H15SPT-G (為了SuperServer 僅有的)

H15 GrandTwin

Key Features


  1. AMD EPYC™ 9006 SP7 Series Processors
  2. Support up to DDR5 16 DIMM slots (1DPC)
  3. 10 PCIe 6.0 x8 MCIO connectors
  4. 2 M.2 PCIe 5.0 x4 with NVMe support. Form factor: 22110/2280
  5. 2 USB 3.0 (GrandTwin I/O Module)
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Optimized Servers


Specifications Resources
Specifications
Product SKUs
MBD-H15SPT-G
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 8.52" x 14.92" (21.64cm x 37.9cm)
Processor
CPU
  • Single processor(s)
  • AMD EPYC™ 9006 SP7 Series Processors
Core Count
  • Up to 256C/512T; Up to 1024MB Cache
Note
  • Supports up to 600W TDP CPUs
System Memory
Memory
  • Slot Count: 16 DIMM Slots
  • Max Memory (1DPC): Up to 4TB 8000MT/s ECC DDR5 RDIMM/3DS RDIMM
  • Max Memory (1DPC): Up to 4TB 12800MT/s ECC DDR5 MRDIMM
Memory Voltage
  • 1.1V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
IPMI
  • ASPEED AST2700 BMC
Input / Output
USB
  • 2 USB 3.0 Type-A port(s) (via GrandTwin I/O Module)
Video
  • 1 ASPEED AST2700 BMC port(s) (via GrandTwin I/O Module)
TPM
  • 1 TPM 2.0 Header
Others
  • 10 MCIO (PCIe 6.0 x8) port(s)
Expansion Slots
M2
  • 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default)/2280)
System BIOS
BIOS Type
  • AMI 64MB SPI Flash EEPROM
BIOS Features
  • ACPI 6.6
  • UEFI 2.11
  • SMBIOS 3.8 or later
Management
Software
PC Health Monitoring
Voltage
  • +12V,+12V Standby,+3.3V,+3.3V standby,+5V,+5V standby,1.8V standby,VBAT
LED
  • BMC/IPMI Heartbeat LED
  • Power LED
  • UID/Remote UID
Temperature
  • CPU temperature
  • CPU thermal trip support
  • Memory temperature
  • Peripheral temperature
  • System temperature
  • VRM temperature
Resources
Servers (Optimized for H15SPT-G)
Parts List

H15SPT-G (For A+ Server Only) Coming Soon

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