2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Quad Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 12TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 12TB 3DS ECC LRDIMM, DDR4-2933MHz Or 12TB 3DS ECC DCPMM, DDR4-2666MHz, in 48 DIMM slots
1 PCI-E 3.0 x32 Left Riser.
1 PCI-E 3.0 x40 Ultra Riser.
1 PCI-E 3.0 x8 in x16 slot rear Middle Riser.
1 PCI-E 3.0 x32 for 2U (or x48+x8 for 4U) on front for NVMe card support.
1 PCI-E 3.0 (x32 for 2U or x48 for 4U) on front for NVMe card support.
1 PCI-E 3.0 x32 Left Riser.
1 PCI-E 3.0 x40 Ultra Riser.
1 PCI-E 3.0 x8 in x16 slot rear Middle Riser.
1 PCI-E 3.0 x32 for 2U (or x48+x8 for 4U) on front for NVMe card support.
1 PCI-E 3.0 (x32 for 2U or x48 for 4U) on front for NVMe card support.
System BIOS
BIOS Type
AMI UEFI
Management
Software
IPMI2.0, KVM with dedicated LAN, NMI, SUM, SuperDoctor® 5, Watchdog
PC Health Monitoring
Voltage
+1.8V, +12V, +3.3V, +5V, +5V standby, 4 -fan status, 5 Phase-switching voltage regulator, Chassis intrusion header, Monitors CPU voltages, Supports system management utility, VBAT
FAN
4x 4-pin fan headers (up to 4 fans), Low noise fan speed control, PWM fan speed control, Status monitoring for on/off control, Status monitoring for speed control
Temperature
N/A
LED
CPU / System Overheat LED
Other Features
4x 8-pin GPU power connectors, RoHS, Halogen Free, SDDC
