: 2260/2280/22110
    M.2 Key: M-Key
    *2 SATA Hybrid ports, RAID 0 & 1
  5. Dual LAN with 10GBase-T with Intel® X550
  6. 1 VGA D-Sub Connector port



Resources
Specifications
Product SKUs
MBD-X11DPS-RE
  • X11DPS-RE
 
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 13.5" x 16.73" (34.29cm x 42.49cm)
 
Processor
CPU
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
  • Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Note
  • *2933 MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
 
System Memory
Memory Capacity
  • 24 DIMM slots
  • Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz
  • Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type
  • 2666/2400/2133MHz ECC 3DS DDR4 LRDIMM, RDIMM
DIMM Sizes
  • LRDIMM: 64GB, 128GB
  • RDIMM: 32GB, 64GB, 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
 
On-Board Devices
Chipset
  • Intel® C627
IPMI
  • ASPEED AST2500
Graphics
  • ASPEED AST2500 BMC
Network Controllers
  • Dual LAN with 10GBase-T with Intel® X550
 
Input / Output
LAN
  • 2 RJ45 10GBase-T ports
USB
  • 2 USB 3.0 port(s) (2 rear)
Video Output
  • 1 VGA D-Sub Connector port(s)
Serial Port
  • 2 COM Port(s) (1 header; 1 rear)
DOM
  • 2 SuperDOM (Disk on Module) port with build power
TPM
  • 1 TPM Header
Expansion Slots
PCI-E
  • 2 PCI-E 3.0 x16 (Low Profile),
  • 4 PCI-E 3.0 x16
M.2
  • M.2 Interface: 2 PCI-E 3.0 x2
  • Form Factor: 2260/2280/22110
  • Key: M-Key
  • *2 SATA Hybrid ports, RAID 0 & 1
 
System BIOS
BIOS Type
  • AMI UEFI
 
Management
Software
  • SuperDoctor® 5, NMI, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, IPMI2.0, Watchdog, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support
System Management Software
  • IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
Voltage
  • VBAT, Monitors CPU voltages, Chipset Voltage, +5V standby, +5V, +3.3V, +12V, +1.8V, Memory Voltages
LED
  • UID/Remote UID
  • CPU / System Overheat LED
Temperature
  • Monitoring for CPU and chassis environment
FAN
  • 8x 4-pin fan headers (up to 8 fans)
  • System level control
  • PWM fan speed control
  • Status monitoring for speed control
  • 8x fans with tachometer monitoring
Other Features
  • WOL, UID, System level control, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, Chassis intrusion detection, RoHS, Halogen Free, Intel® QuickAssist Technology, Innovation Engine
 
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -30°C - 60°C (-22°F - 140°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Parts List
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11DPS-RE 1 X11DPS-RE Motherboard
Optional Parts List
Name Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
Server (Optimized for X11DPS-RE)
X11DPS-RE (For SuperServer Only)