Key Applications
Telecom Central Office and Data Center
5G / Telco Applications
AI Inference and Machine Learning
Network Functions Virtualization
Cloud Computing
Key Features 1. NEBS Level 3 certified2. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡3. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††4. 4 PCI-E 3.0 x16 (FHFL) slots,
2 PCI-E 3.0 x16 (LP) slots5. 2 Hot-swap 2.5" SAS/SATA
drive bays, 2 Internal 2.5" SATA drive bays6. Support 1x M.2 2242/2260/2280,
Support M.2 SATA and NVMe7. 2x 10GBase-T LAN ports via Intel X5408. 9 Heavy duty 4cm counter-rotating
fans with air shroud & optimal fan
speed control9. 2000W Redundant Power Supplies Titanium Level (96%)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡, 3 UPI up to 10.4GT/s
Support CPU TDP up to 165W
Cores
Up to 28 Cores
Note
‡
BIOS version 3.2
or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R).
Extended thermal solutions may be required to support CPUs higher than 165W TDP, please contact Supermicro Technical Support for additional information.
GPU Support
Please refer to Parts List
System Memory
Memory Capacity
12 DIMM slots
Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Memory Type
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note
† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro †† Cascade Lake only. Contact your Supermicro sales rep for more info.
On-Board Devices
Chipset
Intel® C621 chipset
SATA
SATA3 (6Gbps) with RAID 0, 1, 5, 10
Network Connectivity
Intel® X540 Dual Port 10GBase-T
Virtual Machine Device Queues reduce I/O overhead
Supports 10GBASE-T, 100BASE-TX, and 1000BASE-T, RJ45 output
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.