Supermicro’s Rear Door Heat Exchanger (RDHx) provides up to 120 kW of cooling capacity through a plug-and-cool design, enabling easy deployment and exceptional operational flexibility. Compatible with most standard racks, it is ideal for cooling nextgeneration high-density setups and significantly improves thermal performance. Its instant-upgrade capability and rapid installation minimize downtime, delivering superior agility for data center operators.
Adapting storage solutions to meet AI’s demands
Overcoming AI storage challenges with scalable, high-performance solutions
Supermicro’s Rear Door Heat Exchanger (RDHx) provides up to 120 kW of cooling capacity through a plug-and-cool design, enabling easy deployment and exceptional operational flexibility. Compatible with most standard racks, it is ideal for cooling nextgeneration high-density setups and significantly improves thermal performance. Its instant-upgrade capability and rapid installation minimize downtime, delivering superior agility for data center operators.
Adapting storage solutions to meet AI’s demands
Overcoming AI storage challenges with scalable, high-performance solutions
How data movement and storage design are becoming the dominant constraints in enterprise AI
Accelerating AI Workloads with Intelligent Core Prioritization and Turbo Boosting
New Intel® Flat Memory Mode Simplifies Memory Expansion
Significant Virtualization Efficiency Improvements Over 3rd Gen Intel Xeon Scalable Processor-Based Systems: 27% Less TDP Draw, 33% Lower Core Count, 50% Fewer Servers
Supermicro, Red Hat, Senao, Lanner and Intel join forces to create a family of edge computing solutions that are AI-ready and scalable for workload consolidation
AI Performance and Efficiency at the Intelligent Edge, Powered by Intel
AI Factories from Supermicro and NVIDIA are complete, turnkey solutions designed to simplify enterprise AI deployment at scale, delivering faster time‑to‑online and time‑to‑revenue. These end‑to‑end AI infrastructure solutions combine high‑performance GPU compute, AI software, high‑speed networking, and scalable storage to accelerate data‑center‑ready AI workloads.
The new Supermicro Super AI Station for AI inferencing, model training, and fine-tuning – featuring the NVIDIA BG300 Grace™ Blackwell Ultra Desktop Superchip
AI factories from Supermicro and NVIDIA are complete, turnkey solutions simplifying the deployment of AI at any scale, first-to-market, and backed by rack-level integration delivering complete AI confidence.
Powerful, flexible multi-workload acceleration from AI factory, to data center, to edge
Join Kitana and Rudy from the Technology Enablement team at Supermicro as they introduce the ideal solution for AI development, the Super AI Station. Supermicro’s ARS-511GD-NB-LCC, featuring the NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip, is a deskside, liquid‑cooled system that delivers data center–class AI performance right under your desk for training, fine‑tuning, and high‑throughput inference on large models.
Supermicro BigTwin® provides maximum compute and storage density with power efficiency, making it a compelling choice for modern workloads that demand scalability, flexibility, and performance in any energy-constrained environments.
