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Key Features
Compute Intensive Applications
Data Center, HPC and Enterprise Applications
Hyperscale, Hyperconverged
4U 8 node system, each node:
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP),
1 PCI-E 3.0 x16 (for
SIOM
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4. 2 Fixed 3.5" SATA3 drive bays
M.2 Interface: 2 SATA/PCI-E 3.0 x4,
RAID 0 and 1
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key
5. Dual GbE ports via SIOM Network card,
1 dedicated IPMI LAN port (front)
6. 1 VGA, 2 USB 3.0 ports (front)
7. 8x 8cm 13.5k RPM rear fans
per enclosure
8. 2200W Redundant Power Supplies
Titanium Level (96% Efficiency)
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| SYS-F619P3-FT |
- SuperServer F619P3-FT (Black)
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CPU |
- Dual Socket P (LGA 3647)
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
Dual UPI up to 10.4GT/s
- Support CPU TDP 70-165W with IVR
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Cores |
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Note |
‡
BIOS version 3.2
or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R). Extended thermal solutions may be required to support CPUs higher than 165W TDP, please contact Supermicro Technical Support for additional information. |
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Memory Capacity |
- 12 DIMM slots
- Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM††
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Memory Type |
- 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
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Note |
† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro †† Cascade Lake only. Contact your Supermicro sales rep for more info.
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Chipset |
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SATA |
- SATA3 (6Gbps); RAID 0, 1, 5, 10
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Network Controllers |
- Flexible networking via
SIOM
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IPMI |
- Support for Intelligent Platform Management Interface v.2.0
- IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
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Graphics |
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LAN |
- SIOM flexible Network card
- 1 RJ45 Dedicated IPMI LAN port (front)
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USB |
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VGA |
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BIOS Type |
- 128Mb SPI Flash EEPROM with AMI BIOS
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Software |
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Power Configurations |
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CPU |
- Monitors for CPU Cores, Chipset Voltages, Memory.
- 4+1 Phase-switching voltage regulator
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FAN |
- Fans with tachometer monitoring
- Status monitor for speed control
- Pulse Width Modulated (PWM) fan connectors
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Temperature |
- Monitoring for CPU and chassis environment
- Thermal Control for fan connectors
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| Form Factor |
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Model |
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| Width |
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Height |
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Depth |
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Package |
- 28.3" (W) x 15.0" (H) x 42.4" (D)
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Weight |
- Net Weight: 150 lbs (68.04 kg)
- Gross Weight: 200 lbs (90.71 kg)
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Available Colors |
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| Buttons |
- Power On/Off button
- UID button
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LEDs |
- Power status LED
- Network activity LEDs
- Information LED (Fan failure, Overheat)
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PCI-Express |
- 1 PCI-E 3.0 x16 (Low-profile)
- 1 PCI-E 3.0 x8 (Low-profile)
- 1 PCI-E 3.0 x16 (SIOM)
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| Fixed |
- 2 Fixed 3.5" SATA3 drive bays
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M.2 |
- M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1
- M.2 Form Factor: 2260, 2280, 22110
- M.2 Key: M-Key
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| Fans |
- 8x 8cm 13.5k RPM rear fans per enclosure
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2200W Redundant Power Supplies with PMBus |
Total Output Power and Input |
- 1200W with Input 100-127Vac
- 1800W with Input 200-220Vac
- 1980W with Input 220-230Vac
- 2090W with Input 230-240Vac
- 2200W with Input 220-240Vac (for UL/cUL use only)
- 2090W with Input 230-240Vdc (for CCC only)
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AC Input Frequency |
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Dimension (W x H x L) |
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+12V |
- Max: 100A / Min: 0A (100-127Vac)
- Max: 150A / Min: 0A (200-220Vac)
- Max: 165A / Min: 0A (220-230Vac)
- Max: 174.17A / Min: 0A (230-240Vac)
- Max: 183.3A / Min: 0A (220-240Vac)
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5VSB |
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Output Type |
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Certification |
Titanium Level [ Test Report ]
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| RoHS |
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Environmental Spec. |
- Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
- Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
- Operating Relative Humidity:
8% to 90% (non-condensing)
- Non-operating Relative Humidity:
5% to 95% (non-condensing)
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See Parts List
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Part Number
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Qty
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Description
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Motherboard / Chassis |
MBD-X11DPFF-SN
CSE-F418IF3-R2K20BP |
8 1 |
Super X11DPFF-SN Motherboard
4U Chassis |
Backplane
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BPN-ADP-X11DPFF |
8 |
Power adapter card for X11DPFF,RoHS |
Cable 1
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CBL-CDAT-0910 |
8 |
CBL,SGPIO,2X5F TO 2X5F,P2.54, 14CM, 24AWG,RoHS |
Cable 2
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CBL-PWCD-0578 |
4 |
PWCD,US,IEC60320 C14 TO C13,3FT,14AWG |
Cable 3
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CBL-PWEX-1020-11 |
16 |
PWEX,2X4F/P4.2 TO 2X4F/P4.2,10.5CM,16AWG,RoHS |
Cable 4
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CBL-SAST-0672 |
8 |
MINI SAS HD-SAS 29PX2+2x4P,INT,46/56/41/52CM,22/30AWG,RoHS |
Drive Tray(s)
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MCP-220-00134-0N |
16 |
Tool-less 3.5 |
Riser Card
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RSC-P-6 |
8 |
RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
Riser Card
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RSC-R1UF-E16R |
8 |
RSC-R1UF-E16R |
Heatsink / Retention
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SNK-P0067PS |
8 |
1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
Heatsink / Retention
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SNK-P0067PSC |
8 |
1U Passive CPU Heat Sink with a 17-mm Wide Side Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
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Power Supply
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PWS-2K04A-1R |
4 |
AC-DC 2000W, Titanium Level, Redundancy, 1U, PMBus 1.2, +12V/+5Vsb, 360x76x40mm,HF,RoHS/REACH |
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Power Supply
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PWS-2K20A-1R |
4 |
1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm |
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Backplane
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BPN-PDB-X11DPFF |
2 |
Power Middleplane for X11 FIO Fattwin,RoHS |
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Rail Set
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MCP-290-41803-0N |
1 |
Fat twin F418 / F424 Static Rail set support 28-33.5 inch depth rail,RoHS/REACH,PBF |
Notes: - Parts with * are inside the chassis
- Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
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Part Number |
Qty |
Description |
Connect 1x 2.5" NVMe Drive |
CBL-SAST-0950 |
1/node |
2x OcuLink v 1.0 to 2x PCIe SFF-8639 w/ Power, 35/57CM, 32/24/20 AWG |
RAID Card |
AOC-S3108L-H8IR-16DD |
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LSI 3108 8 int 12Gb/s ports, 8xGen3, ROC - LP,16 HDD |
Software |
SFT-OOB-LIC • |
1 |
OOB Management Package (per node license) |
Software |
SFT-DCMS-Single |
1 |
DataCenter Management Package (per node license) |
Hide Parts List
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