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Application Optimized High-Performance Storage Solutions

2U 48 NVMe Simply Double
4U 45/60-Bay Top-Loading

SuperStorage Solutions

New generation X11 Supermicro SuperStorage systems support node based deployment strategies where CPU and HDD capacity scale together, or deployments can be expanded using JBODs for improved economy. Low-latency SSD applications, large media files requiring massive capacity and enterprise workloads looking for the highest performance will benefit from Supermicro's SAS 3.0 (12Gbps) support which provides low-latency and maximum data bandwidth. The Supermicro SuperStorage systems offer a no compromise storage platform with flexible market entry points from 2U, 3U, and 4U form factors using 2.5" or 3.5" SSDs/HDDs. SuperStorage servers support up to: 1TB 3DS ECC LRDIMM or 256GB ECC RDIMM memory, PCI-E 3.0 slots, NVMe, flexible networking options such as 10G SFP+, 10GBase-T LAN ports and IPMI 2.0 and KVM with dedicated LAN, and have support for the latest Intel® Xeon® Scalable processors.

Supermicro SuperStorage solutions present a number of key benefits to customers working with CPU Intensive Storage, Virtual Storage, Single Instance Storage and Data Deduplication, Data Replication and Business Continuity, and Virtual Tape Library customer environments.

Key Benefits:

  • Complete Portfolio of open industry standard storage offerings optimized for Microsoft, VMWare, RedHat and Software Defined Storage solutions
  • Maximum Performance – Full NVMe support, in hybrid expander and direct attach storage backplane with up to 20 GB/s throughput
  • Maximum Efficiency – High capacity 2U, 3U and 4U form factors with industry leading density. Highest efficiency platinum rated power supplies (95% power efficient)
  • Mission Critical Reliability – Fully redundant, fault-tolerant architecture with hot swappable drive bays, power supplies and cooling fans. The active-active capable JBOD hardware is perfect for mission critical applications
New Generation of Computing Excellence
New Intel® Xeon® Scalable processors supported.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
  • IOPS Intensive Storage App., DB App. (MySQL, Casandra), Hyperconverged Infrastructure / Scale-out Architectures
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 32 Hot-swap NGSFF drive bays, 4 hybrid PCI-E NGSFF or SATA3 M.2 drive bays
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 3 USB 3.0, 1 TPM header
  • 8x 4cm counter-rotating cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
24 Hot-swap 2.5" SAS3/SATA3
  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-2029P-ACR24H - SAS3 via Broadcom 3108 AOC
    • SSG-2029P-ACR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
24 Hot-swap 2.5" SAS3/SATA3 Dual JBOD Exp. Ports
  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 2.5" SAS3/SATA3 drive bays
  • Storage Options:
    • SSG-2029P-E1CR24H - SAS3 via Broadcom 3108 AOC
    • SSG-2029P-E1CR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
12 Hot-swap 3.5" SAS3/SATA3
  • Application and data serving, Connectivity/Storage Compute Nodes, High Availability Storage Appliance Platform
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 3 High-performance 80mm PWM fans
  • 800W Redundant Titanium Level (96%) Power Supplies
  • Backup Storage, Cold Storage; Database Applications; Data Warehousing, Archiving
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays (NVMe/SATA optional)
  • Storage Options:
    • SSG-5049P-E1CR45H – SAS3 via Broadcom 3108 AOC
    • SSG-5049P-E1CR45L – SAS3 via Broadcom 3008 AOC
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2 GbE LAN ports via Intel i210, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 5 Hot-swap 8cm redundant PWM fans
  • 1600W Redundant Platinum Level Power Supplies
36 Hot-swap 3.5" SAS3/SATA3
  • Connectivity/Storage Compute Nodes, Database Processing & Storage Appliance Platform
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via Intel X722 + X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 7 High-performance 80mm PWM fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
12 Hot-swap 3.5" SAS3/SATA3 + 4 Hot- swap 2.5" NVMe/SATA
  • High Density Storage, Object Storage 1U, Ceph / Hadoop, Scale-out Storage, Big Data Analytics
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 4 Hot-swap 2.5" NVMe/SATA drive bays
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0, 1 TPM header
  • 6x 4cm 20.5K RPM cooling fans
  • 600W Redundant Platinum Level Power Supplies
12 Hot-swap 3.5" SAS3/SATA3 Dual JBOD Exp. Ports
  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6029P-E1CR12H - SAS3 via Broadcom 3108 AOC
    • SSG-6029P-E1CR12L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
12 Hot-swap 3.5" SAS3/SATA3 SAS3 via Broadcom 3108
  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3 (via Broadcom 3108)/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
16 Hot-swap 3.5" SAS3/SATA3 SAS3 via Broadcom 3108
  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 3.5" SAS3 (via Broadcom 3108)/SATA3 drive bays
  • 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
16 Hot-swap 3.5" SAS3/SATA3 Dual JBOD Exp. Ports
  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6039P-E1CR16H - SAS3 via Broadcom 3108 AOC
    • SSG-6039P-E1CR16L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
24 Hot-swap 3.5" SAS3/SATA3 Dual JBOD Exp. Ports
  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24" Hot-swap 3.5 SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6049P-E1CR24H - SAS3 via Broadcom 3108 AOC
    • SSG-6049P-E1CR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
36 Hot-swap 3.5" SAS3/SATA3 Dual JBOD Exp. Ports
  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6049P-E1CR36H - SAS3 via Broadcom 3108 AOC
    • SSG-6049P-E1CR36L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies