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Special Features

Global SKU(21)

All motherboardsPrintCopy to clipboardURL474 Results

X14SDW-42C-SP9F

X14SDW-42C-SP9F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6556P-B, CPU TDP 235W, Intel Quick Assist Technology, Intel vRAN Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x16 via Riser slot
1 PCIe 4.0 x8 via MCIO connector
12 SFP28 for 25GbE Ethernet with Intel SoC1 RJ45 for Gigabit Ethernet with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0
IEEE1588 v2 & Synchronous Ethernet supportDPLL/OCXO designUp to 8 hours hold-over
2 SMA for 1PPS (1 Input 1 Output)1x SMA for GNSS input with onboard GNSS module

X14SDW-42C-SP9F

Compare

X14SDW-36CE-SP9F

X14SDW-36CE-SP9F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6726P-B, CPU TDP 215W, Intel Quick Assist Technology, Intel vRAN Accelerator, extended working temperature
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x16 via Riser slot
1 PCIe 4.0 x8 via MCIO connector
8 25GbE SFP28 with Intel SoC1 1GbE RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0
IEEE1588 v2 & Synchronous Ethernet supportDPLL/OCXO designUp to 8 hours hold-over
2 SMA for 1PPS (1 Input 1 Output)1x SMA for GNSS input with onboard GNSS module

X14SDW-36CE-SP9F

Compare

X14SDW-36C-SP9F

X14SDW-36C-SP9F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6556P-B, CPU TDP 215W, Intel Quick Assist Technology, Intel vRAN Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x16 via Riser slot
1 PCIe 4.0 x8 via MCIO connector
8 25GbE SFP28 with Intel SoC1 1GbE RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0
IEEE1588 v2 & Synchronous Ethernet supportDPLL/OCXO designUp to 8 hours hold-over
2 SMA for 1PPS (1 Input 1 Output)1x SMA for GNSS input with onboard GNSS module

X14SDW-36C-SP9F

Compare

X14SDV-42C-SP9F

X14SDV-42C-SP9F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6726P-B, CPU TDP 235W, Intel Quick Assist Technology, Intel vRAN Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,M.2 Interface: 1 PCIe 4.0 x4M.2 Form Factor: 2280M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC, Breakout into 8x 25G SFP28 1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-42C-SP9F

Compare

X14SDV-42C-SP3F

X14SDV-42C-SP3F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6726P-B, CPU TDP 235W, Intel Quick Assist Technology, Intel vRAN Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,M.2 Interface: 1 PCIe 4.0 x4M.2 Form Factor: 2280M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC 1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-42C-SP3F

Compare

X14SDV-36CE-SP9F

X14SDV-36CE-SP9F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6556P-B, CPU TDP 215W, Intel Quick Assist Technology, Intel vRAN Accelerator, extended working temperature
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,M.2 Interface: 1 PCIe 4.0 x4M.2 Form Factor: 2280M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC, Breakout into 8x 25G SFP28 1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-36CE-SP9F

Compare

X14SDV-36CE-SP3F

X14SDV-36CE-SP3F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6556P-B, CPU TDP 215W, Intel Quick Assist Technology, Intel vRAN Accelerator, extended working temperature
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,M.2 Interface: 1 PCIe 4.0 x4M.2 Form Factor: 2280M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC 1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-36CE-SP3F

Compare

X14SDV-36C-SP9F

X14SDV-36C-SP9F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6553P-B, CPU TDP 235W, Intel Quick Assist Technology, Intel Media Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,M.2 Interface: 1 PCIe 4.0 x4M.2 Form Factor: 2280M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC, Breakout into 8x 25G SFP28 1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-36C-SP9F

Compare

X14SDV-36C-SP3F

X14SDV-36C-SP3F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6553P-B, CPU TDP 235W, Intel Quick Assist Technology, Intel Media Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,
M.2 Interface: 1 PCIe 4.0 x4
M.2 Form Factor: 2280
M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC
1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-36C-SP3F

Compare

X14SDV-32C-SP9F

X14SDV-32C-SP9F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6546P-B, CPU TDP 195W, Intel Quick Assist Technology, Intel vRAN Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,M.2 Interface: 1 PCIe 4.0 x4M.2 Form Factor: 2280M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC, Breakout into 8x 25G SFP28 1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-32C-SP9F

Compare

X14SDV-32C-SP3F

X14SDV-32C-SP3F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6546P-B, CPU TDP 195W, Intel Quick Assist Technology, Intel vRAN Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,M.2 Interface: 1 PCIe 4.0 x4M.2 Form Factor: 2280M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC 1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-32C-SP3F

Compare

X14SDV-20C-SP9F

X14SDV-20C-SP9F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6516P-B, CPU TDP 145W, Intel Quick Assist Technology, Intel vRAN Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,M.2 Interface: 1 PCIe 4.0 x4M.2 Form Factor: 2280M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC, Breakout into 8x 25G SFP28 1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-20C-SP9F

Compare

X14SDV-20C-SP3F

X14SDV-20C-SP3F

Key Features

System on Chip
Intel® Xeon® 6 SoC 6516P-B, CPU TDP 145W, Intel Quick Assist Technology, Intel vRAN Accelerator
Up to 512GB ECC RDIMM DDR5-6400MT/s in 4 DIMM slots
2 PCIe 5.0 x8 via MCIO connectors
1 PCIe 5.0 x16,
M.2 Interface: 1 PCIe 4.0 x4
M.2 Form Factor: 2280
M.2 Key: M-Key
Dual 100G QSFP28 with Intel SoC
1G RJ-45 with Intel® Ethernet Controller i210IT
12V DC or ATX Power Input
Onboard TPM2.0

X14SDV-20C-SP3F

Compare

X14SBW-TF

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
4 PCIe 5.0 X8 via MCIO connectors
1 PCIe 5.0 x8 (WIO-R),
2 PCIe 5.0 x16 (WIO-L),
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 2280, 22110, M-Key)
Dual LAN with 10GBase-T with Intel®X550
4 USB 3.2 Gen1(2 rear, 2 via header), 8 SATA3 (via SlimSAS x8)
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification

Compare

X14SBW-F

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots
4 PCIe 5.0 X8 via MCIO connectors
1 PCIe 5.0 x8 (WIO-R),
2 PCIe 5.0 x16 (WIO-L),
M.2 Interface: 2 PCIe 5.0 x2 (Form Factor: 2280, 22110, M-Key)
Dual LAN with 1GbE with Intel®I210
4 USB 3.2 Gen1 (2 rear, 2 via header), 8 SATA3 (via SlimSAS x8)
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification

Compare

X14SBT-GAP

Key Features

Intel® Xeon® 6900-series processors with P-cores, Single Socket LGA-7529 (Socket BR) supported, CPU TDP supports Up to 500W TDP
12 DIMM slots supporting up to 3TB
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
8 PCIe 5.0 x8 via MCIO connectors to support AIOM, storage devices or PCIe expansion slots
I/O: 1 COM, TPM header
1 PCIe 5.0 x8 GENZ 2C connector to support 2x M.2 (2280,22110) via proprietary M.2 adapter

Compare

X14SBT-G

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
16 DIMM slots support RDIMM / MRDIMM(1DPC)
1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
2 PCIe 5.0 x16 via Molex Impleplus connectors
4 PCIe 5.0 X8 via MCIO connectors
M.2 Interface: 2 PCIe5.0 x4 (Form Factor: 2280, 22110, M-Key)
I/O: 1 COM, TPM header

Compare

X14SBSC

Key Features

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
16 DIMM slots support RDIMM / MRDIMM(1DPC)
1 PCIe 5.0 x8,3 PCIe 5.0 x16,M.2 Interface: 2 PCIe 4.0 x2 via SAS3808n (Form Factor: 2280, 22110, M-Key)
I/O: 1 COM, TPM header, 1 VGA
Onboard TPM9672: TCG2.0, FIPs 140-2 Level 2, Intel TXT and Microsoft Windows certification

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