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Delivering Systems Optimized for Tomorrow’s Data Center Workloads
Supermicro’s tried-and-tested Building Block Solutions® approach and industry-leading first-to-market advantage allow Supermicro to deliver optimized systems for the most demanding AI, Cloud, and 5G Edge workloads.
Performance Optimized – Enhanced thermal capacity to support the highest performing CPUs and GPUs, plus support for the latest industry technologies including PCIe 5.0, DDR5, CXL 1.1 and high-bandwidth memory.
Energy Efficient – Systems designed for optimal airflow to run in high-temperature data center environments up to 40°C, optional rack-scale liquid cooling solutions and in-house design of Titanium Level power supplies for maximum efficiency.
Improved Security and Manageability – Industry standard compliance for hardware and silicon Root of Trust (RoT), cryptographical attestation of components throughout the entire supply chain and comprehensive remote management capabilities.
Supports Open Industry Standards – Futureproofing and interoperability with support for Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC and the E1.S storage form factor.
Note: Features vary by product. Please check the specific product pages for detailed specifications and feature listings.
Optimized for the most demanding AI, Deep Learning and HPC workloads, Supermicro X13 Universal GPU systems are designed for maximum flexibility, supporting multiple industry-standard GPUs including OAM, SXM5 and PCIe from Intel, NVIDIA and other industry partners.
Optimized for the next generation of HPC, action-oriented AI, 3D simulation and advanced graphic design and rendering. Supermicro X13 PCIe GPU systems support up to 10 next-generation accelerators in a 4U or 5U rackmount chassis.
New X13 Hyper brings next-generation performance to Supermicro’s range of rackmount servers, built to take on the most demanding workloads along with the storage & I/O flexibility that provide customization for a wide range of applications. Up to 3 PCIe 5.0 slots in 1U or 8 slots in 2U for GPUs and add-on cards.
Maximum density, highly versatile HPC platform with up to 20 single-width UP or DP blades in an 8U enclosure, with shared power, cooling and networking for the best possible efficiency. Liquid cooling options are also available for maximum performance.
X13 BigTwin® systems provide maximum performance and serviceability in a multi-node architecture, with dual 4th Gen Intel® Xeon® Scalable processors per node and a hot-swappable tool-less design. Density (2U4N) or storage (2U2N) optimized configurations available with liquid cooling options for maximum performance.
X13 GrandTwin™ is optimized for cloud and media delivery workloads in space-constrained environments, with front-serviceable hot-swap nodes and front or rear I/O options to simplify installation and servicing. Highly modular design with resource saving architecture to reduce both power consumption and materials.
Supermicro X13 FatTwin® systems provide superior performance-per-dollar for virtualization and EDA applications. Front-serviceable single processor nodes with up to 6 drives provide maximum storage density and feature Supermicro's Resource Saving Architecture with shared power to further reduce both TCO and TCE.
The X13 CloudDC family includes UP and DP configurations to support maximum memory and storage density in a single rackmount chassis, and up to 6 PCIe 5.0 slots capable of housing GPUs for AI inferencing at the edge. Tool-less brackets and hot-swap drive trays maximize serviceability in the data center.
A wide range of I/O options to deliver truly optimized systems for specific requirements. . Supermicro's X13 WIO systems can now accommodate double-width GPUs for accelerated AI/ML workloads through newly-designed top loading expansion slots.
X13 Hyper-E brings the performance and flexibility of Supermicro's flagship Hyper series to the Edge with short-depth form factors designed for Edge data center and telco deployments. Systems are NEBS Level 3 certified and feature optional DC power supplies.
X13 SuperEdge features 3 customizable single-processor nodes in a 2U, short-depth form factor. Nodes are hot-swappable with front access I/O, making the system ideal for remote IoT, Edge, or telco deployments and 3 PCIe 5.0 slots per node enable a wide range of add-on cards.
X13 5G and Edge systems are optimized for Multi-Access Edge Computing, Flex-RAN/Open RAN and Edge outdoor 5G applications, with expanded I/O and device-to-device communications using space and power efficient configurations. Systems feature firmware customization, BOM enhancements, and a wide range of legacy I/O support.
Industry-leading storage density, performance and latency with industry-standard EDSFF drives for data-intensive workloads including mission-critical databases, virtualization, next-gen big data, HPC, media & entertainment, content distribution and hot-tier caching.