Resource Library

STAC recently performed a STAC-AI™ LANG6 (Inference-Only) audit of the STAC-AI Pack for TensorRT-LLM (Rev D), running on a Supermicro SYS-222C-TN server hosting NVIDIA RTX PRO 6000 GPUs managed by Red Hat OpenShift 4.20. (ID: SMCI260303)

Supermicro’s Rear Door Heat Exchanger (RDHx) provides up to 120 kW of cooling capacity through a plug-and-cool design, enabling easy deployment and exceptional operational flexibility. Compatible with most standard racks, it is ideal for cooling nextgeneration high-density setups and significantly improves thermal performance. Its instant-upgrade capability and rapid installation minimize downtime, delivering superior agility for data center operators.

Adapting storage solutions to meet AI’s demands

Overcoming AI storage challenges with scalable, high-performance solutions

How data movement and storage design are becoming the dominant constraints in enterprise AI

Accelerating AI Workloads with Intelligent Core Prioritization and Turbo Boosting

New Intel® Flat Memory Mode Simplifies Memory Expansion

Significant Virtualization Efficiency Improvements Over 3rd Gen Intel Xeon Scalable Processor-Based Systems: 27% Less TDP Draw, 33% Lower Core Count, 50% Fewer Servers

Supermicro has partnered with Hammerspace to deliver Hammerspace Ready Nodes – Hammerspace Data Platform solutions based on Supermicro server hardware. Hammerspace Ready Nodes deliver the power of Hammerspace on pre-qualified hardware that is optimized for price-performance, with the convenience of a simplified purchasing model.

Supermicro, Red Hat, Senao, Lanner and Intel join forces to create a family of edge computing solutions that are AI-ready and scalable for workload consolidation

AI Performance and Efficiency at the Intelligent Edge, Powered by Intel

AI Factories from Supermicro and NVIDIA are complete, turnkey solutions designed to simplify enterprise AI deployment at scale, delivering faster time‑to‑online and time‑to‑revenue. These end‑to‑end AI infrastructure solutions combine high‑performance GPU compute, AI software, high‑speed networking, and scalable storage to accelerate data‑center‑ready AI workloads.