MicroBlade MBI-6128R-T2X

  Products  MicroBlade   [ MBI-6128R-T2X ]









Integrated Board
B1DRI


Views: | Angled View | Rear View |

| Angled Node View | Top Node View |

Key Features

• 196 Xeon DP nodes (7056 cores)

    per 42U Rack

• 95% Cable reduction

1. Dual socket R3 (LGA 2011) supports

    Intel® Xeon® processor E5-2600

    v4†/ v3 family; QPI up to 9.6GT/s
2. 8x 288-pin DDR4 DIMM sockets

    up to 256GB VLP RDIMM
3. 2x 2.5" 6Gb/s SATA3 HDD/SSD
4. 1x SATA DOM on board
5. 2x 10Gb/s network connectivity


 
 Drivers & Utilities  BIOS / IPMI  Manuals  Tested Memory  Tested HDD

 OS Certification Matrix  OS Compatibility  Download Driver CD


 


Product SKUs
MicroBlade
  • MBI-6128R-T2X
 
Motherboard
 
  • B1DRI
 
Processor/Cache
CPU
  • Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 120W TDP)
  • 105W TDP CPU or greater required 2000W PSU
  • Dual Socket R3 (LGA 2011)
Cores / Cache
  • Up to 18 Cores / Up to 45MB Cache
System Bus
  • QPI up to 9.6 GT/s
Note † BIOS version 2.0 or above is required
 
System Memory
Memory Capacity
  • 8x 288-pin DDR4 DIMM slots
  • Up to 256GB VLP ECC RDIMM
Memory Type
  • 2400/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
DIMM Sizes
  • VLP RDIMM: 32GB, 16GB, 8GB, 4GB
Memory Voltage
  • 1.2 V
Error Detection
  • Corrects single-bit errors
 
On-Board Devices
Chipset
  • Intel® C612 Express chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1
 
Input / Output
DOM
  • 1x SuperDOM (Disk on Module) port
LAN
  • 2x 10GbE ports (via AOC-XEH-I2M)
 
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI® BIOS
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • ACPI 5.0
  • USB Keyboard support
  • SMBIOS 2.7.1
  • UEFI
Dimensions
Height
  • 1.2" (30.48mm)
Width
  • 4.94" (125.48mm)
Depth
  • 23.2" (589.28mm)
Weight
  • Gross Weight: 5.7 lbs (2.59 kg)
  • Net Weight: 3.4 lbs (1.54 kg)
Available Colors
  • Silver Grey
 
Front Panel
LEDs
  • Power LED
  • UID / KVM LED
  • Network Activity LED
  • Fault LED
 
Drive Bays
Internal
  • 2x 2.5" 6Gb/s SATA3 HDD/SSD and 1x SATA DOM per node
 
Operating Environment / Compliance
Environmental Spec.
  • Operating Temperature: 10°to 35°C (50°to 95°F)
  • Non-operating Temperature: -40°to 70°C (-40°to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5 to 95% (non-condensing)
 
Electromagnetic Compatibility (EMC)
United States / Canada
  • FCC- Emissions (US) Verification
Europe
  • EN55022 - Emissions
  • EN55024 - Immunity
  • EN61000-3-2 - Harmonics
  • EN61000-3-3 - Voltage Flicker
  • CE - EMC Directive 89/336/EEC
 
Safety Compliance
United States / Canada
  • UL60950-1 - CSA/CUL 60950-1
Europe
  • EN60950-1, CE - Low Voltage Directive 73/23/EEE
Germany
  • TUV
Parts List - (Items Included)
  Part Number Qty Description
Motherboard MBD-B1DRI 1 MicroBlade with Dual Intel Xeon E5-2600 v3
MicroBlade Sled MCP-680-31402-0N 1 M628 MicroBlade DP Sled (complete assembly)
Add-on Card AOC-XEH-I2M-O-P 1 AOC with dual ports, 10GbE Ethernet Controller
Add-on Module AOM-BPN-MS28D-O-P 1 The HDD Backplane and controller for B1DRi
Optional Parts List
  Part Number Qty Description
Heatsink / Retention SNK-P0047PSRM 1 Heatsink for front CPUs
Heatsink / Retention SNK-P0047PSR 1 Heatsink for rear CPUs
SATA DOM MEM-IDSAHM3A-016G

MEM-IDSAHM3A-032G

MEM-IDSAHM3A-064G

MEM-IDSAHM3A-128G		 1 SATA3 DOM SH 3ME3 V2 16GB MLC w/ Pin8 VCC Horizontal

SATA3 DOM SH 3ME3 V2 32GB MLC w/ Pin8 VCC Horizontal

SATA3 DOM SH 3ME3 V2 64GB MLC w/ Pin8 VCC Horizontal

SATA3 DOM SH 3ME3 V2 128GB MLC w/ Pin8 VCC Horizontal
Software SFT-OOB-LIC • 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Terms & Conditions   |   Privacy   |   Investor Relations   |   Jobs   |   Site Map
SuperServer® | Motherboard | Chassis | Rack Cabinet | SuperBlade® | Embedded | Networking | Storage | Accessories | AMD Solution | Power Supplies
Copyright © 2019 Super Micro Computer, Inc.   
Information in this document is subject to change without notice.

Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.