

2nd generation Intel® Xeon® Scalable processors supported.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
TwinPro • 2 Hot-swappable DP nodes in 1U
- 2 Hot-swappable DP nodes in 1U; Each Node (x2 nodes) supports:
- Dual 2nd Gen. Intel® Xeon® Scalable processors
- 16 DIMMs; up to 4TB 3DS ECC DDR4-2933 MHz L/RDIMM
- 2 PCI-E 3.0 x16 slots and 1 SIOM slot for flexible Networking options (SIOM must bundle 1 per node)
- Storage Drive Options:
- 1 Video, 2 USB 3.0, 2 SuperDOM, 2 SATA M.2 or 1 NVMe M.2 (optional carrier card AOC-SMG3-2H8M2, support 1029TR-DTR/DC0R)
- System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
- 3 heavy duty counter rotating fans with air shroud
- 1000W Redundant Titanium Level (96%) Power Supplies
SYS-2029BR-HER (Coming Soon)
BigTwin™ • 10 EDSFF (E1.S) per Node
- 4 DP nodes in 2U; depth 28.75", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4 2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 10 EDSFF (E1.S) drive bays and 2 SATA M.2 drive bays per node.
- 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 Heavy duty 8cm PWM fans w/ optimal fan speed control
- 2600W Redundant Titanium Level (96%) Power Supplies
* Contact your Supermicro sales rep for more info.
BigTwin™ • 4 NVMe/SAS3 + • 8 SAS3 per Node
- 2 DP nodes in 2U; depth 28.5", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays per node
- SAS3 (12Gbps) support via Broadcom 3216; IT mode
- 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 heavy duty 80mm fans w/ optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
BigTwin™ • 4 NVMe/SAS3/SATA3 + • 2 SAS3/SATA3 per Node
- 4 DP nodes in 2U; depth 28.5", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
- SAS3 support via Broadcom 3008; IT mode
- 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 heavy duty 80mm fans w/ optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
BigTwin™ • 4 NVMe/SAS3/SATA3 + 2 SAS3/SATA3 per Node
- 4 DP nodes in 2U; depth 28.5", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
- SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
- 1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 heavy duty 80mm fans w/ optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
BigTwin™ • 6 NVMe per Node
- 4 DP nodes in 2U; depth 28.5", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 6 Hot-swap 2.5" NVMe drive bays per node
- 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 heavy duty 80mm fans w/ optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
BigTwin™ • 4 NVMe/SATA3 + • 2 SATA3 per Node
- 4 DP nodes in 2U; depth 28.5", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays per node
- 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 heavy duty 80mm fans w/ optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
BigTwin™ • 6 SATA3 per Node
- 4 DP nodes in 2U; depth 28.5", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 6 Hot-swap 2.5" SATA3 drive bays per node
- 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 heavy duty 80mm fans w/ optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
BigTwin™ • 6 NVMe per Node • N+1 Cooling
- 4 DP nodes in 2U; depth 28.75", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 6 Hot-swap 2.5" NVMe drive bays per node; 2 M.2 SATA3 or NVMe support
- 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 16 Heavy duty 40x56mm fans w/ optimal fan speed control (4 fans per node)
- 2600W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
SYS-2029TP-HTR
/ SYS-2029TP-HC0R / SYS-2029TP-HC1R / SYS-6029TP-HTR / SYS-6029TP-HC0R / SYS-6029TP-HC1R
TwinPro² (SIOM) • Flexible Storage Options
- 4 DP nodes in 2U; depth 28.5" (2029TP) / 30.5" (6029TP), Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
- 16 DIMMs; up to 4TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- Storage Drive Options:
- 2 PCI-E 3.0 x16 Low-profile slots
- 1 SIOM card support for flexible networking options
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 2 SuperDOM
- 4 Heavy duty 8cm fans with optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
BigTwin™ • 3 NVMe/SAS3 + 3 SAS3 per Node
- 2 DP nodes in 2U; depth 30.11", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processor; dual UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 3 NVMe/SAS3 + 3 SAS3 Hot-swap 3.5" drive bays per node, 2 Internal M.2 NVMe/SATA slots
- SAS3 support via Broadcom 3008; IT mode
- 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 heavy duty 80mm fans w/ optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
BigTwin™ • 3 NVMe/SAS3 per Node
- 4 DP nodes in 2U; depth 30.11", Each Node:
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
- 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
- Supports Intel® Optane™ DCPMM*
- 3 Hot-swap NVMe/SAS3 drive bays per node
- SAS3 support via Broadcom 3008; IT mode
- 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
- 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
- 4 heavy duty 80mm fans w/ optimal fan speed control
- 2200W Redundant Titanium Level (96%) Power Supplies
*Contact your Supermicro sales rep for more info.
- 2 DP nodes in 2U; depth 28.5", Each Node (x2 nodes):
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
- 8 DIMMs; up to 2TB 3DS ECC DDR4-2933 MHz L/RDIMM
- 2 PCI-E 3.0 x8 (FHHL) or 1 PCI-E 3.0 x8 (FHHL) + 1 PCI-E 3.0 x4 (FHHL) + 1 PCI-E 3.0 x4 (LP) (8/8/0 or 8/4/4)
- 6 Hot-swap 3.5" SATA3 drive bays
- 2x 1GbE LAN ports, 1 dedicated IPMI port
- I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
- 4 heavy duty fans w/ optimal fan speed control
- 1200W Redundant Titanium Level (96%) Power Supplies
- 4 DP nodes in 2U, depth 28.5", Each Node (x4 nodes):
- Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
- 8 DIMMs; up to 2TB 3DS ECC DDR4-2933 MHz L/RDIMM
- 1 PCI-E 3.0 x16 (LP) slot
- 3 Hot-swap 3.5" SATA3 drive bays
- 2x 1GbE LAN ports, 1 dedicated IPMI port
- I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
- 4 heavy duty fans w/ optimal fan speed control
- 1600W Redundant Titanium Level (96%) Power Supplies