Overview

Highlights

  • New 2U 4-node architecture
  • Maximum performance density
  • Support for latest generation Intel® Xeon® 6900 series processors with up to 24,576 cores per rack
  • Support for latest generation AMD EPYC™ 9005 series processors with up to 36,864 cores per rack

Innovations

  • Direct-to-chip liquid cooling which removes 90% of server-generated heat
  • Modular design with optional components - only pay for what is needed
  • Front-accessible hot-swappable nodes enhance serviceability

Optimized for:

  • HPC Data Center
  • Financial Services
  • Manufacturing
  • Climate & Weather Modeling
  • Oil & Gas
  • Scientific Research
X14/H14 2U4N FlexTwin™ with Liquid Cooling

X14/H14 2U4N FlexTwin™ with Liquid Cooling

Purpose-built HPC-at-scale solution

  • CPU: Dual Intel Xeon 6900 series processors with P-cores or AMD EPYC™ 9005/9004 series processors per node
  • Memory: Up to 24 DIMMs per node, 9TB DDR5 or 3TB MRDIMM
  • Drives: Up to 2 front hot-swap E1.S PCIe 5.0 NVMe drive bays per node
  • PCIe: 1 PCIe 5.0 x16 (LP) + 1 PCIe 5.0 x16 (FHHL) + 1 PCIe 5.0 x16 AIOM per node
Show Models
Resources
Thumbnail: Supermicro FlexTwin™ + Cornelis CN5000 Omni-Path® 400G Solution Brief
Solution Brief

Supermicro and Cornelis Accelerate HPC Workloads with FlexTwin™ and Corrnelis CN5000 Omni-Path® 400G Solution

Read the Solution Brief
Video

Supermicro SuperMinute: New FlexTwin™ HPC-at-Scale Solution

Video

TECHTalk: New Supermicro X14 Max-Performance Multi-Nodes

Available Models

Certain products may not be available in your region