SuperServer SYS-211E-FRDN2T (Complete System Only)

SYS-211E-FRDN2T Main SYS-211E-FRDN2T Angle SYS-211E-FRDN2T Top SYS-211E-FRDN2T Front SYS-211E-FRDN2T Rear
Integrated Board: X13SEM-TF
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Key Applications

  • 5G Core and Edge
  • AI Inference and Machine Learning
  • Network Function Virtualization
  • Cloud Computing

Key Features

  1. Design with compliance to NEBS-Level 3
  2. Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors
  3. 8 DIMM slots; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM
  4. Up to 3 PCIe 5.0 x16 FHHL, 1 PCIe 5.0 X16 HHHL & 1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards
  5. Onboard 2x 10GbE ports
  6. 2x 2.5" drive bays for NVMe drives
  7. 2x 600W DC -48V Power Supplies
  8. Ultra short depth, 2U Front I/O Edge Server
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Specifications Resources Parts List
Specifications
Product SKUs
SuperServer SYS-211E-FRDN2T (Silver/Black)
Motherboard
Super X13SEM-TF
Processor
CPU
Cores
  • Up to 32C/64T; Up to 82.5MB Cache
Note
  • Supports up to 270W TDP CPUs (Aircooled)
  • CPUs (air cooled) with TDP over 225W are only supported under specific conditions.  Contact customer support for details.
System Memory
Memory
  • Memory Capacity: 8 DIMM slots
  • Up to 2TB: 8x 256 GB DRAM
  • Memory Type: 4800MHz ECC DDR5 RDIMM/LRDIMM
Memory Voltage
  • 1.1 V
Error Detection
  • ECC
On-Board Devices
NVMe
  • NVMe; RAID 0/1 support (Intel® VROC RAID Key required)
Chipset
  • Intel® C741
Network Connectivity
  • 2x 100GbE QSFP28 with Intel® E810-CAM2 (optional)
  • 2x 25GbE QSFP28 with Intel® XXV710 (optional)
  • 2x 25GbE QSFP28 with Intel® E810-CAM1 (optional)
  • 2x 40GbE QSFP+ with Intel® XL710-BM2 (optional)
  • 2x 10GbE SFP+ with Intel® X710-BM2 (optional)
  • 4x 1GbE BaseT with Intel® i350 (optional)
  • 2x 200GbE QSFP56 with Mellanox® MT28908A0-XCCF-HVM (optional)
  • 2x 10GbE BaseT with Intel® X550
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 Dedicated BMC LAN port
  • 2 RJ45 10GbE (Intel® X550-AT2)
USB
  • 2 USB 2.0 port(s) (2 front)
  • 2 USB 3.0 port(s) (2 front)
Video
  • 1 VGA port(s)
Serial Port
  • 1 COM Port(s) (1 front)
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
Management
Software
  • SUM
  • SSM
  • Redfish API
  • IPMI 2.0
  • Intel® Node Manager
  • SPM
  • KVM with dedicated LAN
  • NMI
  • Watch Dog
  • SuperDoctor® 5
  • IPMI 2.0
Power Configurations
  • ACPI Power Management
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-211M
Dimensions and Weight
Height
  • 3.5" (88.9mm)
Width
  • 17.2" (436.88mm)
Depth
  • 11.8" (298.8mm)
Package
  • 7.4" (H) x 19.3" (W) x 23.3" (D)
Weight
  • Net Weight: 17 lbs (7.7 kg)
  • Gross Weight: 22 lbs (10 kg)
Available Color
  • Silver/Black
Front Panel
Buttons
  • Power On/Off 
  • UID button
LEDs
  • HDD activity
  • LAN1 activity
  • LAN2 activity
  • Power status
  • System information
Expansion Slots
PCI-Express (PCIe)
  • 1 PCIe 5.0 x16 HHHL slot(s)
  • 1 PCIe 5.0 x8 HHHL slot(s)
  • 2 PCIe 5.0 x16 FHHL slot(s)
Drive Bays / Storage
Hot-swap
  • 2x 2.5" hot-swap NVMe drive bays (2x 2.5" NVMe dedicated)
M.2
  • 2 M.2 NVMe
  • M-Key, 2280/22110
System Cooling
Fans
  • 4x 4-PIN PWM 8cm Fan(s)
Power Supply
1U 600W Redundant short depth DC48V input redundant power supply
Total Output Power
  • 600W : (-44) - (-65) Vdc
Dimension

(W x H x L)
  • 54.5 x 40 x 220 mm
+12V
  • Max: 50A
5V SB
  • Max: 3A / Min: 0A
Certification    

  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)


Resources
Component Options
CPU ListCompatible GPU ListNVMe OptionsTested AOC ListTested M.2 ListTested Memory
Software
BIOS DownloadBMC DownloadDrivers & Utilities
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X13SEM-TF

CSE-211M 		1

1 		Super X13SEM-TF Motherboard

2U Chassis
Backplane BPN-NVME5-826N-B2B 1 2-Port PCIe Gen 5 U.2 NVMe SSD Storage Backplane
Cable CBL-MCIO-1230M5 1 [NR] MCIO x8 (STR to STR),30CM,85OHM,RoHS
CBL-PCBA-G5T16-0809 1 [NR] 2 PCIe Gen5 x16+pwr 08/09cm,30AWG,85 Ohm,RoHS
CBL-PWCD-0974 2 48VDC input power cable, 2M, 12AWG, 3 wires, RoHS/REACH,RoHS
CBL-MCIO-1218M5 1 MCIO x8 (STR to STR),18CM,85OHM,RoHS
CBL-MCIO-1218M5-1 1 MCIO x8 (STR to STR),18CM,85OHM,RoHS
CBL-MCIO-1218M5R 1 MCIO (x8 STR to x8 RA),18CM,85OHM,RoHS
CBL-MCIO-1218M5R-1 1 MCIO x8 (STR to RA),18CM,85OHM,RoHS
CBL-MCIO-1230M5R 1 MCIO x8 (STR to RA),30CM,85OHM,RoHS
CBL-MCIO-1230M5R-1 1 [NR] MCIO x8 (STR to RA),30CM,85OHM,RoHS
CBL-CDAT-1058 1 [NR] NCSI 2x8 to 2x8, Ph2.54, 60cm shielded,28AWG, RoHS,RoHS
Drive Tray(s) MCP-220-00167-0B 2 Gen 3 2.5-inch Tool-less NVMe drive tray (clip design),RoHS
MCP-220-00147-0B 2 Black gen-3 hot-swap 2.5"; Tool-less HDD tray (clip design)
Parts MCP-260-21102-0B 1 1U height IO shield for X13SEM-F/TF MBD, with gasket, bl
Air Shroud MCP-310-21105-0B 1 Mylar air shroud for 211M w/ X13SEM-TF
Power Distributor PDB-PT211M-3424 1 2U support redundancy powers up to 800W for SC211M with 2 Mi
Power Supply PWS-601S-1R 2 1U 600W Redundant DC48V input w/PMBus power supply, W54.5xH4
Riser Card RSC-S-68G5 1 1U LHS Standard riser card with one PCIe 5.0X16andonePC
Heatsink / Retention SNK-P0088P 1 2U Passive CPU HS for X13 Intel Eagle Stream Platform
*Fan FAN-0220L4 4 80x80x38 mm, 14.9K RPM Exhaust Fan for SYS-120P-FRDN6T Serve
*Front Panel FPB-TB826 1 16 pin Cable Adaptor Board for SC826
*Rail Set MCP-290-21106-0N 1 1U height sliding rail for SC211M chassis
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
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