SuperServer AS -2015A-TR

AS -2015A-TR Main AS -2015A-TR Angle AS -2015A-TR Top AS -2015A-TR Front AS -2015A-TR Rear
Integrated Board: H13SAE-MF
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Key Applications

  • Designed for financial companies
  • AMD Xilinx Solarflare X2 and X3 Ethernet adapters validated

Key Features

  1. AMD Ryzen™ 7000 Series LGA1718 up to 170W TDP Processors
  2. 4x DDR5 UDIMM Slots, ECC/Non-ECC DDR5-5200 Up to total 128GB
  3. 2x PCIe 5.0 x16 (FHHL) slots (16/NA or 8/8)
  4. 2x 1GbE LAN (Intel® I210-AT)
    IPMI 2.0 + KVM with Dedicated LAN (1GbE)
  5. 800W High-Efficiency Power Supply Titanium Level Certified
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Specifications Resources Parts List
Specifications
Product SKUs
A+ Server AS -2015A-TR (Black)
Motherboard
Super H13SAE-MF
Processor
CPU
  • Single processor(s)
Core Count
  • Up to 16C/32T
Note
  • Supports 60W - 170W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 2 double-width GPU(s)
System Memory
Memory
  • Memory Capacity: 4 DIMM slots
  • Up to 128GB: 4x 32 GB DRAM
  • Memory Type: 5200/4800/3600MHz ECC DDR5 UDIMM
Memory Voltage
  • 1.1 V
Error Detection
  • ECC/Non-ECC
On-Board Devices
Chipset
  • AMD B650
Network Connectivity
  • 1x 1GbE BaseT with Realtek RTL8211F PHY (dedicated IPMI)
  • 2x 1GbE BaseT with Intel® I210-AT
Input / Output
SATA
  • 4 SATA (6Gbps) port(s)
USB
  • 6 USB port(s) (1 rear; 2 rear; 3 rear)
Video
  • 1 VGA port(s)
  • 1 HDMI port(s)
  • 1 DisplayPort (s)
Serial Port
  • 1 COM Port(s) (1 rear)
TPM
  • TPM header
System BIOS
BIOS Type
  • AMI 32MB SPI Flash
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
Voltage
  • +1.0V PCH, +1.8V PCH, +12V, +3.3V, +5V, +5V standby, 1.05 (PCH), 3.3V standby, 5 (4-pin), CPU, CPU temperature, CPU thermal trip support, PCH temperature, System temperature, VBAT, VRM
FAN
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, Monitoring for CPU and chassis environment, PECI
Other Features
  • 8-pin 12v DC power connector, ACPI power management, ATX Power connector, Chassis intrusion header, Control of power-on for recovery from AC power loss, CPU thermal trip support for processor
Chassis
Form Factor
  • 2U
Model
Dimensions and Weight
Height
  • 3.5" (89mm)
Width
  • 17.2" (437mm)
Depth
  • 25.5" (647mm)
Package
  • 11.4" (H) x 26.7" (W) x 34.5" (D)
Weight
  • Net Weight: 37 lbs (16.78 kg)
  • Gross Weight: 52 lbs (23.59 kg)
Available Color
  • Black
Front Panel
Buttons
  • Power On/Off button
  • System Reset button
LEDs
  • HDD activity LED
  • Network Activity LEDs
  • Power Fail LED
  • Power status LED
  • System Information LED
Expansion Slots
PCI-Express (PCIe)
  • 2 PCIe 5.0 x16 slot(s)
  • 1 PCIe 4.0 x4 slot(s)


  • (Slot#6 and Slot#4 can be configured as 16/NA or 8/8)
Drive Bays / Storage
Drive Bays
  • 4x 3.5" SATA drive bays (or up to 8x 3.5"/2.5" SATA/SAS drive bays via optional RAID AOC)
M.2
  • 2x NVMe (PCIe 5.0x4)
  • M-Key, 2280/22110
System Cooling
Fans
  • 3x 80mm Fan(s)
Power Supply
800W Redundant Titanium Level power supplies
Dimension

(W x H x L)
  • 76 x 40 x 336 mm
AC Input
  • 800W: 100-240Vac / 50-60Hz
  • 800W: 200-240Vdc / 50-60Hz
+12V
  • Max: 66A / Min: 0A (100Vac-240Vac)
  • Max: 66A / Min: 0A (200Vdc-240Vdc)
5V SB
  • Max: 4A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level94%+   Titanium Level

 


  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)


Resources
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-H13SAE-MF

CSE-825TQC-R802LPB
1

1
Super H13SAE-MF Motherboard

2U Chassis
Backplane BPN-SAS3-825TQ 1 8-port 2U SAS3 12Gbps TQ backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD
Cable CBL-0186L 1 SATA SET OF 4-56/45.5/35/23CM ROUND S-RA
CBL-0071L 1 ROUND 16 TO 16 PIN RIBBON FP CABLE 30"L, LF
CBL-PWCD-0160-IS 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,16AWG,RoHS/REACH
CBL-PWEX-1078 3 PWEX,FAN,1X4/P2.5 TO 1X4/P2.54,20CM,22AWG,5A/PIN,RoHS
Parts MCP-260-00185-0B 1 STD I/O Shield for H13SAE-MF with EMI Gasket & Black Mylar
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0094AP4 1 2U Active CPU Heat Sink for AMD Socket AM5 Systems
*Power Supply PWS-802A-1R 2 1U 800W 100-240Vac/47-63Hz, and DC240 input
*Power Distributor PDB-PT825-8824 1 SC825 24PIN REDUNDANT POWER DISTRIBUTOR
*Fan FAN-0181L4 3 80x80x38 mm, 9.4K RPM, Hot-swappable Middle Cooling Fan for X11 Purley Platform Newly Enabled 2U+ Chassis
*Front Panel FPB-FP836-D 1 Front control board Dual color LED(FP836-D)forSC823M,825,825M,828,829,835,836
*Drive Tray(s) MCP-220-00023-01 1 Black USB dummy tray support 1x 2.5" slim HDD for SC825, 836
MCP-220-00075-0B 8 Black gen 5.5 hot-swap 3.5" HDD tray
MCP-220-82502-0B 2 Black fixed 3.5\" HDD tray or FDD dummy tray
*Rear Window MCP-240-82506-0N 1 LP Rear Window for SC825,825M,826,213,216
*Peripheral Drive MCP-290-00007-01 1 Black DVD dummy cover for SC825, 836
*Rail Set MCP-290-00053-0N 1 Rail set, quick/quick, default for 2,3U 17.2"W
MCP-290-00060-0N 1 Threaded rail adapter default for round hole rack
*Air Shroud MCP-310-29001-0N 1 SC825/826/216/213 Intel DP X9,X8 air shroud 13.68x13/12x13
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
2.5" Drive Tray MCP-220-00043-0N 1 Black hot-swap gen 4 3.5 to 2.5 HDD tray
TPM AOM-TPM-9670V 1 SPI TPM 2.0
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