SuperServer SSG-640SP-DE2CR90 (Complete System Only)

SSG-640SP-DE2CR90 Main SSG-640SP-DE2CR90 Angle SSG-640SP-DE2CR90 Top SSG-640SP-DE2CR90 Node SSG-640SP-DE2CR90 Front SSG-640SP-DE2CR90 Rear SSG-640SP-DE2CR90 Side
Integrated Board: X12DSC-6
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Key Applications

  • Big Data & Analytics, Data Lake
  • HPC and AI/ML Workloads
  • Telco & Cloud Service Providers
  • Financial Services & Healthcare Image Archives
  • Content Repositories
  • Government Data Protection

Key Features

Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following:
  1. Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node
  2. 16 ECC DDR4-3200: LRDIMM/RDIMM
  3. 3 x PCIe 4.0 x16 HHHL PCIe slots
  4. 90 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110)
  5. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans
  6. 2600W Redundant Power Supplies Titanium Level (96%)
  7. HBA Controller support via Broadcom® 3616
    Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
  8. Dedicated node to node connectivity featuring high performance NTB PCIe 4.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support
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Specifications Resources Parts List
Specifications
Product SKUs
SuperServer SSG-640SP-DE2CR90 (Black)
Motherboard
Super X12DSC-6
Processor (per Node)
CPU
  • Dual Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
  • Support CPU TDP 120-205W
Cores
  • Up to 36C/72T; Up to 54MB Cache
System Memory (per Node)
Memory
  • Memory Capacity: 16 DIMM slots
  • Up to 4TB: 16x 256 GB DRAM
  • Memory Type: 3200MHz ECC DDR4 RDIMM;LRDIMM
Memory Voltage
  • 1.2 V
Error Detection
  • ECC
On-Board Devices (per Node)
Chipset
  • Intel® C621A
Network Connectivity
  • 2x 10GbE BaseT with X550
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN
  • 1 RJ45 Dedicated IPMI LAN port
  • 2 RJ-45 10Gbase-T ports
USB
  • 2 USB 3.0 port(s) (2 Rear_USB)
Video
  • 1 VGA port(s)
Serial Port
  • 1 COM Port(s) (1 rear)
DOM
  • 2 SuperDOM (Disk on Module) port
System BIOS
BIOS Type
  • AMI 128MB SPI Flash EEPROM
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
PC Health Monitoring
CPU
  • 4+1 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 4U Rackmount
Model
  • CSV-947HTS-R2K63P
Dimensions and Weight
Height
  • 7"
Width
  • 17.6"
Depth
  • 42.1"
Package
  • 29.92" (H) x 35.82" (W) x 53.15" (D)
Weight
  • Net Weight: 150 lbs (68.04 kg)
  • Gross Weight: 240 lbs (108.86 kg)
Available Color
  • Black
Expansion Slots (per Node)
PCI-Express (PCIe)
  • 3 PCIe 4.0 x16 LP slot(s)
Drive Bays / Storage (per Node)
Hot-swap
  • 90x 3.5" hot-swap SATA3/SAS3 drive bays
  • 2x 2.5" 7mm drive bays
M.2
  • 2 M.2 NVMe
System Cooling
Fans
  • 6 Heavy Duty 8cm Fan(s)
Power Supply
1U 2600W redundant power supply
Dimension

(W x H x L)
  • 73.5 x 40 x 265 mm
AC Input
  • 2600W: 200-240Vac / 15A Max / 50-60Hz
DC Input
  • 2600W: 240-240Vdc For CQC only/ 15A Max
+12V
  • Max: 216A / Min: 0A (11.4Vdc-12.6Vdc) (12V output)
Output Type
  • 25 Pairs Gold Finger Connector
Certification Titanium Level94%+   Titanium Level

 

  [ Test Report ]
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (Non-Condensing)
  • Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)


Resources
Component Options
Drive OptionsTested AOC ListTested M.2 ListTested Memory
Documentation
Manuals
Software
BIOS DownloadBMC DownloadDrivers & UtilitiesExpander FirmwareOS Certification
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X12DSC-6

CSV-947HTS-R2K63P 		2

1 		Super X12DSC-6 Motherboard

4U Chassis
Add-on Card / Module AOM-S3616-S-P 2 Storage 3616 controller for serviceable60/90baysystems.
Backplane BPN-ADP-30SAS3-1 3 Adapter board between Expander and HDD BPN for CSE-947H,RoHS
BPN-SAS3-947EB 6 HDD Backplane (15-slot) for CSE-947H 60/90-bay top load chassis/server.,RoHS
BPN-SAS3-947EL 6 SAS3 expander module for top-load 60/90-bay single/twin/SBB CSE-947 project,RoHS
BPN-SAS3-947SB 1 Midplane for topload CSE-947 60/90-bay SBB/Twin/single-node system,RoHS
Cable CBL-0066 2 39" 9 PIN COM PORT EXTENSION CABLE
CBL-0082L 2 Y SPLIT SATA POWER ADAPTER, PB FREE
CBL-0473L 4 21CM 30AWG SATA CBL, S-S
CBL-OTHR-1062-25 2 CBL,VGA,DP15/F, to 2X7F/P2.0,25CM,RoHS
CBL-OTHR-1104 1 90 SBB,SlimlineULP x12 to SlimlineLP x8,FFC,100 OHM to
CBL-PWCD-0376-IS 2 PWCD,US,IEC60320 C19 TO C20,940mm (3ft),14AWG,15A,250V,Black
CBL-PWEX-1100-25 2 MicroFit 2x2F/PH3.0 to 1x4F/PH5.08,25cm,10A/pin,16AWG,R
CBL-PWEX-1265 2 2x4,PH3.0 to 2x4,PH4.2,20CM,16AWG,9.5A/pin,RoHS
Software SFT-OOB-LIC 2 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0078PR 4 2U Proprietary Passive CPU Heat Sink for X12 Generation Hype-E Series Servers
Optional Parts List
Part Number Qty Description
Network Cards AOC-S25G-M2S - Standard LP, 2x 25GbE SFP28, Mellanox ConnectX-4 LX EN
More - AOC Compatibility Matrix (Select Storage & X12)
AOC-SGP-I2 - Standard LP 2-port GbE, Intel 82575
AOC-S40G-I2Q - Standard LP 2-port 40GbE controller, Intel Fortville XL710
TPM Module AOM-TPM-9671V - SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
AOM-TPM-9670V - SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
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