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Ultra (new)
Twin Solutions (new)
MP Servers
GPU / Coprocessor
AMD Solutions
Power Supplies
Server Management

NEW! X11 (Skylake-SP) Solutions Brochure

NEW! X11 (Skylake-SP) Solutions Video

X11 Solutions Launch Video

X11 Product Loop Video

Case Study: Deliver IT Equipment For Evolving Business Opportunities

Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments

Fortune100 Case Study: MicroBlade

Solution Brief


SuperBlade® &

Press Releases:

New X11 Solutions
New Supermicro RSD

Supermicro Solutions based on Intel® Xeon® Scalable Processors

| Mainstream | WIO | DCO | GPU | Storage | Workstation | Twin | FatTwin | Ultra | Max IO |

Serverboards SKUs - Display  | ALL | UP | DP | MP | or Socket P / H4 |

 WIO Serverboards

The Supermicro WIO serverboard product family offers a range of new generation X11 motherboards which are designed to deliver a wide range of I/O options for accelerated computing. Users can optimize the storage and networking alternatives to accelerate performance, increase efficiency and find the perfect fit for their applications. In addition to enabling customizable configurations and optimization for multiple application requirements, Supermicro WIO SuperServers also provide attractive cost advantages and investment protection.

The Supermicro WIO SuperServer® product family supports up to: 3TB DDR4-2933MHz ECC memory in 12 DIMM slots per node with support for Intel® Optane™ DC Persistent Memory, 3/6 Add-on Cards in 1U/2U, 12 SATA 3.0 (6Gbps) ports with Intel® C620 controller, hot-swap 2.5" or 3.5" drive bays, SATA3 and NVMe hybrid ports, optional NVMe drives, LAN options up to 2x 10GBase-T or 2x 1GbE ports, redundant Titanium Level (96%) power supplies, integrated IPMI 2.0 with KVM over dedicated LAN, and dual or single 2nd generation Intel® Xeon® Scalable Processors up to 28 cores and 205W TDP.

Supermicro WIO serverboards are optimized for general purpose, ERP/MRP, and network and security appliance applications and are compatible with the following Supermicro chassis: SC113TQ, SC116TQ, SC213A, SC825TQ, and SC815TQ.

NVMe port option
3 AOC in 1U
SAS3 AOM support


  • Dual Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C622 chipset (X11DDW-NT); Intel® C621 chipset (X11DDW-L)
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 1 PCI-E 3.0 x32 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot, 1 PCI-E 3.0 x16 for AOM; M.2 Interface: PCI-E 3.0 x4
  • 4 PCI-E 3.0 NVMExpress x4 Internal Ports (X11DDW-NT)
  • 2x 10GBase-T LAN ports via Intel® C622 (X11DDW-NT)
  • 2x 1GbE LAN ports, 1 dedicated LAN for IPMI 2.0
  • 1 VGA, TPM 2.0 Header
  • 6 USB 3.0 ports (4 rear + 2 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary WIO, 12.3" x 13.4"

*Contact your Supermicro sales rep for more info.




  • Single Socket P (LGA 3647): 2nd Gen. Intel® Xeon® Scalable processors
  • Intel® C622 chipset
  • 6 DIMMs; up to 1.5TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x32 Left Riser Slot
  • M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
  • 2x 10GBase-T LAN ports via Intel® X557
  • IPMI 2.0 and KVM with dedicated LAN
  • 10 SATA3 (6Gbps) ports via C622
  • 4 SAS3 (12Gbps) ports via Broadcom 3008 (X11SPW-CTF)
  • 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
  • 5 USB 3.0 (2 rear, 2 via header, 1 Type A), 7 USB 2.0 ports (2 rear, 5 via headers)
  • 2 SuperDOM (Disk on Module) ports
  • Form factor: Proprietary WIO, 8.15" x 13.05"

Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis

New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2933MHz
  • Support for Intel® Optane™
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency

Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

Support Resources:

  • DP MB Selection Tool

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