A+ Server 2123BT-HNC0R(Complete System Only)

A+ Products Systems 2U [ 2123BT-HNC0R ]





Integrated Board
Super H11DST-B

Views: | Angled View | Node View |
| Front View | Rear View |

Key Features
- Compute Intensive Application
- HPC, Data Center, Enterprise
Server
- Hyperscale / Hyperconverged

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual AMD EPYC™ 7001/7002* Series Processors (*AMD EPYC 7002 series drop-in support requires board revision 2.x)
2. 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs (7001 Processors)
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required + 7002 Processors)
3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking)
Note: must bundle with Network card
4. Integrated IPMI 2.0 + KVM with dedicated LAN
• Software Out of Band License
 key (SFT-OOB-LIC) included
 for OOB BIOS management
5. 6 SAS3, or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays
M.2 Interface: 1 SATA/PCI-E 3.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-key
6. SAS3 support via Broadcom 3008; IT mode
7. Video via Aspeed AST2500 BMC
8. 2200W Redundant Power Supplies
Titanium Level (96%)
(Full redundancy based on configuration and application load)

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 8 DIMMs, 1 HDD/NVMe and 1 SIOM card per node).

Drivers & Utilities BIOS IPMI Tested Memory Tested M.2 List NVMe Options Manuals OS Certification Matrix Quick-References Guide Drive Options Network Card (AOC) Matrix

Product SKUs
AS -2123BT-HNC0R
  • A+ Server 2123BT-HNC0R (Black)
Motherboard (per Node)

Super H11DST-B
Processor/Chipset (per Node)
CPU
  • Dual AMD EPYC™ 7001/7002* series Processors
    (* Board revision 2.x required)
  • Socket SP3
  • Supports CPU TDP 200W / cTDP up to 200W**
Cores
  • Up to 32 Cores (Board revision 1.x + 7001 Processors)
  • Up to 64 Cores (Board revision 2.x + 7002 Processors)
Note **
  • Please contact Supermicro Technical Support for specifics on high power processor support
System Memory (per Node)
Memory Capacity
  • 16 DIMM slots
  • Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM (7001 Processors)
  • Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required + 7002 Processors)
  • 8-channel memory bus
  • For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
Memory Type
  • DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs (7001 Processors)
  • DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required + 7002 Processors)
Memory Sizes
  • 8GB, 16GB, 32GB, 64GB, 128GB, 256GB*
    (* Board revision 2.x required + 7002 processors)
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices (per Node)
Chipset
  • System on Chip
SAS
  • SAS3 (12Gbps) via Broadcom 3008; IT mode
Network
  • 1 PCI-E 3.0 x16 SIOM LAN Networking Slot for flexible networking, see SIOM LAN options support matrix (Must bundle with at least one SIOM network card)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video
  • ASPEED AST2500 BMC
Input / Output (per Node)
LAN
  • Provided via SIOM (optional)
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
Video
  • 1 VGA port
DOM
  • 1 SuperDOM (Disk on Module) port
Others
  • 1 COM port (header)
  • 1 TPM 2.0 header
System BIOS (per Node)
BIOS Type
  • AMI 128Mb SPI Flash ROM
Management (per Node)
Software
Power Configurations
  • ACPI / APM Power Management
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-217BHQ+-R2K22BP2
Dimensions and Weight
Width
  • 17.25" (438mm)
Height
  • 3.47" (88mm)
Depth
  • 28.5" (724mm)
Package
  • 26.4" (H) x 11.2" (W) x 39.8" (D)
Weight
  • Gross Weight: 85 lbs (38.6 kg)
  • Net Weight: 54.5 lbs (24.7 kg)
Available Colors
  • Black
Front Panel (per Node)
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express
  • 2 PCI-E 3.0 (x16) Low-profile slots
  • 1 SIOM card support
    (must bundle with network card)
M.2
  • Interface: 1 SATA/PCI-E 3.0 x4
  • Form Factor: 2280, 22110
  • Key: M-key
Drive Bays (per Node)
Hot-swap
  • 6 Hot-swap 2.5" SAS3 drive bays or
    4 NVMe + 2 SAS3 Hot-swap 2.5"
System Cooling
Fans
  • 4 Heavy duty 8cm PWM fans
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power
  • 1200W/1800W/1980W/2090/2200W
Dimension
(W x H x L)
  • 45 x 40 x 480 mm
Input
  • 1200W: 100-127Vac / 50-60Hz
  • 1800W: 200-220Vac / 50-60Hz
  • 1980W: 220-230Vac / 50-60Hz
  • 2090W: 230-240Vac / 50-60Hz
  • 2090W: 180-220Vac (for UL/cUL only)
  • 2200W: 220-240Vac (for UL/cUL only)
  • 2090W: 230-240Vdc (for CCC only)
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
  • Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)
  • Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
12Vsb
  • Max: 2.1A / Min: 0A
Output Type
  • Gold Finger
Certification Titanium Level96% Titanium Level
[ Test Report ]
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
    10°C ~ 30°C (50°F ~ 86°F)
    * Support for operating above 30°C is available in certain system configurations. Contact your Supermicro sales rep or Technical Support for more details.
  • Non-operating Temperature:
    -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)

See Parts List

Parts List - (Items Included)

Part Number
Qty
Description
Motherboard / Chassis MBD-H11DST-B
CSE-217BHQ+-R2K22BP2
4
1
Super H11DST-B Motherboard
2U Chassis
Backplane BPN-ADP-6S3008N4-1UB 4 Big Twin 1U hybrid ADP supporting 6x SAS3 and 4x NVMe
Backplane BPN-SAS3-217BHQ-N4 1 2U 4-Node 24-Port Backplane Supports 2x2.5\" SATA3/SAS3 SSD/HDD and 4x2.5\" SATA3/SAS3/NVMe Stoage Media per Node
Drive Tray(s) MCP-220-00141-0B-BULK 8 Black Gen3 hot-swap 2.5 inch HDD tray with lock improved EMI
Drive Tray(s) MCP-220-00144-0B-BULK 16 Black Gen3 hot-swap 2.5 inch HDD tray with lock, orange tab
Parts MCP-240-21730-0N 1 217B BigTwin type I (Impact) BPN retention bkt w/ foam assy
Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
Software SFT-OOB-LIC 4 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0062PM 4 1U Passive Front CPU Heat Sink w/ a 30-mm Wide Middle Air Channel for AMD H11 2U4N Big Twin Series Servers
Heatsink / Retention SNK-P0062PW 4 1U Proprietary 93-mm Wide Passive Rear CPU Heat Sink for AMD H11 2U4N Big Twin Series Servers
Power Supply PWS-2K22A-1R 2 1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48
FAN FAN-0183L4 4 80x80x38 mm, 16.5K RPM, Non-hot-swappable Middle Cooling Fan for X11 Twin Pro, X10 and X11 Big Twin Series Servers


Optional Parts List
Part Number Qty Description
Global Services & Support OS4HR3/2/1
OSNBD3/2/1
-
-
3/2/1-year onsite 24x7x4 service
3/2/1-year onsite NBD service
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
TPM security module AOM-TPM-9655V - TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF;
AOM-TPM-9655V-S - TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF; Provisioned for TXT
AOM-TPM-9665V - TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF;
AOM-TPM-9665V-S - TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF; Provisioned for TXT
SIOM - - Supermicro SIOM solutions [Details]
Hide Parts List

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