SuperServer F619P3-FT

  Products  Systems   FatTwin™   [ F619P3-FT ]




Integrated Board
Super X11DPFF-SN


Views: | Angled (node) | Top (node) |
| Angled Front (system) | Rear (system) |

 Key Features
• Compute Intensive Applications
• Data Center, HPC and Enterprise Applications
• Hyperscale, Hyperconverged
• 4U 8 node system, each node:
1. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM,
    Supports Intel® Optane™ DCPMM††
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP),
    1 PCI-E 3.0 x16 (for SIOM )
4. 2 Fixed 3.5" SATA3 drive bays
    M.2 Interface: 2 SATA/PCI-E 3.0 x4,
    RAID 0 and 1
    M.2 Form Factor: 2260, 2280, 22110
    M.2 Key: M-Key
5. Dual GbE ports via SIOM Network card,
    1 dedicated IPMI LAN port (front)
6. 1 VGA, 2 USB 3.0 ports (front)
7. 8x 8cm 13.5k RPM rear fans
    per enclosure
8. 2200W Redundant Power Supplies
    Titanium Level (96% Efficiency)

 Drivers & Utilities   BIOS   IPMI   Tested Memory  Tested M.2 List   Drive Options   Manuals   OS Certification Matrix   Tested SIOM  Network Card (AOC) Matrix

Product SKUs
SYS-F619P3-FT
  • SuperServer F619P3-FT (Black)
 
Motherboard

Super X11DPFF-SN
 
Processor (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-165W with IVR
Cores
  • Up to 28 Cores
Note ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R).
 
Extended thermal solutions may be required to support CPUs higher than 165W TDP, please contact Supermicro Technical Support for additional information.
 
System Memory (per Node)
Memory Capacity
  • 12 DIMM slots
  • Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM††
Memory Type
  • 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
†† Cascade Lake only. Contact your Supermicro sales rep for more info.
 
On-Board Devices
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Flexible networking via SIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per node)
LAN
  • SIOM flexible Network card
  • 1 RJ45 Dedicated IPMI LAN port (front)
USB
  • 2 USB 3.0 ports (front)
VGA
  • 1 VGA port (front)
 
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI BIOS
 
Management
Software
Power Configurations
  • ACPI Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 4U Rackmount
Model
  • CSE-F418IF3-R2K20BP
 
Dimensions and Weight
Width
  • 17.63" (448mm)
Height
  • 6.96" (177mm)
Depth
  • 29" (737mm)
Package
  • 28.3" (W) x 15.0" (H) x 42.4" (D)
Weight
  • Net Weight: 150 lbs (68.04 kg)
  • Gross Weight: 200 lbs (90.71 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • Network activity LEDs
  • Information LED (Fan failure, Overheat)
 
Expansion Slots (per node)
PCI-Express
  • 1 PCI-E 3.0 x16 (Low-profile)
  • 1 PCI-E 3.0 x8 (Low-profile)
  • 1 PCI-E 3.0 x16 (SIOM)
 
Drive Bays (per node)
Fixed
  • 2 Fixed 3.5" SATA3 drive bays
M.2
  • M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1
  • M.2 Form Factor: 2260, 2280, 22110
  • M.2 Key: M-Key
 
System Cooling
Fans
  • 8x 8cm 13.5k RPM rear fans per enclosure
 
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
  • 1200W with Input 100-127Vac
  • 1800W with Input 200-220Vac
  • 1980W with Input 220-230Vac
  • 2090W with Input 230-240Vac
  • 2200W with Input 220-240Vac (for UL/cUL use only)
  • 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
  • 50-60Hz
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 183.3A / Min: 0A (220-240Vac)
5VSB
  • Max: 1A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level96%  Titanium Level
  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

See Parts List
Parts List - (Items Included)
 
 Part Number
 Qty
 Description
Motherboard / Chassis MBD-X11DPFF-SN
CSE-F418IF3-R2K20BP 		8
1		 Super X11DPFF-SN Motherboard
4U Chassis
Backplane BPN-ADP-X11DPFF 8 Power adapter card for X11DPFF,RoHS
Cable 1 CBL-CDAT-0910 8 CBL,SGPIO,2X5F TO 2X5F,P2.54, 14CM, 24AWG,RoHS
Cable 2 CBL-PWCD-0578 4 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
Cable 3 CBL-PWEX-1020-11 16 PWEX,2X4F/P4.2 TO 2X4F/P4.2,10.5CM,16AWG,RoHS
Cable 4 CBL-SAST-0672 8 MINI SAS HD-SAS 29PX2+2x4P,INT,46/56/41/52CM,22/30AWG,RoHS
Drive Tray(s) MCP-220-00134-0N 16 Tool-less 3.5
Riser Card RSC-P-6 8 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
Riser Card RSC-R1UF-E16R 8 RSC-R1UF-E16R
Heatsink / Retention SNK-P0067PS 8 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0067PSC 8 1U Passive CPU Heat Sink with a 17-mm Wide Side Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
* Power Supply PWS-2K04A-1R 4 AC-DC 2000W, Titanium Level, Redundancy, 1U, PMBus 1.2, +12V/+5Vsb, 360x76x40mm,HF,RoHS/REACH
* Power Supply PWS-2K20A-1R 4 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm
* Backplane BPN-PDB-X11DPFF 2 Power Middleplane for X11 FIO Fattwin,RoHS
* Rail Set MCP-290-41803-0N 1 Fat twin F418 / F424 Static Rail set support 28-33.5 inch depth rail,RoHS/REACH,PBF
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.


Optional Parts List
  Part Number Qty Description
Connect 1x 2.5" NVMe Drive CBL-SAST-0950 1/node 2x OcuLink v 1.0 to 2x PCIe SFF-8639 w/ Power, 35/57CM, 32/24/20 AWG
RAID Card AOC-S3108L-H8IR-16DD - LSI 3108 8 int 12Gb/s ports, 8xGen3, ROC - LP,16 HDD
Software SFT-OOB-LIC • 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Hide Parts List
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