Skip to main content

Industry Leading Next Generation X11 Twin Architecture

2U 4/2-Node Server Solution
2U 4/2-Node Server Solution

Twin Server Solutions

The Supermicro Twin SuperServer® systems are a family of high-density 2U hot-plug multi-node servers available with a variety of memory capacities, HDD technologies, PCIe alternatives, networking capabilities, and GPU support options. Support for the 2nd generation Intel® Xeon™ Scalable processors enable a host benefits to each generation of the Twin architecture with: up to 6TB (BigTwin)/4TB (TwinPro) of DDR4-2933MHz memory in 24 or 16 DIMM slots, flexible networking options of up to 100G, and integrated Ultra Path Interconnect technology for lower latency and extra bandwidth. Support for Intel® Optane™ DC Persistent Memory brings a new class of big, affordable memory to the BigTwin SuperServer® family.

The BigTwin™ is the 5th generation of the breakthrough Twin architecture which extends the compute and storage capabilities of Supermicro's 2U TwinPro and 1U Twin family SuperServer systems. Offering up to 24 All-Flash NVMe or Hybrid HDDs, 2 low-profile PCI-E x16 slots and 1 SIOM slot for maximum networking flexibility, the BigTwin is optimized for today's demanded IT requirements.

The Supermicro Twin Family represents a revolution in Green Computing designed to support customers' critical applications and also reduce Data Center TCO to help preserve the environment. Due to their shared components, the Twin Family improves cost-effectiveness and reliability over rackmount servers, while their modular architecture enables flexible configuration and easy maintenance.

Versatile configurations and the availability of 1U, 2U or 4U form factors allow the Twin Servers to be optimized for many different environments including Enterprise, Data Center, Cloud Computing, HPC, Financial, Science and Engineering, File and Storage Servers.

BigTwin:

  • Up to 4 hot-pluggable Dual Processor nodes
  • Up to 6TB DDR4-2933MHz memory in 24 DIMM slots
  • 205W per socket
  • Up to 24 2.5" All-Flash NVMe or Hybrid Drive Bays in 2U
  • Up to 3 PCI-E 3.0 x16 slots
  • Redundant 2200W high efficiency (96%) power supplies

TwinPro:

  • Up to 2 hot-pluggable Dual Processor nodes
  • Up to 4TB DDR4-2933MHz memory in 16 DIMM slots
  • 205W per socket
  • 24 2.5" / 12 3.5" SAS3 Drive Bays in 2U
  • 3 PCI-E 3.0 x16 slots
  • Redundant 2200W high efficiency (96%) power supplies
New Generation of Computing Excellence
2nd generation Intel® Xeon® Scalable processors supported.
Intel, the Intel logo, Xeon, and Xeon Inside are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
TwinPro • 2 Hot-swappable DP nodes in 1U
  • 2 Hot-swappable DP nodes in 1U; Each Node (x2 nodes) supports:
  • Dual 2nd Gen. Intel® Xeon® Scalable processors
  • 16 DIMMs; up to 4TB 3DS ECC DDR4-2933 MHz L/RDIMM
  • 2 PCI-E 3.0 x16 slots and 1 SIOM slot for flexible Networking options (SIOM must bundle 1 per node)
  • Storage Drive Options:
    • SYS-1029TP-DTR - 4 Hot-swap 2.5" SATA3 (Intel C621)
    • SYS-1029TP-DC0R - 4 Hot-swap 2.5" SAS3 (Broadcom 3008)
    • SYS-1029TP-DC1R - 4 Hot-swap 2.5" SAS3 (Broadcom 3108)
  • 1 Video, 2 USB 3.0, 2 SuperDOM, 2 SATA M.2 or 1 NVMe M.2 (optional carrier card AOC-SMG3-2H8M2, support 1029TR-DTR/DC0R)
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 3 heavy duty counter rotating fans with air shroud
  • 1000W Redundant Titanium Level (96%) Power Supplies
SYS-2029BR-HER (Coming Soon)
BigTwin™ • 10 EDSFF (E1.S) per Node
  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4 2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 10 EDSFF (E1.S) drive bays and 2 SATA M.2 drive bays per node.
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 Heavy duty 8cm PWM fans w/ optimal fan speed control
  • 2600W Redundant Titanium Level (96%) Power Supplies

* Contact your Supermicro sales rep for more info.

BigTwin™ • 4 NVMe/SAS3 + • 8 SAS3 per Node
  • 2 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 (12Gbps) support via Broadcom 3216; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 4 NVMe/SAS3/SATA3 + • 2 SAS3/SATA3 per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 4 NVMe/SAS3/SATA3 + 2 SAS3/SATA3 per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
  • 1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 6 NVMe per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" NVMe drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 4 NVMe/SATA3 + • 2 SATA3 per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 6 SATA3 per Node
  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 6 NVMe per Node • N+1 Cooling
  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 6 Hot-swap 2.5" NVMe drive bays per node; 2 M.2 SATA3 or NVMe support
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 16 Heavy duty 40x56mm fans w/ optimal fan speed control (4 fans per node)
  • 2600W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

TwinPro² (SIOM) • Flexible Storage Options
  • 4 DP nodes in 2U; depth 28.5" (2029TP) / 30.5" (6029TP), Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 4TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • Storage Drive Options:
    • SYS-2029TP-HTR - 6 Hot-swap 2.5" SATA3
    • SYS-2029TP-HC0R - 6 Hot-swap 2.5" SAS3 (Broadcom 3008)
    • SYS-2029TP-HC1R - 6 Hot-swap 2.5" SAS3 (Broadcom 3108)
    • SYS-6029TP-HTR - 3 Hot-swap 3.5" SATA3
    • SYS-6029TP-HC0R - 3 Hot-swap 3.5" SAS3 (Broadcom 3008)
    • SYS-6029TP-HC1R - 3 Hot-swap 3.5" SAS3 (Broadcom 3108)
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support for flexible networking options
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 2 SuperDOM
  • 4 Heavy duty 8cm fans with optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 3 NVMe/SAS3 + 3 SAS3 per Node
  • 2 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processor; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 NVMe/SAS3 + 3 SAS3 Hot-swap 3.5" drive bays per node, 2 Internal M.2 NVMe/SATA slots
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

BigTwin™ • 3 NVMe/SAS3 per Node
  • 4 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 6TB 3DS ECC DDR4-2933 MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM*
  • 3 Hot-swap NVMe/SAS3 drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies

*Contact your Supermicro sales rep for more info.

  • 2 DP nodes in 2U; depth 28.5", Each Node (x2 nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 2TB 3DS ECC DDR4-2933 MHz L/RDIMM
  • 2 PCI-E 3.0 x8 (FHHL) or 1 PCI-E 3.0 x8 (FHHL) + 1 PCI-E 3.0 x4 (FHHL) + 1 PCI-E 3.0 x4 (LP) (8/8/0 or 8/4/4)
  • 6 Hot-swap 3.5" SATA3 drive bays
  • 2x 1GbE LAN ports, 1 dedicated IPMI port
  • I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
  • 4 heavy duty fans w/ optimal fan speed control
  • 1200W Redundant Titanium Level (96%) Power Supplies
  • 4 DP nodes in 2U, depth 28.5", Each Node (x4 nodes):
  • Dual Socket P (LGA 3647) support: 2nd Gen. Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 2TB 3DS ECC DDR4-2933 MHz L/RDIMM
  • 1 PCI-E 3.0 x16 (LP) slot
  • 3 Hot-swap 3.5" SATA3 drive bays
  • 2x 1GbE LAN ports, 1 dedicated IPMI port
  • I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
  • 4 heavy duty fans w/ optimal fan speed control
  • 1600W Redundant Titanium Level (96%) Power Supplies