SuperServer 9029GP-TNVRT (Complete System Only)

  Products  Systems   GPU   [ 9029GP-TNVRT ]









Integrated Board


X11DPG-HGX2



Key Features

  - AI / Deep Learning

  - High-performance Computing

  - Autonomous Vehicle Technology

  - Supports 16 V100 SXM3 GPUs



1. Dual Socket P (LGA 3647) support

    Intel® Xeon® Scalable processors

    3 UPI up to 10.4GT/s
2. Up to 3TB 3DS ECC LRDIMM, up to

    DDR4-2666MHz; 24 DIMM slots
3. 16 PCI-E 3.0 x16 for RDMA via

    IB EDR; 2 PCI-E 3.0 x16 on board
4. Supports 16 V100 SXM3 350W GPUs

    with NVSwitch and NVLink
5. Dual 10GBase-T LAN with

    Intel® X540
6. 16 Hot-swap 2.5" NVMe drives,

    6 Hot-swap 2.5" SATA3 drive bays
7. 6x 80mm Hot-swap PWM Fans,

    8x 92mm Hot-swap Fans
8. 6x (5+1) 3000W Redundant Power

    Supplies; Titanium Level (96%+)


Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 512GB memory, 1 HDD, 16 GPUs installed).

Service: Due to complexity, OSNBD3 is highly recommended.


 Drivers & Utilities   BIOS   IPMI   Tested Memory  Tested M.2 List   NVMe Options   Manuals    OS Certification Matrix    Drive Options 


Product SKUs
SYS-9029GP-TNVRT
  • SuperServer 9029GP-TNVRT (Black)
 
Motherboard


Super X11DPG-HGX2
 
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • Intel® Xeon® Scalable Processors,

    3 UPI up to 10.4GT/s
  • Support CPU TDP 205W
Cores
  • Up to 28 Cores
GPU Support
  • Supports 16 V100 SXM3 350W
 
System Memory
Memory Capacity
  • 24 DIMM slots
  • Up to 3TB 3DS ECC L/RDIMM, up to DDR4-2666MHz
Memory Type
  • 2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
 
On-Board Devices
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps) with RAID 0, 1, 5, 10
Network Controllers
  • Dual Port 10GBase-T from Intel X540 Ethernet Controller
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output
SATA
  • 6 SATA3 (6Gbps) ports
LAN
  • 2 RJ45 10GBase-T LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (front)
Video
  • 1 VGA Connector
COM Port
  • 1 COM port (header)
 
System BIOS
BIOS Type
  • AMI 32Mb SPI Flash ROM
BIOS Features
Chassis
Form Factor
  • 10U Rackmountable
Model
  • CSE-1018G-R12KP
 
Dimensions
Height
  • 17.2" (437mm)
Width
  • 17.8" (452mm)
Depth
  • 27.75" (705mm)
Weight
  • Net Weight: 298 lbs (135 kg)
  • Gross Weight: 385 lbs (175 kg)
Available Colors
  • Black
 
Drive Bays / Storage
Hot-swap
  • 16 Hot-swap 2.5" NVMe drive bays *
  • 6 Hot-swap 2.5" SATA3 drive bays
M.2
  • M.2 Interface: 2 PCI-E 3.0 x4
  • Form Factors: 2280, 22110
  • Key: M-Key
Note * NVMe hot-swap feature doesn't work in Windows environment
 
Expansion Slots
PCI-Express
  • 16 PCI-E 3.0 x16 for RDMA via IB EDR
  • 2 PCI-E 3.0 x16 on motherboard
 
System Cooling
Fans
  • 6x 80mm Hot-swap PWM Fans
  • 8x 92mm Hot-swap Fans
 
Power Supply
6x 3000W Redundant Titanium Level Power Supplies with PMBus
Total Output Power
  • 2883W with Input 200 - 207Vac
  • 3000W with Input 208 - 240Vac
Dimension

(W x H x L)
  • 68 x 40 x 430 mm
Input
  • 50-60Hz
+12V
  • Max: 53.4A & Min: 0.3A (200-207Vac)
  • Max: 55.6A & Min: 0.3A (208-240Vac)
12Vsb
  • Max: 3A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level96%  Titanium Level

 
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:

       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:

       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:

       10% to 85% (non-condensing)
  • Non-operating Relative Humidity:

       5% to 95% (non-condensing)


See Parts List



Parts List - (Items Included)
 

Part Number

Qty

Description

Motherboard / Chassis MBD-X11DPG-HGX2

MBD-X11DPG-HGX2-SW

CSE-1018G-R12KP
1

2

1
Super X11DPG-HGX2 Motherboard

HGX2 PCIe switch board

CSE-1018G-R12KP Chassis
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Add-on Card / Module AOM-HGX2-NVL-P 12 HGX2 NVLINK board,HF,RoHS
Add-on Card / Module AOM-SBL-SAS3 1 AOM-SBL-SAS3
Backplane BPN-GPU-1018G 1 Midplane for 10U CSE-1018G HGX-2 project,RoHS
Riser Card RSC-G-66-HGX2 8 1U LHS Passive GPU RSC w/ 2 PCI-Ex16 slots HGX-2 sys,HF,Rohs
Riser Card RSC-G-A66 1 1U LHS Active GPU Riser card with two PCI-E x16 Slots,HF,RoH
Heatsink / Retention SNK-P0067PS 2 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0071VS 2 1U Proprietary Passive CPU Heat Sink (124 mm Long) for SYS-2029BZ-HNR Series Servers (X11 2U4N 3UPI Big Twin)
* Power Supply PWS-3K01G-1R 6 AC-DC 3000W, Titanium efficiency output: 54Vdc/55.6A, 12Vsb/
* Backplane BPN-PDB-1018G 1 54V PDB for 10U CSE-1018G HGX-2 project, support 6x Delta 54Vdc/3KW PSU, RoHS
* Cable 1 CBL-0223L 6 BLADE PWS POWER CORD C19 to C20, PBF. 1.8m. 12AWG, 20A, 250V
* FAN 1 FAN-0196L4 8 92x92x76 mm, 13.3K-12.2K RPM Counter-rotating Fan for HGX2 P
* FAN 2 FAN-0197L4 6 80x80x80 mm, 12K-11.3K RPM Counter-rotating Fan for HGX2 Pro
* Front Panel FPB-FP1018G 1 Front control board 4.59x2.59 inches for SC1018G,RoHS
* Drive Tray(s) MCP-220-00169-0B 6 Black hot swap tool-less 2.5
* Drive Tray(s) MCP-220-00170-0B 16 Black hot swap tool-less NVMe 2.5
* Rail Set MCP-290-41803-0N 1 Fat twin F418 / F424 Static Rail set support 28-33.5 inch depth rail,RoHS/REACH,PBF
* Parts MCP-620-00022-0N 6 Blade Server Front Blade Light Pipe for MB
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.




Optional Parts List
  Part Number Qty Description
Global Services & Support OS4HR3/2/1

OSNBD3/2/1
-

-
3/2/1-year onsite 24x7x4 service

3/2/1-year onsite NBD service
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Hide Parts List



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