Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Ultra | Twin | FatTwin | DCO | WIO | GPU | Mainstream | Storage | Workstation | Max IO |


  SuperServer® SKUs -  | ALL | 1U | 2U | 3U/4U | UP | DP | MP | Socket P / H4 |

 Supermicro SuperServer®

Supermicro's X11 DP and UP SuperServer®, SuperWorkstation, SuperStorage, and SuperBlade® solutions offer numerous advantages and the highest levels of performance, efficiency, security and scalability in the industry. Supermicro X11 SuperServers support the latest 2nd generation Intel® Xeon® Scalable processors and offer up to 6TB DDR4-2933MHz memory in 24 DIMMs, Intel® Optane™ DC Persistent Memory, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe hot-swap HDD/SSD support, 10GBase-T/10G SFP+/56Gbps FDR InfiniBand networking options, redundant Titanium Level (96%+) Digital power supplies, and IPMI 2.0 plus KVM with dedicated LAN. The SuperWorkstation systems offer in addition 7.1 HD Audio, and up to 11 USB ports.

The Supermicro X11 DP and UP solutions are offered in the industry's broadest variety of form factors, including 1U, 2U, 3U/Mini-Tower, 4U/Tower, and 8U SuperBlade® addressing the widest array of product/market and application segments:

  • Data Center Optimized (DCO)
  • Application Optimized
  • I/O Optimized (WIO)
  • Twin
  • TwinPro™
  • FatTwin™
  • BigTwin™
  • GPU/Coprocessor
  • SuperWorkstation
  • SuperStorage
  • SuperBlade®
  • MicroBlade
  • MicroCloud
  • Max IO

The X11 platforms enable Supermicro to offer the most extensive and technologically advanced range of computing solutions for Data Center, Enterprise, Cloud, HPC, AI/ML, Hadoop/Big Data, Storage, and Embedded environments.

Power efficiency in high availability, mission-critical applications is increased with upgraded high speed cooling architectures including high-speed fans, high-efficiency redundant Titanium Level (96%+) Digital Switching power supplies, BBP® (Battery Backup Power) and integrated SuperCap (CacheVault) power supply technologies.

When combined with full Rack Integration Services, Hardware Maintenance Services, and Data Center Management Software that manages health, power, and maintenance of servers in large deployments, Supermicro X11 Serverboard, Chassis, SuperServer®, SuperWorkstation, SuperStorage, and SuperBlade® platforms provide the most complete, scalable computing solutions with maximum performance and the highest levels of efficiency and reliability.


BigTwin
8 Hot-swap 3.5" Bays
3 Peripheral 5.25" bays
Cost Effective

 / 

  • 4U Mainstream Server for Virtualization and Multi Tasking
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 3.5" SATA3 drive bays, 3 Peripheral 5.25" bays, 2 opt. fixed 2.5" SATA, SSD/NVMe
  • 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8 slots
  • 2x 10GBase-T (-TRT) / 1GbE (-TR) ports, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
  • 3 Hot-swap PWM cooling fans and 2 Hot-swap rear fans
  • 1280W Redundant Platinum Level Power Supplies

*Contact your Supermicro sales rep for more info.

 
BigTwin
11 PCI-E Slots
8 Hot-swap 3.5", 2 Peripheral 5.25"


  • 3U Max I/O Server - Expansion / Performance / Flexibility
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 8 Hot-swap 3.5" SATA3 drive bays and 2 Peripheral 5.25" bays
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16 (HSSI), 2 PCI-E 3.0 x16 (or 4 PCI-E x8), 4 PCI-E 3.0 x8 , 1 PCI-E 3.0 x4 (in x8 slot)
  • 1 PCI-E 3.0 x4 M.2 2280 slot from PCH
  • 2 GbE, 1 Video, 2 COM, 4 USB 3.0 (2 rear, 2 via header), 4 USB 2.0 (2 rear, 2 via header), 1 Type A
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 3x 80mm middle fans and 1x 80mm fear exhaust fan
  • 980W Redundant Platinum Level Power Supplies

*Contact your Supermicro sales rep for more info.

 
BigTwin
Rear I/O, 8-Node, Each:
6 Hot-swap 2.5" SAS3/SATA3/NVMe opt.

 / 
 / 
 / 

  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • Storage Options (all Hot-swap):
    • SYS-F619P2-RT – 6x 2.5" SATA3
    • SYS-F619P2-RTN – 6x 2.5" SATA3 or 2 SATA3 + 4 NVMe U.2
    • SYS-F619P2-RC0 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F619P2-RC1 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 3x 4cm 20k RPM middle fans
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Rear I/O, 4-Node, Each:
8 Hot-swap 3.5" SAS3/SATA3/NVMe opt.

 / 
 / 
 / 

  • FatTwin™ Server; EACH NODE (x4 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • Storage Options (all Hot-swap):
    • SYS-F629P3-RTB – 8x 3.5" SATA3
    • SYS-F629P3-RTBN – 8x 3.5" SATA3 or 6 SATA3 + 2 NVMe U.2
    • SYS-F629P3-RC0B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F629P3-RC1B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 2x 8cm 14k RPM middle fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Up to 2 GPUs
7.1 HD Audio


  • CAD/CAM/CAE, 3D Rendering, Digital Content Creation, Oil and Gas Simulation, Research lab/National Lab
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4x 3.5" drive bays supported by 90° rotating hard drive cage
  • Optional 4x 2.5" internal drive bays (supports 2 NVMe via opt. cables)
  • 2x 5.25" Peripheral drive bays
  • 4 PCI-E 3.0 x16, 2 PCI-E x8
  • 2x 1GbE, 1 shared IPMI port
  • 1 VGA, 1 COM, 6 USB 3.0, 2 USB 3.1, M.2, 7.1 HD Audio
  • 1 rear 12cm exhaust fan, 1 front 12cm cooling fan
  • 1200W Platinum Level Power Supply

*Contact your Supermicro sales rep for more info.

 
BigTwin
Up to 2 GPUs
7.1 HD Audio


  • CAD/CAM/CAE, 3D Rendering, Digital Content Creation, Oil and Gas Simulation, Research lab/National Lab
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 3.5" drive bays (SATA3 by default, SAS3 via opt. AOC, 2 NVMe support with optional cables)
  • 4 PCI-E 3.0 x16, 2 PCI-E x8
  • 2x 1GbE ports, 1 shared IPMI port
  • 1 VGA, 1 COM, 6 USB 3.0, 2 USB 3.1, M.2, 7.1 HD Audio
  • 2 Super quiet PWM fans and 1 Super quiet rear fan
  • 1200W Platinum Level Power Supply

*Contact your Supermicro sales rep for more info.

 
BigTwin
Up to 4 GPUs


  • GPU Server, Mission-critical app., enterprise server, large database, e-business, on-line transaction processing, oil & gas, medical app.
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 3.5" drive bays (2 SATA3 ports by default)
  • 4 PCI-E 3.0 x16 (double-width), 2 PCI-E 3.0 x16 (single-width), 1 PCI-E x4 (in x8) slots
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0, 7.1 HD Audio
  • 4 heavy duty fans, 4 exhaust fans, 2 active heat sinks with optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
16 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6039P-E1CR16H - SAS3 via Broadcom 3108 AOC
    • SSG-6039P-E1CR16L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
24 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24" Hot-swap 3.5 SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6049P-E1CR24H - SAS3 via Broadcom 3108 AOC
    • SSG-6049P-E1CR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
36 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6049P-E1CR36H - SAS3 via Broadcom 3108 AOC
    • SSG-6049P-E1CR36L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 4TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
36 Hot-swap 3.5" SAS3/SATA3


  • Connectivity/Storage Compute Nodes, Database Processing & Storage Appliance Platform
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via Intel X722 + X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 7 High-performance 80mm PWM fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
7U 8-Way
224 Cores per System
96 DDR4 DIMMs


  • In-Memory Database Application, Research lab/National Lab, Scale-up HPC, Virtualization, ERP, CRM
  • Octa Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 8S-3 UPI up to 10.4GT/s
  • Up to 23 or 39 (OEM) PCI-E 3.0 slots, 32 U.2 NVMe support opt. available
  • 96 DIMMs; up to 24TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM using 8x X11OPi-CPU modules
  • Supports Intel® Optane™ DCPMM*
  • 16 Hot-swap 2.5" SAS3 drive bays (w/ RAID cards); 8x 2.5" or 6x 3.5" internal drive bays (w/ RAID cards)
  • 4x 10GBase-T via SIOM, 1 dedicated IPMI
  • 1 VGA, 1 COM, 2 USB 2.0 (rear)
  • 8x 9cm 10.5K-10.8K RPM Hot-Swap Counter-rotating Rear Fans
  • 5x 1600W (N+2) Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin

 / 

  • Backup Storage, Cold Storage; Database Applications; Data Warehousing, Archiving
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays (NVMe/SATA optional)
  • Storage Options:
    • SSG-5049P-E1CR45H – SAS3 via Broadcom 3108 AOC
    • SSG-5049P-E1CR45L – SAS3 via Broadcom 3008 AOC
  • 8 DIMMs; up to 2TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2 GbE LAN ports via Intel i210, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 5 Hot-swap 8cm redundant PWM fans
  • 1600W Redundant Platinum Level Power Supplies

*Contact your Supermicro sales rep for more info.

 
BigTwin

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays, 6 optional NVMe bays
  • Storage Options:
    • SSG-6049P-E1CR45H – SAS3 via Broadcom 3108 AOM
    • SSG-6049P-E1CR45L – SAS3 via Broadcom 3008 AOM
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card slot
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 1600W Redundant Platinum Level Power Supplies

*Contact your Supermicro sales rep for more info.

 
BigTwin


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays, 6 optional NVMe bays
  • Storage Options:
    • SSG-6049P-E1CR45L+ – SAS3 via Broadcom 3616 AOM
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card slot
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 1600W Redundant Platinum Level Power Supplies

*Contact your Supermicro sales rep for more info.

 
BigTwin

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 60 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays
  • Storage Options:
    • SSG-6049P-E1CR60H – SAS3 via Broadcom 3108 AOM
    • SSG-6049P-E1CR60L – SAS3 via Broadcom 3008 AOM
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 2000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 60 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays
  • Storage Options:
    • SSG-6049P-E1CR60L+ – SAS3 via Broadcom 3616 AOM
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 2000W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Up to 8 NVIDIA GPUs


  • 3D rendering, Astrophysics, Chemistry, Cloud Computing, Virtualization, Compute intensive application
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • Up to 24 Hot-swap 2.5" Drive Bays, 8x 2.5” drives supported natively
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 PCI-E 3.0 x16 (double-width), 2 PCI-E 3.0 x8 slots, 1 PCI-E 3.0 x4 slot
  • I/O ports: 2x 10GBase-T, 1 Video, 1 COM, 4 USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 8x 92mm RPM Hot-Swappable Cooling Fans
  • 2000W (2+2) Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Up to 8 GPUs


  • Artificial Intelligence, Big Data Analytics, High-performance Computing, Research Lab/National Lab, Astrophysics, Business Intelligence
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 2.5" drive bays (8x 2.5" drives supported natively)
  • 11 PCI-E 3.0 x16 (FH, FL) and 1 PCI-E 3.0 x8 (in x16) slots
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0
  • 8x 92mm Hot-swap cooling fans
  • 2000W (2+2) Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Up to 8 NVIDIA GPUs


  • Artificial Intelligence, Big Data Analytics, High-performance Computing, Research Lab/National Lab, Astrophysics, Business Intelligence
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 2.5" drive bays (8x 2.5" drives supported natively)
  • 11 PCI-E 3.0 x16 (FH, FL) and 1 PCI-E 3.0 x8 (in x16) slots
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0
  • 8x 92mm Hot-swap cooling fans
  • 2000W (2+2) Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Up to 8 NVIDIA Tesla
V100 SXM2 GPUs
Up to 300 GB/s
GPU-to-GPU NVLINK


  • Artificial Intelligence, Big Data Analytics, High-performance Computing, Research Lab/National Lab, Astrophysics, Business Intelligence
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 16 Hot-swap 2.5" drive bays (support 8 NVMe drives)
  • 4 PCI-E 3.0 x16 (LP, GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray)
  • 2x 10GBase-T ports via Intel X540, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (front)
  • 8x 92mm cooling fans, 4x 80mm cooling fans
  • 2200W (2+2) Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin


  • Designed for Content Creation, Engineering and  Scientific applications
  • Single socket R4 supports Intel® Xeon® processor W Family; Intel® C422 Chipset
  • 4 Fixed 3.5" drive bays; 2 optional 5.25" Peripheral drive bays
  • 3 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 slots, 2 U.2, 2 M.2 M key
  • Up to 512GB Registered ECC LRDIMMs, up to DDR4‑2666MHz; in 8 DIMM slots
  • Dual GbE LAN ports
  • 6 SATA3 ports via PCH; RAID 0, 1, 5, 10
  • 2 USB 3.1 (2 Type A), 6 USB 3.0 (4 rear, 2 headers), 6 USB 2.0 (2 rear, 4 headers)
  • ALC 1220 7.1 HD Audio
  • 1x 12cm front cooling fan
  • 900W High Efficiency Power Supply
 
BigTwin

 (Coming Soon)
  • Single Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 8 Hot-swap 3.5" SAS3/SATA3 drive bays (SATA3 by default) with SGPIO
  • 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16) slots
  • 1x 10GBase-T and 1x 1GbE port, 1 dedicated IPMI port
  • 1 VGA, 1 COM, 6 USB 3.1 Gen1, 4 USB 3.1 Gen2, M.2, 7.1 HD Audio
  • 2 Super quiet PWM fans and 1 Super quiet rear fan
  • 1200W Platinum Level Power Supply

*Contact your Supermicro sales rep for more info.

 
BigTwin
Up to 20 single-width GPUs

 (Coming Soon)
  • AI/Deep Learning, Video Transcoding
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 3.5" drive bays, 2 optional 2.5" U.2 NVMe drives
  • 20 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x8 (FHFL, in x16 slot)
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0 (rear)
  • 8x 92mm RPM Hot-Swappable Cooling Fans
  • 2000W (2+2) Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
4-Way MP
112 Cores per System
48 DDR4 DIMMs


  • High Throughput Ingest, High Density Hot Storage, HPC / Data Analytics, Media/Video Streaming, Content Delivery Network (CDN), Big Data Top of Rack
  • Quad Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 6 PCI-E 3.0 x16 slots, 10 PCI-E 3.0 x8 slots (Up to 6 double width passive GPUs)
  • 48 DIMMs; up to 12TB 3DS ECC DDR4 2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 24 Hot-swap 3.5" SAS3/SATA3 drive bays via opt. RAID card; 8 Hybrid ports with NVMe support via opt. AOC
  • 4x 10GBase-T via AOC, 1 dedicated IPMI
  • 1 VGA, 1 COM, 2 USB 3.0 (rear)
  • 8x 9cm heavy duty fans with speed control
  • 1600W (3+1) Redundant Platinum Level Power Supplies

*Contact your Supermicro sales rep for more info.

 
BigTwin
Front I/O, 8-Node,
Each: 2/4 Fixed 2.5" SATA3/ NVMe


  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 or 4 Fixed 2.5" SATA3/NVMe drive bays
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 2 M.2 support
  • 8x 8cm 13.5k RPM rear fans
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Rear I/O, 8-Node, Each:
6 Hot-swap 2.5"

 / 
 / 

  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: 
  • 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz L/RDIMM, Up to 2TB Intel® DCPMM (Optane™)
  • Supports Intel® Optane™ DCPMM*
  • Storage Options (all Hot-swap):
    • SYS-F619P2-RTN – 6x 2.5" SATA3 or 2 SATA3 + 4 NVMe U.2
    • SYS-F619P2-RC0 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F619P2-RC1 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 3x 4cm 20k RPM middle fans
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Front I/O, 8-Node,
Each: 2 Fixed 3.5" SATA3


  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 2 Fixed 3.5" SATA3 drive bays
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 2 M.2 support
  • 8x 8cm 13.5k RPM rear fans
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 
BigTwin
Rear I/O, 4-Node, Each:
8 Hot-swap 3.5"

 / 
 / 

  • FatTwin™ Server; EACH NODE (x4 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 3TB 3DS ECC DDR4‑2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • Storage Options (all Hot-swap):
    • SYS-F629P3-RTBN – 8x 3.5" SATA3 or 6 SATA3 + 2 NVMe U.2
    • SYS-F629P3-RC0B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F629P3-RC1B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 2x 8cm 14k RPM middle fans
  • 1200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

Titanium Level
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2933MHz
  • Support for Intel® Optane™
    DCPMM
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

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