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Key Applications
- Hyperscale / Hyperconverged
- HPC and Big Data
- Data Center Enterprise Applications
- Scale Out Storage
- Telco Data Center
- Virtualization Server
Key Features
8 Hot-pluggable System Nodes in a 4U form factor. Each node supports:
1. Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
2. Up to 2TB ECC 3DS LRDIMM,
up to DDR4-3200MHz; 8 DIMM slots
3. Expansion slots: 1 PCI-E 4.0 x16 (LP Riser),
1 PCI-E 4.0 x16 (for AIOM)
4. AIOM Network card,
1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 6 Hot-swap 2.5" drive bays:
2 NVMe/SATA3,
4 SATA3 (optional NVMe with additional cables)
M.2 Interface: 4 SATA/PCI-E 4.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
7. 3x 4cm 17.6K RPM middle fans
8. 2200W Redundant Power Supplies
Titanium Level (96%)
(Full redundancy based on
configuration and application load)

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Complete System Only: To maintain quality and integrity, this product is sold only as a completely assembled system (for optimal performance 8 DIMMs is recommended). Minimum requirement is 1 CPU, 4 DIMMs, 1 HDD/NVMe and 1 AIOM/AOC NIC card per node.
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AS -F1114S-RNTR |
- A+ Server F1114S-RNTR (Black)
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CPU |
- Single AMD EPYC™ 7003/7002 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
- Socket SP3
- Supports CPU TDP / cTDP up to 280W*
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Cores |
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Note |
* Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
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Memory Capacity |
- 8 DIMM slots
- Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
- 8-channel memory bus
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Memory Type |
- DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
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Memory Sizes |
- 8GB, 16GB, 32GB, 64GB, 128GB, 256GB
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Memory Voltage |
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Error Detection |
- Corrects single-bit errors
- Detects double-bit errors (using ECC memory)
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Chipset |
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SATA |
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Network Controllers |
- Flexible networking via
AIOM (not included, must add 1 per node)
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IPMI |
- Support for Intelligent Platform Management Interface v.2.0
- IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
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Graphics |
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LAN |
- Flexible networking via AIOM
- 1 RJ45 Dedicated IPMI LAN port
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USB |
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VGA |
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Others |
- 1 COM port
- 1 TPM 2.0 header
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BIOS Type |
- 256Mb SPI Flash EEPROM with AMI BIOS
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Software |
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Power Configurations |
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CPU |
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FAN |
- Fans with tachometer monitoring
- Status monitor for speed control
- Pulse Width Modulated (PWM) fan connectors
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Temperature |
- Monitoring for CPU and chassis environment
- Thermal Control for fan connectors
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Form Factor |
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Model |
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Width |
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Height |
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Depth |
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Package |
- 28.3" (W) x 15.0" (H) x 42.4" (D)
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Weight |
- Net Weight: 150 lbs (68.04 kg)
- Gross Weight: 200 lbs (90.71 kg)
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Available Colors |
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Buttons |
- Power On/Off button
- UID button
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LEDs |
- Power status LED
- Hard drive activity LED
- Network activity LEDs
- Information LED (UID, Fan failure, Overheat)
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PCI-Express |
- 1 PCI-E 4.0 x16 (Low-profile riser)
- 1 PCI-E 4.0 x8 (Internal RAID AOC)
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Hot-swap |
- 2 Hot-swap 2.5" NVMe/SATA3 and 4 SATA3 (optional NVMe with additional cables)
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M.2 |
- M.2 Interface: 4 SATA/PCI-E 4.0 x4
- M.2 Form Factor: 2242, 2260, 2280, 22110
- M.2 Key: M-Key
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1 SATA/NVMe backplane |
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Fans |
- 3x 4cm 17.6K RPM middle fans
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2200W Redundant Power Supplies with PMBus |
Total Output Power and Input |
- 1200W with Input 100-127Vac
- 1800W with Input 200-220Vac
- 1980W with Input 220-230Vac
- 2090W with Input 230-240Vac
- 2200W with Input 220-240Vac (for UL/cUL use only)
- 2090W with Input 230-240Vdc (for CCC only)
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AC Input Frequency |
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Dimension (W x H x L) |
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+12V |
- Max: 100A / Min: 0A (100-127Vac)
- Max: 150A / Min: 0A (200-220Vac)
- Max: 165A / Min: 0A (220-230Vac)
- Max: 174.17A / Min: 0A (230-240Vac)
- Max: 183.3A / Min: 0A (220-240Vac)
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5VSB |
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Output Type |
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Certification |

Titanium Level [ Test Report ]
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RoHS |
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Environmental Spec. |
- Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
- Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
- Operating Relative Humidity:
8% to 90% (non-condensing)
- Non-operating Relative Humidity:
5% to 95% (non-condensing)
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See Parts List
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Part Number
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Qty
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Description
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Motherboard / Chassis |
MBD-H12SSFR-AN6
CSE-F418BC3-R2K20B
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8
1
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Super H12SSFR-AN6 Motherboard
4U Chassis
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Backplane |
BPN-ADP-X11DPFR |
8 |
Power distribution board |
Backplane |
BPN-NVME4-F418-B6S6 |
8 |
1U 6-Slot SFF Backplane Supports 6xSAS3/SATA3/NVMe4 Storage Devices,HF,RoHS |
Cable 1 |
CBL-0486L |
16 |
2x2 to 2x2 15cm Power Cable HF |
Cable 2 |
CBL-OTHR-1211-28 |
8 |
2x10pin (PH 1) to 2x10pin (PH 1),11CM,28AWG,1A/pin,RoHS |
Cable 3 |
CBL-PWCD-0900 |
4 |
PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17 |
Cable 4 |
CBL-SAST-1223-85 |
8 |
Slimline x8 (LE) to 2x Slimline x4 (STR),22/22CM,85 OHM |
Cable 5 |
CBL-SAST-1247-100 |
16 |
Slimline x4 (LE) to MiniSAS HD x4 (STR),47CM,100 OHm,Ro |
Heatsink / Retention |
SNK-P0062P |
8 |
1U Passive CPU Heat Sink for AMD Socket SP3 Processors |
Riser Card |
RSC-S-6G4 |
8 |
1U LHS Standard riser card with one PCI-E 4.0 x16 slot,HF,Ro |
Power Supply |
PWS-2K20A-1R |
4 |
1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm |
Backplane |
BPN-PDB-X12DPFR |
2 |
FatTwin 4U 4-Node PDB with LCMC for RIO Platform |
Rail Set |
MCP-290-41803-0N |
1 |
Fat twin F418 / F424 Static Rail set support 28-33.5 inch depth rail,RoHS/REACH,PBF |
Software |
SFT-OOB-LIC •  |
1 |
OOB Management Package (per node license) |
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Part Number |
Qty |
Description |
Cable(s) for Additional NVMe Support |
CBL-SAST-1223-85 |
2 |
Slimline x8 (LE) to 2x Slimline x4 (STR),22/22CM,85 OHM |
Software |
SFT-DCMS-Single |
1 |
DataCenter Management Package (per node license) |
Hide Parts List
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