SuperServer SYS-221HE-TNRD (Complete System Only)

SYS-221HE-TNRD Main SYS-221HE-TNRD Angle SYS-221HE-TNRD Top SYS-221HE-TNRD Front SYS-221HE-TNRD Rear
Integrated Board: X13DEM
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Key Applications

  • 5G Core and Edge
  • Telecom Micro Data Center
  • AI Inference and Machine Learning
  • Network Function Virtualization
  • Cloud Computing

Key Features

  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
  2. 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600
  3. Configurable PCIe slot options up to 8 PCIe 5.0 x8 (6 FHFL+ 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL + 1 FHHL)
  4. Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. Up to 6x 2.5" hot-swap drive bays with options to support NVMe/SATA drives
  6. 6 heavy duty hot-swap fans with optimal fan speed control
  7. Redundant 1300W -48V DC power supplies
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SYS-221HE-TNRD
Specifications Resources & Downloads
Specifications
Product SKUs
SuperServer SYS-221HE-TNRD
Motherboard
Super X13DEM
Processor
CPU
Core Count
  • Up to 60C/120T; Up to 112.5MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 3 double-width or 3 single-width GPU(s)
Supported GPU
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • PCIe
System Memory
Memory
  • Slot Count: 32 DIMM slots/16 Channels
  • Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices
SATA
  • SATA (6Gbps) ; RAID 0/1/5/10 support
NVMe
Chipset
  • Intel® C741
Network Connectivity
  • 2 SFP28 25GbE with Broadcom® BCM57414 (optional)
  • 2 QSFP28 100GbE with Broadcom® BCM57508 (optional)
  • 2 QSFP28 100GbE with Intel® E810-CAM2 (optional)
  • 2 QSFP28 100GbE (optional)
  • 4 SFP+ 10GbE with Intel® X710-BM2 (optional)
  • 2 QSFP56 200GbE (optional)
  • 2 QSFP56 100GbE (optional)
  • 2 RJ45 1GbE with Intel® I350-AM2 (optional)
  • 4 SFP+ 10GbE with Intel® X710-TM4 (optional)
  • 1 OSFP 400GbE with NVIDIA® ConnectX®-7 NDR (optional)
  • 4 RJ45 10GbE with Intel® X550 (optional)
  • View AIOM Options
  • View AOC Options
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB
  • 2 USB 2.0 port(s) (front)
Video
  • 1 VGA port(s)
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
Management
Software
Power configurations
  • ACPI Power Management
  • Power-on mode for DC power recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-HE211-R000NFP
chassisWeight
  • Net Weight: 34.4 lbs (15.6 kg)
  • Gross Weight: 47.4 lbs (21.5 kg)
Dimensions and Weight
Height
  • 3.5" (88.9 mm)
Width
  • 17.2" (436.88 mm)
Depth
  • 22.6" (574 mm)
Package
  • 9.7" (H) x 23.5" (W) x 36.9" (D)
Weight
  • Gross Weight: 47.4 lbs (21.5 kg)
  • Net Weight: 34.4 lbs (15.6 kg)
Available Color
  • Silver
Front Panel
LED
  • HDD activity LED
  • LAN1 activity
  • LAN2 activity
  • Power Fail
  • Power status LED
  • System information
Buttons
  • Power On/Off 
  • UID button
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 3 PCIe 5.0 x16 FHFL slot(s)
    • 2 PCIe 5.0 x8 FHHL slot(s)
    • 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
  • Option A
    • 6 PCIe 5.0 x8 FHFL slot(s)
    • 2 PCIe 5.0 x8 FHHL slot(s)
    • 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
  • Option B
    • 3 PCIe 5.0 x16 FHFL slot(s)
    • 1 PCIe 5.0 x16 FHHL slot(s)
    • 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
  • View AOC Options
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 6 bay(s)
    • 6 front hot-swap 2.5" NVMe*/SAS*/SATA* drive bay(s)
  • (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
  • View Drive Options
M.2
System Cooling
Fans
  • 6 Counter-rotating, Hot-swappable 6cm Fan(s)
Power Supply
2x 1300W Redundant power supplies
Dimension (WxHxL)
  • 73.5 x 40 x 203 mm
+12V
  • Max: 108.3A / Min: 0A
12V SB
  • Max: 2.1A / Min: 0A
AC Input
  • 1300W: -44--65Vdc
Output Type
  • Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 0°C ~ 35°C (32°F ~ 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
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