Built to Accelerate - Supermicro at COMPUTEX Taipei 2026
Supermicro is once again at COMPUTEX Taipei in 2026 to showcase the latest industry-leading solutions for AI, HPC, Cloud, and Edge applications. Here you will find Press Releases, images, blog posts, and other resources related to this event.
Press Releases & Resources
Supermicro Launches New Server Solutions with Intel Xeon 6+ Processors to Reduce TCO and Accelerate Time-to-Online for Large-Scale Cloud and Data Centers
SAN JOSE, Calif., TAIPEI, Taiwan, May 31, 2026— Super Micro Computer, Inc (NASDAQ: SMCI), an AI, Enterprise, Storage, 5G/Edge total solution provider featuring Data Center Building Block Solutions® (DCBBS), today announced the launch of 12 new server platforms optimized for new Intel Xeon 6+ processors. Featuring up to 288 efficiency cores per socket and delivering improved performance-per-watt, the new systems are designed for high-density cloud, virtualization, 5G analytics, and other throughput-intensive workloads.
"By working closely with Intel, we have optimized our DCBBS with the new Xeon 6+ processors to deliver breakthrough core density and efficiency," said Charles Liang, president and CEO of Supermicro. "These new X14 platforms, with up to 576 E-cores per server, dramatically improve performance-per-watt and help customers shorten time-to-deployment while lowering TCO and energy consumption in large-scale cloud and enterprise data centers."
For more information, visit www.supermicro.com/x14
Explore Supermicro's Computex Resources here.
Intel Xeon 6+ systems offer double the core count, up to 17% higher instructions per clock (IPC), five times more last-level cache, and 25% faster memory support to deliver impressive performance gains, compared to previous generations.
Key Product Families:
- Hyper Series: Single and dual-socket 1U and 2U rackmount servers optimized for maximum performance and configurability. These systems are ideal for a wide range of workloads with support for high-memory configurations and advanced networking.
- SuperBlade: Ultra-dense blade architecture supporting up to 10 compute nodes in a compact 6U chassis. Delivers exceptional rack compute density and shared infrastructure efficiency for large-scale deployments.
- FlexTwin: High-density liquid-cooled systems designed for maximum flexibility and serviceability. Each dual-socket node operates independently while sharing power and cooling resources, perfect for cloud and hyperscale environments.
- GrandTwin: Single-socket multi-node systems offering density and thermal efficiency. Engineered for the highest core counts and optimized for E-core heavy workloads. It’s designed for high-density cloud environments with a multi-node architecture that allows customers to scale up their operations efficiently.
DCBBS delivers complete, modular AI infrastructure built from validated components and subsystems, enabling flexible deployment from individual servers and networking to full rack-scale and data center-level solutions, including software and services.
Supermicro's comprehensive portfolio of AI infrastructure solutions will be on display at the Supermicro booth during Computex.
Supermicro Introduces DCBBS Blueprints for NVIDIA Vera Rubin NVL72 and NVIDIA HGX™ Rubin NVL8, Built to Scale from 5MW to 1GW as an End-to-End Total Solution
- End-to-End Blueprint Scalable from a 5MW to 1GW Power Envelope with full facility-side infrastructure for either single-tenant or multi-tenant deployments
- DLC-2 Direct Liquid Cooling: engineered for near total heat capture, power efficiency, and lower noise with full stack integration of cold plates, CDUs, manifolds, rear door heat exchangers, cooling towers, and SMC PG25-A ultra-high electrical impedance coolant
- Management Software Suite: End-to-end SuperCloud software delivers unified infrastructure control, deployment automation, developer tools, and multi-tenant GPU cloud management
- In-Rack, In-Row, and Site Infrastructure Solutions covering every deployment layer from rack integration to in-row CDUs and SuperCluster configurations, to site-level infrastructure
- Dedicated Team of Supermicro Experts manage the complete deployment lifecycle: site survey, project design, integration, deployment, and ongoing support
- Supporting NVIDIA's latest reference architecture integrating NVIDIA Context Memory Storage Platform, NVIDIA Spectrum™-X Ethernet, and NVIDIA Quantum-X800 InfiniBand Platform
SAN JOSE, California, and TAIPEI, Taiwan, June 1, 2026—Super Micro Computer, Inc. (NASDAQ: SMCI), a Total IT Solutions provider for AI, Cloud, Storage, and 5G/Edge, introduces Data Center Building Block Solutions (DCBBS) Blueprints based on the NVIDIA Vera Rubin NVL72 and the NVIDIA HGX Rubin NVL8 platforms. The Blueprints are designed for gigawatt-scale AI data center deployment, starting from building blocks of a single 1,152-GPU scalable unit that can be multiplied to virtually any size. Supermicro's DCBBS Blueprints include the design and delivery of an end-to-end total solution with a dedicated team of experts covering the full deployment lifecycle. DCBBS provide the necessary compute, storage, networking, advanced liquid cooling, power distribution, and site infrastructure, accelerating time-to-online for large-scale liquid-cooled AI Factories.
"The NVIDIA Vera Rubin NVL72 platform sets a new standard for AI factory performance, and our DCBBS Blueprints give customers a proven, end-to-end path to build at any scale — from 5MW to 1GW," said Charles Liang, president and CEO of Supermicro. "We have delivered some of the earliest and largest liquid-cooled AI factories, and that experience is built into every Blueprint — so our customers can move from design to fully operational faster than ever before."
Supermicro's DCBBS Blueprints address the challenges of the practical implementation behind the most advanced AI infrastructure in the world. The NVIDIA Vera Rubin platform vastly improves AI Factory performance density, doubling speeds across multiple computing domains. NVIDIA's latest reference architecture precisely defines what an ideal 1,152-GPU scalable unit should contain —a Supermicro's DCBBS Blueprint defines the steps to achieve deployment success, with a proven track record for deploying the world's largest liquid-cooled AI factories featuring over 100,000 GPUs.
For more information on DCBBS, visit https://www.supermicro.com/en/solutions/dcbbs
Explore Supermicro's Computex Resources here.
Supermicro's DCBBS Blueprint Addresses the Reality of AI Factory Implementation
Customers planning AI factory buildouts or retrofits start from a fixed constraint: available power. DCBBS Blueprints for NVIDIA Vera Rubin NVL72 features a balanced bill-of-materials for a given power envelope, ranging from 5MW to 1GW, and provides the right ratio of cooling capacity, power delivery, compute nodes, management nodes, high-performance storage nodes, context memory storage platform nodes, and networking to ensure optimal performance due to bottlenecks such as network oversubscription, power capacity limitations, thermal throttling or other encumbrances.
The Blueprints cover the full end-to-end sequence that Supermicro has successfully used to complete large-scale AI projects at record-breaking speeds:
- On-site facility surveys are conducted by the Supermicro dedicated team to analyze the physical site against the deployment requirements. Surveys include assessment of loading dock access, data hall measurements and clearances, floor plan, floor load ratings, and more. The site is assessed for existing prospective power and cooling infrastructure to accurately inform Supermicro's design proposal, tailored to each customer project.
- Project design and proposals include all critical details into a specific buildout plan customized to the customer's requirements and facility constraints. Supermicro defines the right combination of DCBBS components, including the cooling solution (in-row CDUs up to 1.8MW for fully direct liquid-cooled compatible facilities, liquid-to-air sidecars for facilities without facility water infrastructure, in-rack CDU options based on a 52U rack configuration are currently in development, and rear-door heat exchanger options are available as a supplementary option for environments with higher ambient temperatures). Customers receive a complete proposal with a transparent bill of materials and a clear deployment timeline.
- Solution Integration with Full On-Site Service: Supermicro's solution integration process starts well before on-site delivery, with much of the heavy-lifting happening in Supermicro's US-based manufacturing facilities. This includes the processes of racking, stacking, and cabling within each rack. Supermicro verifies functionality with a testing process that exceeds industry standards, extending to system-level (L10) and cluster-level (L11) multi-node tests. The Supermicro dedicated team manages the logistics of site-level components such as CDUs, cooling towers, and power infrastructure, including coordination with any third-party vendors of the customer's choice, if applicable. Integration delivery service and on-site integration include rack placement, power and cooling connections, network cabling, system commissioning, software stack installation, and on-site solution validation.
- Support, Services, and Software provide a range of continued on-site options for long-term success, including on-site response times as fast as 4 hours for mission-critical uptime requirements. Integration with Supermicro's software suite of infrastructure. management tools are available, including Supermicro's SuperCloud Composer® and SuperCloud Director for unified infrastructure control ranging from bare-metal management to multi-tenant workload orchestration, and NVIDIA's full AI software stack including NVIDIA AI Enterprise and NVIDIA Run:ai. Asset tracking features ensure physical asset information and sensor data for every CDU, and other components, are readily available.
Supermicro's DCBBS Blueprints Align with the Reference Architecture for NVIDIA Vera Rubin NVL72
The NVIDIA Vera Rubin platform has the potential for transformative generational performance improvements but requires a repeatable and dependable approach to deploy successfully. Supermicro ensures alignment with the latest NVIDIA reference architecture, giving customers confidence that their deployment aligns with the NVIDIA Cloud Partner ecosystem.
The scalable units at the heart of the Supermicro DCBBS Blueprints provide 1,152 NVIDIA Rubin GPUs with 331TB of HBM4 GPU memory. The Vera Rubin generation doubles GPU memory bandwidth, GPU-to-GPU NVLink bandwidth, and per-GPU networking bandwidth compared to NVIDIA Blackwell, providing the architectural foundation for training and inference of frontier AI models with multiple trillions of parameters.
- Advanced Direct Liquid Cooling technology stack (DLC-2), including 5MW cooling towers, 4x in-row cooling distribution units (up to 1.8MW each), 16x vertically mounted cooling distribution manifolds, and 576 direct-to-chip copper cold plates (1 per every host processor module). Featuring Supermicro SMC PG25-A coolant engineered to deliver exceptional chemical and thermal stability. Liquid-to-air options will be available to support Vera Rubin NVL72 deployment in facilities without liquid cooling infrastructure, including a 200kW option supporting one rack and a 500kW option supporting two racks.
- Power Distribution Infrastructure from medium-voltage transformers through low-voltage distribution, rack-level power shelves, and battery backup units (BBUs). Each Vera Rubin NVL72 rack includes four 110 kW power shelves with redundant 18.3 kW power supply units. The DCBBS portfolio supports mission-critical data centers, with options including Supermicro’s Battery Energy Storage System (BESS) providing instant-switching backup power.
- 48U and 52U rack enclosure options optimized for high-density direct liquid cooling.
- 16x compute racks optimized for the NVIDIA Vera Rubin NVL72 and NVIDIA HGX Rubin NVL8 platforms.
- 6x networking racks (4x compute, 2x converged) support NVIDIA Spectrum-X Ethernet or NVIDIA Quantum-X800 InfiniBand up to 1.6Tb/s for the compute fabric. Options will be available for silicon photonics networking with co-packaged optics (CPO) for improved operational cost, power efficiency, and resiliency without pluggable transceivers.
- 4x high performance storage racks based on the Supermicro Petascale server platform for NVMe-tier application storage, model training checkpointing, and more. 2x context memory storage platform racks streamlined to handle the needs of long-context inference, agentic working memory, and retrieval workloads.
For more information visit https://www.supermicro.com/en/accelerators/nvidia/vera-rubin.
Supermicro's DCBBS Blueprint Ensures Single-Vendor Accountability A typical AI infrastructure buildout involves more than a dozen distinct supplier relationships across compute, storage, networking, racks, cooling distribution, cooling towers, power infrastructure, battery backup, cabling, transceivers, and services. When these relationships are managed across multiple vendors, every vendor handoff introduces schedule risk and accountability gaps that slow deployments and complicate troubleshooting processes.
The DCBBS Blueprints for NVIDIA Vera Rubin NVL72 and NVIDIA HGX Rubin NVL8 are now available for customer engagements with deployments scheduled for the second half of 2026 aligned with NVIDIA Vera Rubin general availability. Supermicro will demonstrate the NVIDIA Vera Rubin NVL72 and NVIDIA HGX Rubin NVL8 platforms at Computex booth N0602, June 2-6, 2026, in Taipei, Taiwan, with additional demonstrations at NVIDIA GTC Taipei.
Supermicro Expands Rack-Scale AI Leadership with AMD Helios Platform, Accelerating Deployment and Operational Efficiency
SAN JOSE, Calif., TAIPEI, Taiwan, June 1, 2026 — Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, 5G/Edge Total Solution Provider featuring Data Center Building Block Solutions® (DCBBS), in close collaboration with AMD, will showcase the next-generation AMD Helios rack-scale platform at Computex. Designed for the era of agentic AI, Helios enables Cloud Service Providers (CSPs), NeoClouds, hyperscalers, and enterprises to deliver large-scale AI workloads—including Sovereign AI, LLM training, inference, and fine-tuning—with unmatched efficiency and scalability.
"With DCBBS, Supermicro is redefining what is possible in the data center by shifting from traditional server design to a complete rack-scale architecture," said Charles Liang, president and CEO of Supermicro. "By combining Supermicro’s DCBBS with AMD Instinct™ MI455X GPU architecture, we deliver unprecedented AI performance, improved power efficiency through advanced cooling, and scalable infrastructure for next-generation AI workloads."
https://www.supermicro.com/en/accelerators/amd
Explore Supermicro's Computex Resources here.
“The next era of AI will be defined not only by more compute, but by how efficiently that compute can be deployed, connected and scaled,” said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD. “AMD Helios delivers an open, rack-scale AI architecture that brings together leadership AMD compute, networking and software to help customers accelerate time to deployment, improve infrastructure efficiency and scale demanding AI workloads with long-term flexibility.”
Supermicro is one of the first partners collaborating closely with AMD to bring the Helios solution to market, reinforcing its leadership in delivering end-to-end AI infrastructure solutions. Helios is a 72-GPU double-width rack-scale system powered by AMD Instinct MI455X GPUs, 6th Gen AMD EPYC™ CPUs, and AMD Pensando™ networking technologies all unified by the open AMD ROCm™ software stack. Optimized for large-scale AI deployments, Helios delivers exceptional compute density and performance for frontier model training and high-throughput inference. Key capabilities include modular scalability from rack to cluster level, open networking for both scale-up and scale-out AI, advanced security, and integrated virtualization with rack-scale software acceleration.
With open networking, advanced security, and integrated ROCm™ software, Helios helps providers accelerate time-to-market AI services, optimize resource utilization, and deliver reliable, high-performance AI capabilities at hyperscale.
The Helios platform exemplifies Supermicro’s A+A+A approach—Architecture, Accelerators, and Advancements—bringing together rack-scale system design, leading AMD AI compute solutions, and integrated software innovations. This unified approach enables customers to deploy AI infrastructure faster, operate more efficiently, and scale seamlessly as demand grows.
DCBBS delivers complete, modular AI infrastructure built from validated components and subsystems, enabling flexible deployment from individual servers and networking to full rack-scale and data center-level solutions, including software and services.
The AMD Helios rack-scale solution will be on display at the Supermicro booth Taipei Nangang Exhibition Center Hall 1, 4F, N0602, offering attendees a first-hand look at its design and capabilities. Visitors can also explore the platform through Supermicro’s A+ Superverse Interactive Demo.
Supermicro Collaborates with Arm to Deliver a New Class of Energy-Efficient Rack-Scale Infrastructure for Enterprise Agentic AI
SAN JOSE, Calif., TAIPEI, Taiwan, June 1, 2026 — Super Micro Computer, Inc. (NASDAQ: SMCI), an AI, Enterprise, Storage, 5G/Edge total solution provider featuring Data Center Building Block Solutions® (DCBBS), today announced a new class of AI-centric solutions featuring Arm® AGI CPUs. The increasing compute demands of modern agentic AI require a new class of rack-scale infrastructure that maximizes compute performance within the power envelopes and physical footprints of enterprise data centers. Supermicro's new solutions are built to support the rapid growth of agentic AI, delivering performance, efficiency, and density that maximizes the economics of rack-scale deployments backed by Supermicro's, end-to-end DCBBS capabilities reduce time-to-online.
"Supermicro continues to lead the industry when it comes to deploying new and innovative rack-scale solutions that maximize performance and efficiency," said Charles Liang, president and CEO of Supermicro. "Our DCBBS technology stack delivers end-to-end data center solutions of any size, which combined with the new density and efficient performance optimized Arm AGI CPU microarchitecture, helps enterprises realize significant TCO savings on their agentic AI infrastructure investments."
Learn more about the Supermicro Arm server line here.
Explore Supermicro's Computex Resources here.
"Agentic AI is driving a fundamental shift in infrastructure requirements, where efficiency, scalability, and orchestration performance are becoming just as critical as raw compute," said Mohamed Awad, Executive Vice President, Cloud AI Business Unit, Arm. "By combining Arm AGI CPUs with Supermicro’s rack-scale system expertise, we’re enabling infrastructure designed to deliver higher AI throughput, maximum compute density, and improved data center economics at scale."
Supermicro’s new computing platforms consist of air-cooled dual-socket 2U compute-optimized and 5U GPU-optimized rackmount servers, as well as a liquid-cooled multi-node solution designed specifically for rack-scale agentic AI deployments. Combining Supermicro’s proven modular, high-density architectures with the energy-efficient Arm Neoverse® CSS V3-based CPUs enables scalable, flexible infrastructure that maximizes performance-per-watt and dramatically lowers energy demand to accelerate AI adoption across modern data centers.
When deployed in Supermicro solutions, the Arm AGI CPU can deliver over 2x performance per rack compared to traditional architectures and help enterprises save up to $10 billion in CAPEX per Gigawatt of AI data center capacity based on Arm's estimates. Building on Supermicro's industry-leading rack density and performance-per-watt, these solutions help ensure maximum utilization of data center space and power resources.
Arm AGI CPU boasts a dense 136-core microarchitecture purpose built for performance, minimizing legacy overhead and completing more work per cycle for sustained, unthrottled performance. 6GB/s memory bandwidth per core and latency-optimized memory access support linear scaling, while expanded memory capacity and flexible I/O provides energy-efficient, scalable agentic AI infrastructure to orchestrate thousands of parallel tasks across distributed infrastructure.
With over 6,000 cores in a single air-cooled rack, enterprises can efficiently deploy numerous dedicated systems for a high volume of agentic AI tasks.
The Supermicro lineup of Arm-based servers includes five models:
2U Hyper Server – Optimized for agentic AI, Cloud, and memory-intensive workloads
https://www.supermicro.com/en/products/system/hyper/2u/ars-222h-nr
- Two Arm AGI CPUs, up to 136 cores per CPU
- Up to 6TB of DDR5-8800 MT/s RDIMMs
- Up to two GPUs
5U GPU Server – GPU-dense configuration for AI training and inference
https://www.supermicro.com/en/products/system/gpu/5u/ars-522gp-nr
- Two Arm AGI CPUs, up to 136 cores per CPU
- Up to 6TB of DDR5-8800 MT/s RDIMMs
- Up to 8 Double Width GPUs
2U4N Liquid-Cooled Server – For OCP ORV3 environment
https://www.supermicro.com/en/products/system/hyper/2-ou/ars-242tp-qnr-lcc
- Two Arm AGI CPUs per node, up to 136 cores per CPU
- 4 Nodes in 2-OU potentially up to 20,672 cores per one ORV3 Rack.
- Up to 6TB of DDR5-8800 MT/s RDIMMs per node
2U Hyper-E Server – Single-socket edge-optimized architecture with front I/O
https://www.supermicro.com/en/products/system/hyper/2u/ars-212he-fnr
- Single socket Arm AGI CPU, up to 136 cores
- Up to 3TB of DDR5-8800 MT/s RDIMMs
- Up to 2 GPUs
1U 4N in an OCP ORW rack – Massive Compute Density
- ORW - 48U rack
- 336 Arm AGI CPUs per rack
- 168 Servers per rack with 45,696 cores per rack
Supermicro continues to lead the industry with its comprehensive portfolio of AI infrastructure solutions, enabling organizations worldwide to deploy scalable, efficient, and environmentally responsible AI data centers.
The latest rack-scale solutions will be on display at the Supermicro booth at Taipei Nangang Exhibition Center Hall 1, 4F, N0602, offering attendees a first-hand look at their design and capabilities.
Media Contacts
If you need additional support, please contact our public relations team at PR@supermicro.com