H13SRA-F

Key Features


  1. AMD Ryzen™ Threadripper™ PRO 7000 WX-Series and Ryzen™ Threadripper™ 7000 Series Processors
    Single socket sTR5, LGA-4844, Up to 350W TDP, Overclocking supported
  2. AMD TRX50

  3. Up to 4TB of memory with speeds of 5200+MT/s (1DPC) with overclocking support
    **Memory addressing up to 1TB/channel is subject to AMD Infrastructure Roadmap for Socket sTR5 Processors
  4. M.2 Interface: 2 PCIe 4.0 x4 (RAID 0, 1)
    M.2 Form Factor: 2280/22110
    M.2 Key: M-Socket
  5. 2 PCIe 5.0 x16, support 2 triple/dual/single-width GPU cards
    2 PCIe 5.0 x8, open rear
  6. Dual 1Gb LAN with Broadcom BCM5720
  7. 4 SATA 3 (6Gb, RAID 0, 1, 10)
    1 MCIO connector (PCIe Gen4 x8) to support 2 U.2 ports via cable for NVMe 2.5" SSD drives
  8. 1 USB 3.2 Gen2x2 (20G, 1 rear Type-C)
    1 USB 3.2 Gen2x1 (10G, 1 header Type-C)
    4 USB 3.2 Gen2x1 (4 rear Type-A)
    1 USB 3.2 Gen1x1 (5Gb, 1 header Type-A 2 ports)
    1 USB 2.0 (1 header Type-A 2 ports)
  9. 1 Dedicated LAN for IPMI
  10. Overclocking supported on CPU and RDIMM
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Specifications Resources Parts List
Specifications
Product SKUs
MBD-H13SRA-F
Physical Stats
Form Factor
  • ATX
Dimension
  • 12" x 9.6" (30.48cm x 24.384cm)
Processor
CPU
  • AMD Ryzen™ Threadripper™ PRO 7000 WX-Series, AMD Ryzen™ Threadripper™ 7000 Series
  • Single Socket Socket sTR5 (LGA-4844) supported, CPU TDP supports Up to 350W TDP
Core
  • Up to 96 cores, 192 threads
System Memory
Memory Capacity
  • 4 DIMM slots
  • Up to 4TB ECC Registered RDIMM/3DS RDIMM, DDR5-5200MHz
  • Memory addressing up to 1TB/channel is subject to AMD Infrastructure Roadmap for Socket sTR5 Processors
Memory Type
  • 5200 MT/s ECC DDR5 RDIMM/3DS RDIMM
DIMM Sizes
  • RDIMM/3DS RDIMM: 16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB, 256GB, 512GB, 1024GB
Memory Voltage
  • 1.1V
On-Board Devices
Chipset
  • TRX50
SATA
  • 4 SATA3 ports; RAID 0,1,10
Audio
  • ALC 888S HD Audio 5.1 Channel
Network Controllers
  • Dual LAN with 1Gb Broadcom BCM5720
  • Single LAN with ASPEED AST2600, Dedicated LAN for IPMI
Input / Output
USB
  • 5 USB 3.2 Gen2x1 port(s) (1 header type C; 4 rear type A)
  • 1 USB 3.2 Gen2x2 port(s) (1 rear type C)
  • 2 USB 3.2 Gen1x1 port(s) (2 via header)
  • 2 USB 2 port(s) (2 via header)
Video Output
  • 1 VGA port(s)
Serial Port
  • 1 COM Port(s) (1 COM rear)
TPM
  • 1 TPM Header
Expansion Slots
PCIe
  • 2 PCIe 5.0 x8, Open rear,
  • 2 PCIe 5.0 x16, metal armor protection, support 2 triple/dual/single-width GPU cards,
  • 1 PCIe 4.0 x8, MCIO connector
M.2
  • M.2 Interface: 2 PCIe 4.0 x4, RAID 0, 1
  • Form Factor: 2280/22110
  • Key: M-Key
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.5
  • SMBIOS 3.6 or later
  • UEFI 2.9
  • RTC (Real Time Clock) Wakeup
Management
Software
Power Configurations
  • Power-on mode for AC power recovery, ACPI Power Management, Wake-On-LAN, S4/S5
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • System temperature, PCH temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support, Vmem, GPU temperature, NvMe temperature, Vcore, SAS HDD temperature
FAN
  • 7x 4-pin fan headers (up to 7 fans)
  • Fan speed control, CPU/System Overheat LED, Fan failed LED, UID/remote UID, HDD activity LED, LAN activity LED, CPU/Suspend-state indicator LED, 2 4-pin fan headers for CPU liquid cooling pump
Other Features
  • RoHS
  • Chassis intrusion detection
  • Power supply monitoring
Operating Environment
Operating Temperature Range
  • 0°C - 50°C (32°F - 122°F)
Non-Operating Temperature Range
  • -20°C - 60°C (-4°F - 140°F)
Operating Relative Humidity Range
  • 10% - 85%
Non Operating Relative Humidity Range
  • 10% - 95%
Resources
Chassis
Component Options
Software
Documentation
Parts List
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