Supermicro ASG-2117S7-NE332R | 2U-Speicherserver

2U single socket Petascale with up to 40 hot-swap drive bays and 3 PCIe 6.0 x16 slots + 1 PCIe 6.0 x16 AIOM slot

Integrated Board: H15SPF
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Key Applications

  • Virtualization
  • Software-defined Storage
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server
  • High Performance Computing (HPC)

Key Features

  1. Single AMD EPYC™ 9006 Series Processor up to 600W with air cooling
  2. Up to 16 DIMMs supporting up to 4TB RDIMM DDR5-8000 in 1DPC or 4TB MRDIMM DDR5-12800 in 1DPC
  3. Gen6 Networking Support in both AOC and AIOM Format
  4. 1x PCIe 6.0 x16 TSFF AIOM (OCP 3.0) ;
    2x PCIe 6.0 x16 FHHL slots;
    1x PCIe 6.0 x16 FHFL Double-Width slot;
    1x PCIe 4.0 x4 DC-SCM
  5. Upto 32x Hot Pluggable E3.S or E3.L Drive Slots in Front, and 2x Hot Pluggable 80mm M.2 slots in rear
  6. 2 Redundant 2000W Titanium Level power supplies
    2 Redundant 2700W Titanium power supplies
  7. 2U Rackmount chassis with 30.6" (778 mm) depth
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ASG-2117S7-NE332R
Specifications Free Remote Testing Resources & Downloads
Specifications
Product SKUs
ASG-2117S7-NE332R
Motherboard
Super H15SPF
Processor
CPU
  • Single processor(s)
  • AMD EPYC™ 9006 SP7 Series Processors
Core Count
  • Up to 256C/512T
Note
  • Supports up to 600W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • 1 double-width GPU
System Memory
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (1DPC): Up to 4TB 8000MT/s ECC DDR5 RDIMM/3DS RDIMM
  • Max Memory (1DPC): Up to 4TB 12800MT/s ECC DDR5 MRDIMM
Memory Voltage
  • 1.1V
On-Board Devices
SAS
  • SAS (12Gbps) via Broadcom® 3808; RAID 0/1 support
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 USB 3.0 ports (rear)
Video
  • 1 VGA port
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 64MB SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • UEFI 2.8
  • USB Keyboard support
  • ACPI 6.5
  • SMBIOS 3.7 or later
Management
Software
Power configurations
  • ACPI/APM Power Management
  • Power-on mode control for AC power loss recovery
  • Power button override mechanism,
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
Fan
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Voltage
  • System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-256E3-R000NDP
Dimensions and Weight
Height
  • 3.47" (88 mm)
Width
  • 17.25" (438 mm)
Depth
  • 30.7" (780 mm)
Package
  • 9.4" (H) x 23.5" (W) x 43.2" (D)
Weight
  • Gross Weight: 83.78 lbs (38 kg)
  • Net Weight: 61.73 lbs (28 kg)
Available Color
  • Silver
Expansion Slots
PCI-Express (PCIe) Configuration
  • Option A*
    • 2 PCIe 6.0 x16 (in x16) FHHL double-width slots
    • 1 PCIe 6.0 x16 (in x16) FHFL double-width slot
  • Option B*
    • 1 PCIe 6.0 x16 (in x16) FHHL double-width slot
    • 1 PCIe 6.0 x16 (in x16) FHFL double-width slot
  • Default
    • 2 PCIe 6.0 x16 (in x16) FHHL double-width slots
    • 1 PCIe 6.0 x16 (in x16) AIOM slot (OCP 3.0 compatible)
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
M.2
  • 2 M.2 PCIe 4.0 x4 NVMe slots (M-key)
Drive Bays / Storage
Drive Bays Configuration
  • Option A: Total 40 bays
    • 40 front hot-swap E3.S 1T PCIe 6.0 x2 NVMe drive bays
  • Option B: Total 40 bays
    • 40 front hot-swap E3.L 1T PCIe 6.0 x2 NVMe drive bays
  • Option C: Total 24 bays
    • 24 front hot-swap E3.S 1T PCIe 6.0 x4 NVMe drive bays
  • Option D: Total 24 bays
    • 24 front hot-swap E3.L 1T PCIe 6.0 x4 NVMe drive bays
M.2
  • 2 M.2 PCIe 4.0 x4 NVMe slots (M-key 2280/22110)
System Cooling
Fans
  • 6 counter-rotating 60x60x56mm Fan(s)
Air Shroud
  • 1 Air Shroud
Power Supply
2x 2700W
2x 2700W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 265 mm
Input 1000W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2000W: 230-240Vac / 50-60Hz
2000W: 220-240Vac / 50-60Hz (for UL only)
2000W: 230-240Vdc / 50-60Hz (for CQC only)
2700W: 200-240Vac
+12V Max: 83A / Min: 0A (100Vac-127Vac)
Max: 150A / Min: 0A (200Vac-220Vac)
Max: 165A / Min: 0A (220Vac-230Vac)
Max: 166A / Min: 0A (230Vac-240Vac)
Max: 225A / Min: 0A (200Vac-240Vac)
12V SB Max: 3.5A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Environmental / Recycling
Recycle
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Resources & Downloads

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