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NRF 2026

Javits Center, New York, NY (Booth 5281)
1 月 11 - 1 月 13, 2026

Join us for NRF 2026 this January, 2026

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Supermicro Unveils High-Density, Liquid-Cooled and Air-Cooled 6U SuperBlade® Powered by Intel® Xeon® 6900 Series Processors for Maximum Performance and Efficiency

  • 6U SuperBlade's innovative design delivers up to 93% cable reduction and 50% space savings compared to traditional 1U servers
  • 32-inch depth enclosure fits in a standard 19-inch rack, eliminating the need for a deep rack
  • Supports both air cooling (6U 5 nodes) and liquid cooling (6U 10 nodes)
  • Powered by dual Intel Xeon 6900 Series Processors with P-cores, the 6U SuperBlade delivers high compute density, supporting up to 100 servers per rack
  • Optimized for demanding HPC and AI workloads including manufacturing, financial services, scientific research, energy and climate & weather modeling
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HPC and AI converging infrastructures

Vik Malyala, Managing Director & President for EMEA from Supermicro shares the boundaries between HPC and AI workloads becoming increasingly blurred

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Supermicro擴大NVIDIA Blackwell產品系列,推出全新4U與2-OU(OCP)液冷NVIDIA HGX B300解決方案,現可大量出貨

  • 本次推出的4U與2-OU(OCP)液冷NVIDIA HGX B300系統,適用於高密度超大規模設施與AI工廠的部署。這兩款機型基於Supermicro Data Center Building Block Solutions®架構,並分別採用DLC-2與DLC散熱技術
  • 4U液冷NVIDIA HGX B300系統可適用於標準的19吋EIA機架,可在每機架內支援最高64個GPU,並能透過DLC-2(直接液冷)技術為最高98%的系統熱能進行冷卻
  • 緊湊、高能效的2-OU(OCP)NVIDIA HGX B300 8-GPU系統針對21吋OCP Open Rack V3(ORV3)規格所設計,可在單一機架內支援最高144個GPU
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