MicroCloud. Dense Multi-Node Solution

Dense Multi-Node Solution for the Cloud

Overview

Highlights
3U systems supporting 24, 12 or 8 nodes with 4 DIMM slots
Hot-swappable 3.5” or 2.5” NVMe/SAS3/SATA3 options
Onboard 10 Gigabit Ethernet for optimized cost effectiveness

Innovations

Designed for Hyperscale and Cost Effectiveness
The MicroCloud modular architecture provides high density, serviceability and cost effectiveness required for today’s demanding hyperscale deployments. The 24/12/8 modular server nodes are conveniently integrated into a compact 3U chassis that is less than 30 inches deep, saving over 76% of rack space when compared to traditional 1U servers.
Power and Density Optimized
The MicroCloud family offers hyperscale data center optimized single socket computing solutions with the latest lower-power and high-density system-on-chip (SoC) processors, including Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors to enable a wide range of flexible and scalable cloud and edge computing solutions.
Front I/O Option for Easy Access and Serviceability
Power and I/O ports are located at the front of the chassis for rapid server provision, upgrades, and service. Rear I/O option is also available when hot-swappable storage is preferred.

Product Features

Resources

24/12/8 UP Nodes in 3U Optimized for Web Hosting, CDN and Social Networking

The Supermicro MicroCloud modular server system provides the high density, performance, efficiency and cost effectiveness required for today’s demanding server deployments. The 24/12/8 modular server nodes are conveniently integrated into a compact 3U chassis that is less than 30 inches deep, saving over 76% of rack space when compared to traditional 1U servers. The cable-less, hot-pluggable server nodes operate independently.

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