SuperServer SYS-220HE-FTNRD-NEBS (Complete System Only)

X12 DP 2U Short-depth front I/O System with 6 NVMe/SATA bays and redundant DC PSU (NEBS certificated)

SYS-220HE-FTNRD-NEBS Main
Integrated Board: X12DHM-6
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Key Applications

  • 5G Core and Edge
  • Telecom Micro Data Center
  • AI Inference and Machine Learning
  • Network Function Virtualization
  • Cloud Computing

Key Features

  1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  2. 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
  3. 3 PCIe 4.0 x16 slots with GPU/Accelerator support (Default);
     1 PCIe 4.0 x16 expansion slots (Optional)
  4. Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. Up to 6x 2.5" hot-swap drive bays with options to support NVMe/SATA drives
  6. 6 heavy duty hot-swap fans with optimal fan speed control Rear I/O, tool-less design
  7. 1300W DC power supplies
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SYS-220HE-FTNRD-NEBS
Specifications Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-220HE-FTNRD-NEBS
Motherboard
Super X12DHM-6
Processor
CPU
  • Dual Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
Note
  • Supports up to 270W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 4 double-width GPU(s)
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
  • View Memory Options
Memory Voltage
  • 1.2V
On-Board Devices
Chipset
  • Intel® C621A
Network Connectivity
  • 2 RJ45 1GbE with Intel® I350-AM2 (optional)
  • 4 SFP 1GbE with Intel® I350-AM4 (optional)
  • 2 RJ45 10GBASE-T with Intel® X550-AT2 (optional)
  • 2 SFP+ 10GbE with Intel® X710-BM2 (optional)
  • 4 SFP+ 10GbE with Intel® XL710-BM1 (optional)
  • 4 SFP+ 10GbE with Intel® X710-TM4 (optional)
  • 2 SFP28 25GbE with Broadcom® BCM57414 (optional)
  • 4 SFP28 25GbE (optional)
  • 2 QSFP28 100GbE with Broadcom® BCM57508 (optional)
  • 4 RJ45 1GbE with Intel® I350-AM4 (optional)
  • View AIOM Options
  • View AOC Options
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB
  • 2 USB 2.0 port(s) (front)
Video
  • 1 VGA port(s)
Management
Software
Power configurations
  • ACPI Power Management
  • Power-on mode for DC power recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-HE211-R000NFP
chassisWeight
  • Net Weight: 34.4 lbs (15.6 kg)
  • Gross Weight: 47.4 lbs (21.5 kg)
Dimensions and Weight
Height
  • 3.5" (88.9 mm)
Width
  • 17.2" (436.88 mm)
Depth
  • 22.6" (574 mm)
Package
  • 9.7" (H) x 23.5" (W) x 36.9" (D)
Weight
  • Gross Weight: 47.4 lbs (21.5 kg)
  • Net Weight: 34.4 lbs (15.6 kg)
Available Color
  • Silver
Front Panel
LED
  • HDD activity LED
  • LAN1 activity
  • LAN2 activity
  • Power Fail
  • Power status LED
  • System information
Buttons
  • Power On/Off 
  • UID button
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 3 PCIe 4.0 x16 FHFL slot(s)
    • 1 PCIe 4.0 x16 FHHL slot(s)
  • Option A
    • 6 PCIe 4.0 x8 (in x16) FHFL slot(s)
    • 2 PCIe 4.0 x8 (in x16) FHHL slot(s)
  • View AOC Options
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 6 bay(s)
    • 6 front hot-swap 2.5" NVMe/SAS/SATA drive bay(s)
  • View Drive Options
M.2
System Cooling
Fans
  • 6 Counter-rotating, Hot-swappable 60x60x56mm Fan(s)
Power Supply
1300W Redundant power supplies
Dimension (WxHxL)
  • 73.5 x 40 x 203 mm
DC Input
  • 108.3A Max
Operating Environment
Environmental Spec.
  • Operating Temperature: 5°C ~ 35°C (41°F ~ 95°F)
  • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
Parts List
NEBS Qualified Parts List
Part Number Qty Description
Add on Cards AOC-E810-XXVDA4 1 Intel E810-XXVDA4 PCIe 4-port 25GbE SFP28 Gen4x16, RoHS
AOC-STGF-I2S 1 Std LP 2-port 10G SFP+, Intel X710
GPU-NVTA100-40-PS 1 NVIDIA A100 40GB CoWoS HBM2 PCIe 4.0-- Passive Cool
AOC-S3908L-H8IR-16DD 1 Boardcom 3908L SAS controller
AOC-STG-I4S 1 Standard LP 4-port 10G SFP+
AOC-STG-I4T 1 PCIe Low Profile form factor, Quad 10GBase-T Ports (RJ45),
AOC-A100G-B2CM 1 AIOM Dual Port 100GbE QSFP28, based on Broadcom BCM57508 with 0.5U Bracket,RoHS
AOC-A25G-b2SM 1 AIOM 2-port 25GbE SFP28, Broadcom BCM57414 with 0.5U bracket,RoHS
CPU P4X-ICX6338T-SRKXF 2 ICX 6338T 2P 24C/48T 2.1G 36M 11.2GT 165W 4189 M1
Memory MEM-DR432L-SL02-ER32 • 4 Samsung 32GB DDR4-3200 ECC RDIMM
MEM-DR464L-SL01-ER32 • 4 Samsung 64GB DDR4-3200 ECC RDIMM
MEM-DR416L-SL02-ER32 • 4 Samsung 16GB DDR4-3200 ECC RDIMM
MEM-DR432L-HL03-ER32 • 4 Hynix 32GB DDR4-3200 ECC RDIMM
MEM-DR464L-HL02-ER32 • 4 Hynix 64GB DDR4-3200 ECC RDIMM
MEM-DR432L-CL05-ER32 • 4 Micron 32GB DDR4-3200 ECC RDIMM
MEM-DR464L-CL03-ER32 • 4 Micron 64GB DDR4-3200 ECC RDIMM
MEM-DR416L-CL06-ER32 • 4 Micron 16GB DDR4-3200 ECC RDIMM
Storage HDS-X2A-XS800ME70045 1 Seagate 2.5" LangeBP 800GB SAS 12Gb/s,15mm,10DWPD SSD,HF
HDS-M2T-MTFDDAK960TDS1AW 1 Micron 5300 PRO 960GB, SATA, 2.5", 3D TLC, 1.5DWPD
HDS-S2T1-MZ7LH960HAJR05 1 Samsung PM883 960GB SATA 6Gb/s V4 TLC 2.5" 7mm (1.3 DWPD)
HDS-I2T0-SSDSC2KG480G8 1 Intel D3-S4610 480GB SATA 6Gb/s 3D TLC 2.5" 7mm 3DWPD Rev.2
HDS-IUN0-SSDPE2KE032T8 1 Std LP 2-port 10G SFP+, Intel X710
HDS-SUN1-MZQLB960HAJR07 1 Samsung PM983 960GB NVMe PCIe3x4 V4 TLC 2.5" 7mm (1.3 DWPD)
HDS-SMN1-MZ1LB960HAJQ07 1 Samsung PM983 960GB NVMe PCIe3x4 V4 M.2 22x110mm (1.3 DWPD)
HDS-IMT0-SSDSCKKB960G8 1 Intel D3 S4510 960GB M.2 SATA 6Gb/s 3D TLC 22x80mm 1DWPD
TPM security module AOM-TPM-9670V-S-P 1 SPI capable vertical TPM 2.0 provisioned for server,RoHS
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