Skip to main content

Supermicro Accelerates IT Innovation with Resource Saving Datacenter Solutions at CloudFest 2018

Supermicro showcasing multi-node BigTwin™ and SuperBlade® Solutions optimized for Cloud Datacenters along with cost-effective 45/60/90-bay storage systems that extend server resource lifecycles

Europa-Park, Germany, March 13, 2018 — Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in enterprise computing, storage, networking solutions and green computing technology, today announced that is showcasing SuperBlade, MicroBlade, and 2U BigTwin systems at CloudFest 2018 from March 13-15 in the Arena exhibitor space, booth #F09.

“Taking our We Keep IT Green® mission to the next level, Supermicro has already deployed Resource Saving systems in volume at many Fortune 100 datacenters,” said Charles Liang, President and CEO of Supermicro. “As the leader in server system power efficiency and green computing, Supermicro now enables further savings by extending the life of server enclosures including networking, storage, fans and power supplies. The result is less power consumption and less e-waste during technology refresh cycles, which saves costs and helps preserve our Mother Earth for future generations.”

To further convey the significance of this important Resource Saving innovation, Dr. Martin Galle of Supermicro will be presenting “Energy Saving to Resource Saving: The Next Steps of Running Efficient Cloud Infrastructure” in the main.FORUM Dome at 4:10pm on Wednesday, March 14.

Supermicro is showcasing SuperBlade® and MicroBlade™ high-density compute solutions designed to provide resource-saving disaggregated architecture to power today’s datacenters. These enclosure-based blade server solutions have been engineered for optimum performance, reliability, and scalability while enabling lower initial acquisition cost, lower Total Cost of Ownership (TCO) while providing higher Return on Investment (ROI).

The SuperBlade portfolio is a modular, enclosure-based, self-contained solution in a variety of form factors including 8U, 6U and 4U.The individual blade servers are available in 1-socket (UP), 2-socket (DP) and 4-socket (4S) versions. The 8U enclosure can support up to twenty DP or ten 4S blades or a combination of both. The 6U enclosure accommodates either ten or fourteen disaggregated UP/DP blade servers. The 4U supports up to fourteen DP blade servers. All blade servers are designed to take advantage of the performance features of the latest Intel® Xeon® Scalable processors, and are design optimized to support up to 205W TDP per CPU. The 8U SuperBlade includes high-performance, low latency, maximized throughput switches including 100G EDR InfiniBand or 100G Intel® Omni-Path, and 25/10G Ethernet switches. The 6U enclosure supports two 25G Ethernet switches. Redundant Chassis Management Modules (CMM) provide manageability to the enclosures. Innovative optional Battery Backup Power (BBP) modules improve reliability and data protection while eliminating the need for expensive datacenter UPS systems. Optimized Titanium-level power supplies and cooling fan modules enable the system to support free-air cooling and reduce the TCO for the datacenter.

Supermicro MicroBlades are flexible, extreme-density 6U/3U all-in-one total systems that feature 28/14 hot-swappable, disaggregated MicroBlade server nodes supporting 28/14 new dual-node Xeon UP systems with Intel E3-1200 v6/v5 family configurations with up to 2 SSDs or 1 HDD per node. The 6U/3U MicroBlade enclosure can incorporate up to two Chassis Management Modules, and up to two Switch Modules for efficient, high-bandwidth communications. It can incorporate up to eight redundant (N+1 or N+N) 1600/2000W high-efficiency (95%/96%) power supplies with cooling fans. This innovative new generation architecture includes server, networking, storage, and unified remote management for cloud computing, video streaming, content delivery, social networking, desktop virtualization and remote workstation applications.

Delivering the highest performance and efficiency of any 2U 4-node design, the Supermicro BigTwin™ system supports the full range of Intel® Xeon® Scalable processors, fully exploits all the memory channels with a maximum of 24 DIMMs per node, and offers options for all-flash NVMe or hybrid NVMe/SAS3 drive bays. Depending on configuration, each node features dual Intel Xeon Scalable processors (up to 28 cores, 205W TDP per CPU, 3 UPI), 24 DIMMs for up to 3TB of DDR4-2666MHz registered ECC memory, up to 6 hot-swap NVMe or SAS3 drives, up to three PCI-E 3.0 slots including support for a flexible SIOM module enabling 100/50/40/25/10G networking options and redundant 2600W/2200W Titanium Level (96%+) digital power supplies.

Supermicro’s 45/60/90-bay storage servers come with the most flexible and innovative designs in the industry. These servers feature tiered storage, packing hot, warm and cold storage in one compact 4U enclosure. Supermicro’s 45-bay storage server (SSG-6048R-E1CR45H/L) is the industry’s only one supporting NVMe SSDs (6 x U.2) for I/O intensive meta-data operations, highest performance CPU, largest memory with 24 DIMMs, M.2 SSDs, high-availability boot drives, and wide range networking choices with Supermicro Super I/O Module (SIOM) cards.

The 45-bay storage server is right-sized for datacenter deployments with a short depth of 25.9 inches (0.66 meters) that is perfect for space-constrained environments. The Common Software-Defined Storage (SDS) applications and use cases that are ideal for Supermicro top-loading storage servers include Red Hat Gluster, Ceph, data replication targets, data backup, archive and cold storage, video streaming and surveillance.

Supermicro technology partners at CloudFest 2018 will be showcasing a breadth of Supermicro standard rackmount platforms to address a wide range of workloads. These exhibits will include the all-flash Ultra SuperServer with 24 hot-swap NVMe drives as well as AMD EPYC processor-based Ultra, BigTwin, WIO and 4U servers.