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X10DSN-TS

Super Micro Computer, Inc.
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  Products   Motherboards   Xeon® Boards   [ X10DSN-TS ]

X10DSN-TS
NVMe, SIOM LAN support
For Server SKUs Only


Key Features
1. Dual socket R3 (LGA 2011) supports
    Intel® Xeon® processor E5-2600
    v4/ v3 family; QPI up to 9.6GT/s
2. Intel® C612 chipset
3. Up to 1TB ECC LRDIMM , up to
    DDR4- 2400MHz ; 16x DIMM slots
4. 1 PCI-E 3.0 x24 left riser slot
5. Dual port 10GBase-T (Intel® X540),
    Intel® XL710 used for dedicated
    heartbeat between 2 nodes in SBB
6. 2x SATA3 (6Gbps); RAID 0, 1
7. 3x USB 3.0 ports (2 rear, 1 Type A)
8. 1 VGA, 2 SuperDOM, TPM, 1 COM
   
 
Links & Resources
Tested Memory List
Tested AOC List
Update Your BIOS
Download the Latest Drivers and Utilities
Download Driver CD
Heat Sink Compatibility
OS Compatibility
DP Motherboard Selection Assistant
Product SKUs
MBD-X10DSN-TS -B
  • X10DSN-TS (for server SKUs only)
 
Physical Stats
Form Factor
  • Proprietary
Dimensions
  • 13.85" x 11.8" (35.18cm x 29.97cm)
 
Processor/Cache
CPU
  • Intel® Xeon® processor E5-2600 v4/ v3 family (up to 145W TDP**)
  • Dual Socket R3 (LGA 2011)
Cores / Cache
  • Up to 22 Cores / Up to 55MB Cache
System Bus
  • QPI up to 9.6 GT/s
Note BIOS version 2.0 or above is required
Note ** Motherboard supports this maximum TDP. Please verify your system can thermally support.
 
System Memory
Memory Capacity
  • 16x 288-pin DDR4 DIMM slots
  • Up to 1TB ECC LRDIMM
Memory Type
  • 2400/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
DIMM Sizes
  • RDIMM: 32GB, 16GB, 8GB, 4GB
  • LRDIMM: 64GB, 32GB
Memory Voltage
  • 1.2 V
Error Detection
  • Corrects single-bit errors
 
On-Board Devices
Chipset
  • Intel® C612 chipset
AHCI SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
SCU SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Intel® X540 Dual Port 10GBase-T
  • Intel® XL710 10G SFP+, used for dedicated heartbeat between 2 nodes in SBB
  • Realtek RTL8211E PHY (dedicated IPMI)
Video
  • ASPEED AST2400 BMC
 
Input / Output
SATA
  • 2 SATA3 (6Gbps) ports
LAN
  • 2 RJ45 10GBase-T ports
USB
  • 3 USB 3.0 ports (2 rear, 1 Type A)
Video
  • 1 VGA port
Serial Port / Header
  • COM port via riser
DOM
  • 2 SuperDOM (Disk on Module) ports
TPM
  • 1 TPM Header
SuperServer(s) with X10DSN-TS
Model(s)

 
Expansion Slots
PCI-Express
  • 1 PCI-E 3.0 x24 Left riser slot
 
System BIOS
BIOS Type
  • 128Mb SPI Flash EEPROM with AMI BIOS
BIOS Features
  • Plug and Play (PnP)
  • PCI 2.3
  • ACPI 1.0 / 2.0 / 3.0 / 4.0
  • USB Keyboard support
  • SMBIOS 2.7.1
  • UEFI 2.3.1
 
Management
Software
  • Intel® Node Manager
  • IPMI 2.0
  • KVM with dedicated LAN
  • NMI
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
 
PC Health Monitoring
Voltage
  • Monitors for CPU Cores, +1.8V, +12V, +3.3V, +5V, +5V standby, 1.05 (PCH), Memory Voltages.
  • 5 Phase-switching voltage regulator
FAN
  • 8x 4-pin fan headers
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support
  • Thermal Monitor 2 (TM2) support
  • PECI
LED
  • Suspend Static indicator LED
  • UID/Remote UID
Other Features
  • RoHS
 
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non-Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Parts List (bulk)
  Part Number Qty Description
Motherboard MBD-X10DSN-TS 1 X10DSN-TS Motherboard (only comes with server)
Optional Parts List
  Part Number Qty Description
Heat Sink
(optional, not included)
- - CPU Heat Sink reference
TPM security module
(optional, not included)
AOM-TPM-9665V
AOM-TPM-9665H
- TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF;
Vertical or Horizontal depends on the server
AOM-TPM-9665V-S
AOM-TPM-9665H-S
- TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF;
Vertical or Horizontal depends on the server, Provisioned for TXT
SuperDOM - - Supermicro SATA DOM Solutions [Details]
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.