H12SSFF-AN6 (For A+ Server Only)
  A+ Products  Motherboards   [ H12SSFF-AN6 ]
H12SSFF-AN6
Key Features
1. Single AMD EPYC™ 7003/7002 Series Processor
(7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
2. 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
3. Expansion slots:
1 PCI-E 4.0 x16 Right Riser Slot
1 PCI-E 4.0 x16 Left Riser Slot
1 PCI-E 4.0 x16 AIOM LAN Networking Slot
M.2 Interface: 2 SATA/PCI-E 4.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-key
4. 12 SATA3, 2 M.2, 1 SuperDOM
5. Dedicated IPMI 2.0 LAN
6. ASPEED AST2600 BMC graphics
7. 2 USB 3.0 ports (front)
8. 3x 4-pin PWM Fans & Speed control

Links & Resources
Tested Memory List
Tested HDD List
Tested M.2 List
Tested AOC List
Motherboard Manual
Update Your BIOS
IPMI Firmware
Download the Latest Drivers and Utilities
Download Driver CD
OS Compatibility

   

Product SKUs
MBD-H12SSFF-AN6
  • H12SSFF-AN6 (for server SKUs only)
 
Physical Stats
Form Factor
  • Proprietary FatTwin™
Dimensions
  • 8.441" x 18.724"
 
Processor/Chipset
CPU
  • Single AMD EPYC™ 7003/7002 Series Processor
    (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
  • Socket SP3
Cores
  • Up to 64 Cores
Chipset
  • System on Chip
 
System Memory
Memory Capacity
  • 16 DIMM slots
  • Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
  • 8-channel memory bus
Memory Type
  • DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
DIMM Sizes
  • 8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
 
On-Board Devices
SATA
  • SATA3 (6 Gbps)
IPMI
  • Support for Intelligent Platform Management Interface v. 2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2600 BMC
Network Controllers
  • 1 PCI-E 4.0 x16 AIOM LAN Networking Slot
  • ATEN IPMI (Dedicated) from ASPEED AST2600 BMC
VGA
  • ASPEED AST2600 BMC
 
Input / Output
SATA
  • 12 SATA3 (6 Gbps) ports
NVMe
  • 2 internal NVMe ports
LAN
  • Provided via AIOM
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (front)
VGA
  • 1 VGA port (front)
Others
  • 1 COM port (header)
  • 1 SuperDOM power connector
  • 1 TPM 1.2/2.0 header
 
Expansion Slots
PCI-Express
  • 1 PCI-E 4.0 x16 Right Riser Slot
  • 1 PCI-E 4.0 x16 Left Riser Slot
  • 1 PCI-E 4.0 x16 AIOM LAN Networking Slot
M.2
  • Interface: 2 SATA/PCI-E 4.0 x4
  • Form Factor: 2260, 2280, 22110
  • Key: M-key
Chassis ( Optimized for H12SSFF-AN6)
4U
  • SCF418IF4-R2K20BP
 
Server(s) (with H12SSFF-AN6)
Model(s)
 
System BIOS
BIOS Type
  • AMI 256Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 5.1
  • USB Keyboard Support
  • SMBIOS 3.1.1
 
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
 
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +1.5V, +1.8V, +12V, +5V, +5V standby
  • CPU switching voltage regulator
FAN
  • Up to 3 fan status tachometer monitoring
  • Up to 3x 4-pin fan headers
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 3x Fan connectors
  • I²C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
 
Operating Environment / Compliance
Environmental Specifications
  • Operating Temperature:
       10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
Retail Pack List
  Part Number Qty Description
H12SSFF-AN6 MBD-H12SSFF-AN6 -O 1 H12SSFF-AN6 Motherboard
Optional Parts List
  Part Number Qty Description
TPM security module AOM-TPM-9655V - TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF;
AOM-TPM-9665V - TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF;

Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
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