SuperServer SSG-520P-ACTR12H

SSG-520P-ACTR12H Main SSG-520P-ACTR12H Angle SSG-520P-ACTR12H Top SSG-520P-ACTR12H Front SSG-520P-ACTR12H Rear
Integrated Board: X12SPI-TF
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Key Applications

  • Enterprise Server
  • Database Processing & Storage
  • Appliance Optimized Storage

Key Features

  1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP.
  2. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM
  3. 2 PCIe 4.0 x16 (LP) slots, 2 PCIe 4.0 x8 (LP) slots
  4. Intel® Ethernet Controller X550 2x 10GbE RJ45
  5. 12x Direct-attached hot-swap 3.5" SAS3/SATA3 drive bays, Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe/SATA (rear, optional)
  6. Redundant Titanium 800W Power Supply
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Specifications Resources Parts List
Specifications
Product SKUs
SuperServer SSG-520P-ACTR12H (Black)
Motherboard
Super X12SPI-TF
Processor
CPU
  • Single Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
Core Count
  • Up to 40C/80T; Up to 60MB Cache per CPU
Note
  • Supports up to 270W TDP CPUs (Air Cooled)
System Memory
Memory
  • Memory Capacity: 8 DIMM slots
  • Up to 2TB: 8x 256 GB DRAM
  • Up to 3TB: 4x 256 GB DRAM and 4x 512 GB PMem
  • Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM
  • Intel® Optane™ persistent memory 200 series
Memory Voltage
  • 1.2 V
Error Detection
  • Yes
On-Board Devices
SATA
  • SATA3 (6Gbps) via C621A Chipset; RAID 0, 1, 5, 10 support
SAS
  • SAS3 (12Gbps) via Broadcom 3916; RAID 0, 1, 5, 6, 10, 50, 60 support
Chipset
  • Intel® C621A
Network Connectivity
  • 2x 10GbE BaseT with Intel® X550
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 Dedicated IPMI LAN port
  • 2 RJ45 10GBase-T LAN ports
USB
  • 4 USB 2.0 port(s) (2 headers; 2 rear)
  • 5 USB 3.2 Gen 1 port(s) (2 headers; 2 rear; 1 Type A)
Video
  • 1 VGA port(s)
Serial Port
  • 1 COM Port(s) (1 header)
DOM
  • 2 SuperDOM (Disk on Module) port with built-in power
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Power Configurations
  • ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
CPU
  • 7+1 Phase-switching voltage regulator module (VRM)
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-826BTS-R802LPB
Dimensions and Weight
Height
  • 3.5" (89mm)
Width
  • 17.2" (437mm)
Depth
  • 25.6" (650mm)
Package
  • 11.5" (H) x 26.5" (W) x 34" (D)
Weight
  • Net Weight: 34 lbs (15.4 kg)
  • Gross Weight: 58 lbs (26.3 kg)
Available Color
  • Black
Front Panel
Buttons
  • Power On/Off 
  • System Reset
LEDs
  • Device Activity
  • LAN 1 Activity
  • LAN 2 Activity
  • Power Failure LED
  • Power status
  • System information
Expansion Slots
PCI-Express (PCIe)
  • 2 PCIe 4.0 x8 LP slot(s)
  • 2 PCIe 4.0 x16 LP slot(s)
Drive Bays / Storage
Hot-swap
  • 12x 3.5" hot-swap SATA/SAS drive bays
M.2
  • 1x PCIe 3.0 x4 and SATA
  • Form Factor: 2280, 22110
  • Key: M-key
Peripheral Bays
  • 2x 2.5" SATA or NVMe drive bays (optional)
System Cooling
Fans
  • 3x (8cm x8cm x3.8cm) heavy duty fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud(s)
Power Supply
800W Redundant Titanium Level power supplies
Dimension

(W x H x L)
  • 76 x 40 x 336 mm
AC Input
  • 800W: 100-240Vac / 50-60Hz
  • 800W: 200-240Vdc / 50-60Hz
+12V
  • Max: 66A / Min: 0A (100Vac-240Vac)
  • Max: 66A / Min: 0A (200Vdc-240Vdc)
5V SB
  • Max: 4A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level94%+   Titanium Level

 

  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)


Resources
Component Options
Drive OptionsNVMe OptionsTested AOC ListTested M.2 ListTested Memory
Documentation
ManualsQuick Reference Guide
Software
BIOS DownloadBMC DownloadDrivers & UtilitiesOS Certification
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X12SPI-TF

CSE-826BTS-R802LPB 		1

1 		Super X12SPI-TF Motherboard

2U Chassis
Add-on Card / Module AOC-S3916L-H16IR-32DD-P 1 16 int 12Gb/s ports, x8 Gen4, ROC - LP, 32HDDw/exp,RoHS
Backplane BPN-SAS3-LA26A-N12 1 2U 12-Slot LFF Backplane Supports 12 x SAS3/SATA3/NVMe4 Storage Devices with 1x(2x4) + 4x(1x4) power connectors, co-lay with BPN-SAS3-LA26A-N12,HF,RoHS
Cable CBL-CDAT-0728 1 4 Pin to 4 Pin I2C Cable, 65cm, 26AWG, 4 Wires, Pinout 1-1
CBL-SAST-1249-100 1 Slimline x8 (STR) to 2x Slimline x4 (STR),50CM,100 OHM,
CBL-SAST-1281-100 1 Slimline x8 (STR) to 2x Slimline x4 (STR),80CM,100 OHM,
CBL-CDAT-0921-85 1 [NR] I2C,(1x4F to 1x4F)/P2.5,85CM,26AWG,RoHS
CBL-PWCD-0160-IS 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,16AWG,RoHS/REACH
CBL-PWEX-1069 3 PWEX,FAN,1X4/P2.5 TO 1X4/P2.54,30CM,22AWG,5A/pin,RoHS
Parts MCP-260-00042-1N 1 Standard I/O Shield for X12SPi with EMI Gasket
Manual MNL-2361-QRG 1 520P-ACTR12L/H Quick Reference Guide
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0078P 1 2U Passive CPU Heat Sink for X12 Generation Intel Whitley and Cedar Island Platforms
*Power Supply PWS-802A-1R 2 1U 800W 100-240Vac/47-63Hz, and DC240 input
*Power Distributor PDB-PT826-8824 1 PDB with longer 24pin for SC826B
*Front Panel FPB-TB826-T 1 Chassis transfer board for SC826
*Drive Tray(s) MCP-220-00075-0B 12 Black gen 5.5 hot-swap 3.5" HDD tray
*Rear Window MCP-240-82608-0N 1 216B/826B LP rear window,RoHS/REACH,PBF
*Rail Set MCP-290-00053-0N 1 Rail set, quick/quick, default for 2,3U 17.2"W
MCP-290-00060-0N 1 Threaded rail adapter default for round hole rack
*Air Shroud MCP-310-29001-0N 1 SC825/826/216/213 Intel DP X9,X8 air shroud 13.68x13/12x13
*Fan FAN-0166L4 OR 3 80x80x38 mm, 13.5K RPM, Optional Middle Cooling Fan for 2U Ultra Series Servers (Hot-swappable Version of FAN-0162L4)
FAN-0206L4 80x80x38 mm, 13.5K RPM, Middle Cooling Fan for 2U and above Servers
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
2x 2.5" NVMe Cage (Rear) MCP-220-82619-0N + 1x CBL-SAST-1264-85 1 Rear hot-swap 2x 2.5" NVMe drive kit
2x 2.5" SATA/SAS Cage (Rear) MCP-220-82616-0N • 1 Rear hot-swap 2x 2.5" SATA/SAS drive kit
3.5" to 2.5" Converter Tray(s) MCP-220-00043-0N • - Hot-swap Gen-4 3.5" to 2.5" HDD tray, Black
CacheVault BTR-CVPM05 & BKT-BBU-BRACKET-05 (For S3916) 1 CacheVault for Broadcom 3916 with SuperCap mounting bracket for PCIe location
Intel VROC RAID Key for NVMe AOC-VROCINTMOD 1 Intel SSD Only Upgrade module; RAID 0/1/10/5
AOC-VROCPREMOD • 1 Premium Upgrade module (Intel + 3rd party Vendor SSD); RAID 0/1/10/5
AOC-VROCSTNMOD 1 Standard Upgrade module (Intel + 3rd party Vendor SSD); RAID 0/1/10
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
TPM AOM-TPM-9670V-S-O 1 TPM 2.0, vertical form factor, provisioned for server
AOM-TPM-9671V-S-O 1 TPM 1.2, vertical form factor, provisioned for server
UP Storage SuperServer SSG-520P-ACTR12H