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行业领导下一代X11 双子星及架构

2U 4/2-节点服务器解决方案
2U 4/2-节点服务器解决方案

双子星 (Twin) 服务器 解决方案

Supermicro Twin SuperServer® 系统是一系列高密度2U热插入多节点服务器,可提供各种内存容量,HDD技术,PCIe替代方案,网络功能和GPU支持选项。 支持第二代 Intel® Xeon® 可扩展处理器,可以为每一代Twin架构提供主机优势,包括:24位或16位DIMM插槽的高达6TB(BigTwin)/ 4TB(TwinPro)DDR4-2933MHz ECC内存,灵活的网络选项高达100G,并整合了超路径互连技术,可降低延迟和额外的带宽。Intel® Optane™ DC 持久内存的支持为 BigTwin SuperServer ®系列带来了一种新型大容量且价格实惠的内存。

BigTwin™是第五代突破性的Twin架构,可扩展Supermicro的2U TwinPro和1U Twin系列SuperServer系统的计算和存储功能。 BigTwin提供多达24个全闪存NVMe或混合HDD,2个低调PCI-E x16插槽和1个SIOM插槽,实现了最大的网络灵活性,针对当今IT需求进行了优化。

Supermicro Twin Family代表了绿色计算革命,旨在支持客户的关键应用,并减少数据中心总体拥有成本以帮助保护环境。 由于Twin系列共享组件,Twin系列产品可以通过机架式服务器提高成本效益和可靠性,而其模块化架构可实现灵活的配置和易于维护。

多功能配置和1U,2U或4U机壳尺寸的可用性允许双服务器针对许多不同的环境进行优化,包括企业,数据中心,云计算,HPC,财务,科学和工程,文件和储存服务器。

最多 (BigTwin):

  • 4个热插拔双核节点
  • 6TB DDR4-2933MHz内存,24个DIMM插槽
  • 每个节点205W
  • 24个 2.5"/ 12 3.5"SAS3驱动器托架,2U
  • 3个PCI-E 3.0 x16插槽
  • 2200W高效率(96%)冗余电源

最多 (TwinPro):

  • 2个热插拔双核节点
  • 4TB DDR4-2933MHz内存,16个DIMM插槽
  • 每个节点205W
  • 24U 2.5"/ 12 3.5"SAS3驱动器托架,2U
  • 3个PCI-E 3.0 x16插槽
  • 2200W高效率(96%)冗余电源
New Generation of Computing Excellence
2nd generation Intel® Xeon® Scalable processors supported.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
TwinPro • 2 Hot-swappable DP nodes in 1U
  • 2 Hot-swappable DP nodes in 1U; Each Node (x2 nodes) supports:
  • Dual 2nd Gen. Intel® Xeon® Scalable processors
  • 16 DIMMs; up to 4TB 3DS ECC DDR4-2933 MHz L/RDIMM
  • 2 PCI-E 3.0 x16 slots and 1 SIOM slot for flexible Networking options (SIOM must bundle 1 per node)
  • Storage Drive Options:
    • SYS-1029TP-DTR - 4 Hot-swap 2.5" SATA3 (Intel C621)
    • SYS-1029TP-DC0R - 4 Hot-swap 2.5" SAS3 (Broadcom 3008)
    • SYS-1029TP-DC1R - 4 Hot-swap 2.5" SAS3 (Broadcom 3108)
  • 1 Video, 2 USB 3.0, 2 SuperDOM, 2 SATA M.2 or 1 NVMe M.2 (optional carrier card AOC-SMG3-2H8M2, support 1029TR-DTR/DC0R)
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 3 heavy duty counter rotating fans with air shroud
  • 1000W Redundant Titanium Level (96%) Power Supplies
SYS-2029BR-HER (Coming Soon)
BigTwin™ • 10 EDSFF (E1.S) per Node
  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4 2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 10 EDSFF (E1.S) drive bays and 2 SATA M.2 drive bays per node.
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 Heavy duty 8cm PWM fans w/ optimal fan speed control
  • 2600W Redundant Titanium Level (96%) Power Supplies

* Contact your Supermicro sales rep for more info.

BigTwin™ • 4 NVMe/SAS3 + • 8 SAS3 per Node
  • 2 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 (12Gbps) support via Broadcom 3216; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 4 NVMe/SAS3/SATA3 + • 2 SAS3/SATA3 per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 4 NVMe/SAS3/SATA3 + 2 SAS3/SATA3 per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
  • 1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 6 NVMe per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" NVMe drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 4 NVMe/SATA3 + • 2 SATA3 per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 6 SATA3 per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 6 NVMe per Node • N+1 Cooling
  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" NVMe drive bays per node; 2 M.2 SATA3 or NVMe support
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 16 Heavy duty 40x56mm fans w/ optimal fan speed control (4 fans per node)
  • 2600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

TwinPro² (SIOM) • Flexible Storage Options
  • 4 DP nodes in 2U; depth 28.5" (2029TP) / 30.5" (6029TP), Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • Storage Drive Options:
    • SYS-2029TP-HTR - 6 Hot-swap 2.5" SATA3
    • SYS-2029TP-HC0R - 6 Hot-swap 2.5" SAS3 (Broadcom 3008)
    • SYS-2029TP-HC1R - 6 Hot-swap 2.5" SAS3 (Broadcom 3108)
    • SYS-6029TP-HTR - 3 Hot-swap 3.5" SATA3
    • SYS-6029TP-HC0R - 3 Hot-swap 3.5" SAS3 (Broadcom 3008)
    • SYS-6029TP-HC1R - 3 Hot-swap 3.5" SAS3 (Broadcom 3108)
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support for flexible networking options
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 2 SuperDOM
  • 4 Heavy duty 8cm fans with optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 3 NVMe/SAS3 + 3 SAS3 per Node
  • 2 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processor; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 NVMe/SAS3 + 3 SAS3 Hot-swap 3.5" drive bays per node, 2 Internal M.2 NVMe/SATA slots
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 3 NVMe/SAS3 per Node
  • 4 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 Hot-swap NVMe/SAS3 drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

  • 2 DP nodes in 2U; depth 28.5", Each Node (x2 nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 2TB 3DS ECC DDR4-2933 MHz L/RDIMM
  • 2 PCI-E 3.0 x8 (FHHL) or 1 PCI-E 3.0 x8 (FHHL) + 1 PCI-E 3.0 x4 (FHHL) + 1 PCI-E 3.0 x4 (LP) (8/8/0 or 8/4/4)
  • 6 Hot-swap 3.5" SATA3 drive bays
  • 2x 1GbE LAN ports, 1 dedicated IPMI port
  • I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
  • 4 heavy duty fans w/ optimal fan speed control
  • 1200W Redundant Titanium Level (96%) Power Supplies
  • 4 DP nodes in 2U, depth 28.5", Each Node (x4 nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 2TB 3DS ECC DDR4-2933 MHz L/RDIMM
  • 1 PCI-E 3.0 x16 (LP) slot
  • 3 Hot-swap 3.5" SATA3 drive bays
  • 2x 1GbE LAN ports, 1 dedicated IPMI port
  • I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
  • 4 heavy duty fans w/ optimal fan speed control
  • 1600W Redundant Titanium Level (96%) Power Supplies