Supermicro Solutions based on Intel® Xeon®-D processors

Supermicro leverages its deep expertise in server technology to bring customers the first Intel® Xeon® D System-on-a-Chip (SoC) Family solutions with server-class reliability, availability and serviceability (RAS) features available in ultra-dense and low-power solutions. Xeon D combines the performance and advanced intelligence of Intel® Xeon® processors into a dense, lower-power system-on-a-chip. The solutions will be able to deliver optimized compute and storage for intelligent edge network appliances, mid-range networking, cold and warm storage environments such as storage and network security appliances, SMB storage servers, Hadoop, web hosting, controllers, dedicated compute nodes, and other similar applications.

These advanced technology building blocks offer the best work load optimized solutions and long life availability with the Intel® Xeon® processor D family including:

  • Up to 16 cores providing up to 3x performance improvement
  • Up to: 512GB ECC DDR4 LRDIMM operating at 2666MHz
  • PCI-E 3.0 x16 and PCI-E 3.0 x8 slots, USB 3.0 I/O
  • 12 SATA 3.0 storage ports
  • Quad 10 GbE plus quad GbE LAN networking
  • IPMI 2.0
  • 8-pin 12V DC or ATX power source
  • 7 years product life

Resources

Intel® Xeon® Processor D
  • Lower Power, Higher Physical Density
  • Single-Chip BGA Solution with Integrated I/O
  • Xeon® Core, Best Socket Perf/Watt
SYS-1019D-FHN13TP
SYS-1019D-FHN13TP
  • Multi-Access Edge Computing (MEC), Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV), Artificial Intelligence (AI)
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Hot-swap 2.5" drive bays and 2 Internal 2.5" SSD bays
  • 3 M.2: M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 350W AC-DC Multi-output Platinum Level Power Supply
SYS-1019D-4C-FHN13TP
SYS-1019D-4C-FHN13TP
  • Multi-Access Edge Computing (MEC), Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV), Artificial Intelligence (AI)
  • Intel® Xeon® processor D-2123IT SoC, 4-Cores, 8 Threads, 60W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2666MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Hot-swap 2.5" drive bays and 2 Internal 2.5" SSD bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 350W AC-DC Multi-output Platinum Level Power Supply
SYS-1019D-16C-FHN13TP
SYS-1019D-16C-FHN13TP
  • Multi-Access Edge Computing (MEC), Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV), Artificial Intelligence (AI)
  • Intel® Xeon® processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Hot-swap 2.5" drive bays and 2 Internal 2.5" SSD bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 500W Multi-output Platinum Level Power Supply
SYS-1019D-14CN-FHN13TP
SYS-1019D-14CN-FHN13TP
  • Multi-Access Edge Computing (MEC), Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV), Artificial Intelligence (AI)
  • Intel® Xeon® processor D-2177NT SoC, 14-Cores, 28 Threads, 105W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2666MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Hot-swap 2.5" drive bays and 2 Internal 2.5" SSD bays
  • 3 M.2: M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 (FHFL) slots
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 500W Multi-output Platinum Level Power Supply
SSG-5019D8-TR12P
SSG-5019D8-TR12P
12x 3.5" SATA3 drive bays
  • Warm storage, CDN, Web or DB Server, Multi-access Edge Computing, VM and SMB Servers
  • Intel® Xeon® processor D-2146NT (8-Core)
  • 12x 3.5" SATA3 Drive Bays, SAS3 support by AOC
  • 4 DIMMs, up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM, DDR4-2133MHz memory
  • 1 PCI-E 3.0 x8 (FH), M.2: M Key and B Key
  • 2x 10GBase-T, 4x 1GbE, 2x 10G SFP+ ports, 1x dedicated IPMI LAN port
  • I/O ports: 1 VGA, 1 COM, 2 USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 6x 40mm 4-pin fans
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-FRN5TP
SYS-1019D-FRN5TP
  • Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV)
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2x 2.5” drive bays (one drive space shares with M.2), 2 EDSFF
  • 2 M.2: M-Key: 2280/22110, 1 M.2 E-Key: 2230, 1 M.2 B-Key: 3042
  • 4 PCI-E 3.0 x8 slots for optional AIOM
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-12C-FRN5TP
SYS-1019D-12C-FRN5TP
  • Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV)
  • Intel® Xeon® processor D-2163IT SoC, 12-Cores, 24 Threads, 75W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2x 2.5” drive bays (one drive space shares with M.2), 2 EDSFF
  • 2 M.2: M-Key: 2280/22110, 1 M.2 E-Key: 2230, 1 M.2 B-Key: 3042
  • 4 PCI-E 3.0 x8 slots for optional AIOM
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-14C-FRN5TP
SYS-1019D-14C-FRN5TP
  • Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV)
  • Intel® Xeon® processor D-2173IT SoC, 14-Cores, 28 Threads, 70W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2x 2.5” drive bays (one drive space shares with M.2), 2 EDSFF
  • 2 M.2: M-Key: 2280/22110, 1 M.2 E-Key: 2230, 1 M.2 B-Key: 3042
  • 4 PCI-E 3.0 x8 slots for optional AIOM
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-16C-FRN5TP
SYS-1019D-16C-FRN5TP
  • Centralized/Cloud Radio Access Network (C-RAN), Universal Customer Premise Equipment (uCPE), Software Defined WAN (SD-WAN), Network Function Virtualization (NFV)
  • Intel® Xeon® processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2x 2.5” drive bays (one drive space shares with M.2), 2 EDSFF
  • 2 M.2: M-Key: 2280/22110, 1 M.2 E-Key: 2230, 1 M.2 B-Key: 3042
  • 4 PCI-E 3.0 x8 slots for optional AIOM
  • 2 USB 3.0, 1 VGA, 1 COM via RJ45
  • 400W Redundant Platinum Level Power Supplies
SYS-1019D-FRN8TP
SYS-1019D-FRN8TP
  • Network Security Appliance, FireWall Applications, Virtualization, SD-WAN and vCPE/uCPE
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2666MHz in 4 DIMM slots
  • 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0 (front)
  • Up to 4 Internal fixed 2.5" drive bays
  • 1 M.2 M-Key for storage: 2242/2280, 1 M.2 B-Key for SSD & WAN: 2242
  • 2 USB 3.0 (front), 1 VGA (front)
  • 400W Redundant Platinum Level Power Supplies
SYS-5019D-FN8TP
SYS-5019D-FN8TP
  • Network Security Appliance, SDN-WAN, vCPE controller box, NFV Edge Computing Server, Virtualization Server, IoT Edge Computing / Gateway
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2666MHz in 4 DIMM slots
  • 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Internal 3.5" or 4 Internal 2.5" drive bays
  • 1 M.2 slot M key for SSD, 2242/8, 1 M.2 B Key for SSD/ WAN card,
    1 Mini-PCI-E with mSATA Support, 1 PCI-E 3.0 x8 slot
  • 2 USB 3.0, 1 VGA
  • 200W Low-noise AC-DC Power Supply
SYS-5019D-4C-FN8TP
SYS-5019D-4C-FN8TP
  • Network Security Appliance, SDN-WAN, vCPE controller box, NFV Edge Computing Server, Virtualization Server, IoT Edge Computing
  • Intel® Xeon® processor D-2123IT SoC, 4-Cores, 8 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2666MHz in 4 DIMM slots
  • 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 2 Internal 3.5" or 4 Internal 2.5" drive bays
  • 1 M.2 slot M key for SSD, 2242/80, 1 M.2 B Key for SSD/ WAN card,
    1 Mini-PCI-E with mSATA Support, 1 PCI-E 3.0 x8 slot
  • 2 USB 3.0, 1 VGA
  • 200W Low-noise AC-DC Power Supply
SYS-E403-9D-4C-FN13TP
SYS-E403-9D-4C-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2123IT SoC, 4-Cores, 8 Threads, 60W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-8CN-FN13TP
SYS-E403-9D-8CN-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-12C-FN13TP
SYS-E403-9D-12C-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2163IT SoC, 12-Cores, 24 Threads, 75W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-14C-FN13TP
SYS-E403-9D-14C-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2173IT SoC, 14-Cores, 28 Threads, 70W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-14CN-FN13TP
SYS-E403-9D-14CN-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2177NT SoC, 14-Cores, 28 Threads, 105W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 2242/3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA
  • 600W Multi-output Gold Level Power Supply
SYS-E403-9D-16C-FN13TP
SYS-E403-9D-16C-FN13TP (Coming Soon)
  • Multi-Access Edge Computing (MEC), Universal Customer Premise Equipment (uCPE), Network Function Virtualization (NFV), Edge Computing, Vehicle to Everything Application (C-V2X / V2X)
  • Intel® Xeon® processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2400MHz in 4 DIMM slots
  • 9x 1GbE (1 port used for management), 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0
  • 4 Internal 2.5" drive bays
  • 1 M-Key: 2280/22110, 1 E-Key: 2230, 1 B-Key: 3042
  • 2 PCI-E 3.0 x16 slots or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots
  • 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA (option)
  • 600W Multi-output Gold Level Power Supply
SYS-E300-9D
SYS-E300-9D
  • Network Security Appliance, SDN-WAN, vCPE controller box, NFV Edge Computing Server, Virtualization Server, IoT Edge Computing / Gateway
  • Intel® Xeon® processor D-2123IT SoC, 4-Cores, 8 Threads, 60W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2666MHz in 4 DIMM slots
  • 2x 10GBase-T LAN and 1 dedicated LAN for IPMI 2.0
  • 1 Internal 2.5" drive bay
  • 1 onboard OCuLink port (or 1 PCI-E 3.0 x4 NVMe), 1 PCI-E 3.0 x8 (LP) open slot
  • 2 USB 3.0, 1 VGA, 1 TPM 2.0 header
  • 120W Lockable DC Power Adapter
SYS-5039MD8-H8TNR
SYS-5039MD8-H8TNR
  • Cloud computing, dynamic web serving, dedicated hosting, content delivery network, memory caching, and corporate applications
  • 8 modular UP Nodes in 3U; EACH NODE:
  • Intel® Xeon® processor D-2141i SoC, 8-Cores, 16 Threads, 65W
  • Up to 512GB ECC LRDIMM, up to 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2 GbE LAN ports and 1 dedicated LAN supports IPMI 2.0
  • 2x 3.5" SATA3 or 2x 2.5" Hybrid SATA3/NVMe w/ optional kits
  • 1 PCI-E 3.0 x16, 1 Micro-LP, and 2 M.2
  • 1600W Redundant Titanium Level Power Supplies
SYS-5039MD18-H8TNR
SYS-5039MD18-H8TNR
  • Cloud computing, dynamic web serving, dedicated hosting, content delivery network, memory caching, and corporate applications
  • 8 modular UP Nodes in 3U; EACH NODE:
  • Intel® Xeon® processor D-2191 SoC, 18-Cores, 36 Threads, 86W
  • Up to 512GB ECC LRDIMM, up to 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2 GbE LAN ports and 1 dedicated LAN supports IPMI 2.0
  • 2x 3.5" SATA3 or 2x 2.5" Hybrid SATA3/NVMe w/ optional kits
  • 1 PCI-E 3.0 x16, 1 Micro-LP, and 2 M.2
  • 1600W Redundant Titanium Level Power Supplies
X11SDS-8C
X11SDS-8C
  • Intel® Xeon® Processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports, 2x 10G SFP+ ports, 1x Gigabit Ethernet LAN port (via AOM-SMF-TP4F), IPMI 2.0 by Shared LAN
  • 4 AIOM expansion slots supporting PCI-E x8 modules, 2 PCI-E EDSFF-Short Drive slots (shared with M.2 M-Keys)
  • M.2 Interface: 2 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280/22110; 1 M.2 E-Key PCI-E 3.0 x2, 2230; 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042
  • Up to 2 SATA3 (6Gbps) ports
  • 1 USB 3.0 port (Type A), 2 additional USB 3.0 ports via AOM-SMF-TP4F
  • 1 VGA header, TPM header and onboard
  • Form factor: Proprietary, 13.9" x 7.25"
X11SDS-12C
X11SDS-12C
  • Intel® Xeon® Processor D-2163IT SoC, 12-Cores, 24 Threads, 75W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports, 2x 10G SFP+ ports, 1x Gigabit Ethernet LAN port (via AOM-SMF-TP4F), IPMI 2.0 by Shared LAN
  • 4 AIOM expansion slots supporting PCI-E x8 modules, 2 PCI-E EDSFF-Short Drive slots (shared with M.2 M-Keys)
  • M.2 Interface: 2 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280/22110; 1 M.2 E-Key PCI-E 3.0 x2, 2230; 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042
  • Up to 2 SATA3 (6Gbps) ports
  • 1 USB 3.0 port (Type A), 2 additional USB 3.0 ports via AOM-SMF-TP4F
  • 1 VGA header, TPM header and onboard
  • Form factor: Proprietary, 13.9" x 7.25"
X11SDS-14C
X11SDS-14C
  • Intel® Xeon® Processor D-2173IT SoC, 14-Cores, 28 Threads, 70W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports, 2x 10G SFP+ ports, 1x Gigabit Ethernet LAN port (via AOM-SMF-TP4F), IPMI 2.0 by Shared LAN
  • 4 AIOM expansion slots supporting PCI-E x8 modules, 2 PCI-E EDSFF-Short Drive slots (shared with M.2 M-Keys)
  • M.2 Interface: 2 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280/22110; 1 M.2 E-Key PCI-E 3.0 x2, 2230; 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042
  • Up to 2 SATA3 (6Gbps) ports
  • 1 USB 3.0 port (Type A), 2 additional USB 3.0 ports via AOM-SMF-TP4F
  • 1 VGA header, TPM header and onboard
  • Form factor: Proprietary, 13.9" x 7.25"
X11SDS-16C
X11SDS-16C
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports, 2x 10G SFP+ ports, 1x Gigabit Ethernet LAN port (via AOM-SMF-TP4F), IPMI 2.0 by Shared LAN
  • 4 AIOM expansion slots supporting PCI-E x8 modules, 2 PCI-E EDSFF-Short Drive slots (shared with M.2 M-Keys)
  • M.2 Interface: 2 M.2 M-Key SATA/PCI-E 3.0 x4, 2242/2280/22110; 1 M.2 E-Key PCI-E 3.0 x2, 2230; 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042
  • Up to 2 SATA3 (6Gbps) ports
  • 1 USB 3.0 port (Type A), 2 additional USB 3.0 ports via AOM-SMF-TP4F
  • 1 VGA header, TPM header and onboard
  • Form factor: Proprietary, 13.9" x 7.25"
X11SDV-4C-TP8F
X11SDV-4C-TP8F
Passive Heatsink
  • Intel® Xeon® Processor D-2123IT SoC, 4-Cores, 8 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 4x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8 and 1 PCI-E 3.0 x16, and
    • M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2, 2242/2280 form, M-Key, B-Key
    • U.2 Interface: 2 PCI-E 3.0 x4, 2 PCI-E 3.0 NVMe x4 Internal Ports
  • 12 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 COM port (header), 1 SuperDOM
  • Form factor: Flex ATX, 9" x 7.25"
X11SDV-4C-TLN2F
X11SDV-4C-TLN2F
Passive Heatsink
  • Intel® Xeon® Processor D-2123IT, 4-Cores, 8 Threads, 60W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-8C-TLN2F
X11SDV-8C-TLN2F
Passive Heatsink
  • Intel® Xeon® Processor D-2141I SoC, 8-Cores, 16 Threads, 65W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-12C-TLN2F
X11SDV-12C-TLN2F
Passive Heatsink
  • Intel® Xeon® Processor D-2166NT SoC, 12-Cores, 24 Threads, 85W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-16C-TLN2F
X11SDV-16C-TLN2F
Passive Heatsink
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-8C+-TLN2F
X11SDV-8C+-TLN2F
Active Heatsink
  • Intel® Xeon® Processor D-2141I SoC, 8-Cores, 16 Threads, 65W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-16C+-TLN2F
X11SDV-16C+-TLN2F
Active Heatsink
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 2x 10GBase-T LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8
  • Up to 8 SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
  • 4 SATA ports or PCI-E 3.0 x4 (U.2 NVMe) option via OCuLink port
  • 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 SATA DOM
  • Form factor: Mini-ITX, 6.75" x 6.75"
X11SDV-8C-TP8F
X11SDV-8C-TP8F
Passive Heatsink
  • Intel® Xeon® Processor D-2146NT SoC, 8-Cores, 16 Threads, 80W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 4x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8 and 1 PCI-E 3.0 x16, and
    • M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2, 2242/2280 form, M-Key, B-Key
    • U.2 Interface: 2 PCI-E 3.0 x4, option via mini-SAS HD port
  • 12 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.0 ports (rear), 4 USB 2.0 ports (via headers)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 COM port (header), 1 SuperDOM
  • Form factor: Flex ATX, 9" x 7.25"
X11SDV-12C-TP8F
X11SDV-12C-TP8F
Passive Heatsink
  • Intel® Xeon® Processor D-2166NT SoC, 12-Cores, 24 Threads, 85W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2133MHz in 4 DIMM slots
  • 4x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8 or 1 PCI-E 3.0 x16,
    • M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2, 2242/2280 form, M-Key, B-Key
    • U.2 Interface: 2 PCI-E 3.0 x4, 2 PCI-E 3.0 NVMe x4 internal ports
  • 12 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 4 USB 3.0 ports (2 rear + 2 headers), 3 USB 2.0 port (2 headers + 1 Type A)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 COM port (header), 1 SuperDOM
  • Form factor: Flex ATX, 9" x 7.25"
X11SDV-16C-TP8F
X11SDV-16C-TP8F
Passive Heatsink
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads, 100W
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4-2400MHz in 4 DIMM slots
  • 4x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x8 or 1 PCI-E 3.0 x16,
    • M.2 Interface: 1 PCI-E 3.0 x4 and 1 SATA/PCI-E 3.0 x2, 2242/2280 form, M-Key, B-Key
    • U.2 Interface: 2 PCI-E 3.0 x4, 2 PCI-E 3.0 NVMe x4 internal ports
  • 12 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 4 USB 3.0 ports (2 rear + 2 headers), 3 USB 2.0 port (2 headers + 1 Type A)
  • 1 VGA D-Sub connector port, 1 TPM header, 1 COM port (header), 1 SuperDOM
  • Form factor: Flex ATX, 9" x 7.25"
X11SDW-12C-TP13F
X11SDW-12C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2163IT SoC, 12-Cores, 24 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 10"
X11SDW-14C-TP13F
X11SDW-14C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2173IT SoC, 14-Cores, 28 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 10"
X11SDW-14CNT-TP13F
X11SDW-14CNT-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2177NT SoC, 14-Cores, 28 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242/3042
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 9.6"
X11SDW-16C-TP13F
X11SDW-16C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2183IT SoC, 16-Cores, 32 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 ports (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 10"
X11SDW-4C-TP13F
X11SDW-4C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2123IT SoC, 4-Cores, 8 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
  • 1 M.2 E-Key PCI-E 3.0 x1, 2230
  • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 ports (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 10"
X11SDW-8C-TP13F
X11SDW-8C-TP13F
Passive Heatsink
  • Intel® Xeon® Processor D-2146NT SoC, 8-Cores, 16 Threads
  • Up to 512GB ECC LRDIMM or 256GB ECC RDIMM DDR4 2133MHz in 4 DIMM slots
  • 9x GbE, 2x 10GBase-T, 2x 10G SFP+ LAN ports; IPMI 2.0 and KVM w/ dedicated LAN
  • 1 PCI-E 3.0 x32 Left Riser Slot
    • 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280/22110
    • 1 M.2 E-Key PCI-E 3.0 x1, 2230
    • 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242
  • 4 SATA3 (6Gbps) ports via SoC: RAID 0, 1, 5, 10
  • 2 USB 3.1 Gen1 ports (2 rear), 4 USB 2.0 ports (4 headers)
  • 1 VGA port, 1 TPM header, 2 COM port (1 rear, 1 header)
  • Form factor: Proprietary WIO, 8" x 9.6"