SuperServer 9029GP-TNVRT (Complete System Only)

  Products  Systems   GPU   [ 9029GP-TNVRT ]

10U Dual Processor (Intel) System with Up to 16 NVIDIA V100 GPUs

Integrated Board


Views: | Top View (GPU) | Top View (CPU) | Top View (Switch) |
| Angled-Rear View | Angled-Front View | Front View | Rear View |


Key Applications
  - AI/ML, Deep Learning Training and Inference
  - Big Data Analytics
  - High-performance Computing (HPC)
  - Research Laboratory/National Laboratory
  - Autonomous Vehicle Technology


Key Features
1. Supports 16 NVIDIA® V100 SXM3
    350W GPUs with NVISwitch and NVLink
2. Optimized for NVIDIA® GPUDirect™ RDMA
3. Dual Socket P (LGA 3647) support
    Intel® Xeon® Scalable processors
    3 UPI up to 10.4GT/s
4. Up to 3TB 3DS ECC LRDIMM, up to
    DDR4-2933MHz; 24 DIMM slots
5. 16 PCI-E 3.0 x16 for RDMA via
    IB EDR; 2 PCI-E 3.0 x16 on board
6. Support 8 NVIDIA V100 with
    300GB/s NVLINK
7. Dual 10GBase-T LAN with
    Intel® X540
8. 16 Hot-swap 2.5" NVMe drives,
    6 Hot-swap 2.5" SATA3 drive bays
9. 6x 80mm Hot-swap PWM Fans,
    8x 92mm Hot-swap Fans
10. 6x (5+1) 3000W Redundant Power
    Supplies; Titanium Level (96%+)

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 512GB memory, 1 HDD, 16 GPUs installed).
Service: Due to complexity, OSNBD3 is highly recommended.

 Drivers & Utilities   BIOS   IPMI   Tested Memory  Tested M.2 List   Drive Options   NVMe Options   Manuals   OS Certification Matrix 

Product SKUs
  • SuperServer 9029GP-TNVRT (Black)

Super X11DPG-HGX2
  • Dual Socket P (LGA 3647)
  • Intel® Xeon® Scalable Processors,
    3 UPI up to 10.4GT/s
  • Support CPU TDP 205W
  • Up to 28 Cores
Supported GPUs
CPU-GPU Interconnect
  • PCI-E Gen 3 x16 Switch CPU-GPU Interconnect
GPU-GPU Interconnect
  • NVIDIA® NVLink™ with NVSwitch™ GPU-GPU Interconnect
System Memory
Memory Capacity
  • 24 DIMM slots
  • Up to 3TB 3DS ECC L/RDIMM, up to DDR4-2933MHz
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
On-Board Devices
  • Intel® C621 chipset
  • SATA3 (6Gbps) with RAID 0, 1, 5, 10
Network Controllers
  • Dual Port 10GBase-T from Intel X540 Ethernet Controller
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
  • 6 SATA3 (6Gbps) ports
  • 2 RJ45 10GBase-T LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
  • 2 USB 3.0 ports (front)
  • 1 VGA Connector
COM Port
  • 1 COM port (header)
System BIOS
  • AMI 32Mb SPI Flash ROM
BIOS Features
Form Factor
  • 10U Rackmountable
  • CSE-1018G-R12KP
  • 17.2" (437mm)
  • 17.8" (452mm)
  • 27.75" (705mm)
  • Net Weight: 298 lbs (135 kg)
  • Gross Weight: 385 lbs (175 kg)
Available Colors
  • Black
Drive Bays / Storage
  • 16 Hot-swap 2.5" NVMe drive bays *
  • 6 Hot-swap 2.5" SATA3 drive bays
  • M.2 Interface: 2 PCI-E 3.0 x4
  • Form Factors: 2280, 22110
  • Key: M-Key
Note * NVMe hot-swap feature doesn't work in Windows environment
Expansion Slots
  • 16 PCI-E 3.0 x16 for RDMA via IB EDR - supporting 16 V100 GPUs
  • 2 PCI-E 3.0 x16 on motherboard
System Cooling
  • 6x 80mm Hot-swap PWM Fans
  • 8x 92mm Hot-swap Fans
Power Supply
6x 3000W Redundant Titanium Level Power Supplies with PMBus
Total Output Power
  • 2883W with Input 200 - 207Vac
  • 3000W with Input 208 - 240Vac
(W x H x L)
  • 68 x 40 x 430 mm
  • 50-60Hz
  • Max: 53.4A & Min: 0.3A (200-207Vac)
  • Max: 55.6A & Min: 0.3A (208-240Vac)
  • Max: 3A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level96%  Titanium Level
Operating Environment
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       10% to 85% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

See Parts List

Parts List - (Items Included)
Part Number
Motherboard / Chassis MBD-X11DPG-HGX2
Super X11DPG-HGX2 Motherboard
HGX2 PCIe switch board
CSE-1018G-R12KP Chassis
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Add-on Card / Module AOM-HGX2-NVL-P 12 HGX2 NVLINK board,HF,RoHS
Add-on Card / Module AOM-SBL-SAS3 1 AOM-SBL-SAS3
Backplane BPN-GPU-1018G 1 Midplane for 10U CSE-1018G HGX-2 project,RoHS
Riser Card RSC-G-66-HGX2 8 1U LHS Passive GPU RSC w/ 2 PCI-Ex16 slots HGX-2 sys,HF,Rohs
Riser Card RSC-G-A66 1 1U LHS Active GPU Riser card with two PCI-E x16 Slots,HF,RoH
Heatsink / Retention SNK-P0067PS 2 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0071VS 2 1U Proprietary Passive CPU Heat Sink (124 mm Long) for SYS-2029BZ-HNR Series Servers (X11 2U4N 3UPI Big Twin)
* Power Supply PWS-3K01G-1R 6 AC-DC 3000W, Titanium efficiency output: 54Vdc/55.6A, 12Vsb/
* Backplane BPN-PDB-1018G 1 54V PDB for 10U CSE-1018G HGX-2 project, support 6x Delta 54Vdc/3KW PSU, RoHS
* Cable 1 CBL-0223L 6 BLADE PWS POWER CORD C19 to C20, PBF. 1.8m. 12AWG, 20A, 250V
* FAN 1 FAN-0196L4 8 92x92x76 mm, 13.3K-12.2K RPM Counter-rotating Fan for HGX2 P
* FAN 2 FAN-0197L4 6 80x80x80 mm, 12K-11.3K RPM Counter-rotating Fan for HGX2 Pro
* Front Panel FPB-FP1018G 1 Front control board 4.59x2.59 inches for SC1018G,RoHS
* Drive Tray(s) MCP-220-00169-0B 6 Black hot swap tool-less 2.5
* Drive Tray(s) MCP-220-00170-0B 16 Black hot swap tool-less NVMe 2.5
* Rail Set MCP-290-41803-0N 1 Fat twin F418 / F424 Static Rail set support 28-33.5 inch depth rail,RoHS/REACH,PBF
* Parts MCP-620-00022-0N 6 Blade Server Front Blade Light Pipe for MB
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.

Optional Parts List
  Part Number Qty Description
NVMe RAID 1 (Require Intel VROC Key) AOC-SLG3-2M2
Tested M.2 List
Low Profile PCI-E x8 add-on card supports 2 PCI-E 3.0 x4 M-Key M.2 NVMe Modules
NVMe M.2 Module
Network Card(s) AOC-MCX455A-ECAT-MLN - Mellanox ConnectX-4 VPI adapter card, EDR IB (100Gb/s) and 100GbE, single-port QSFP28, PCIe3.0 x16, tall bracket, ROHS R6
AOC-MCX456A-ECAT-MLN - Mellanox ConnectX-4 VPI adapter card, EDR IB (100Gb/s) and 100GbE, dual-port QSFP28, PCIe3.0 x16, tall bracket, ROHS R6
AOC-MCX515A-CCAT - Mellanox ConnectX-5 EN network interface card, 100GbE single-port QSFP28, PCIe3.0 x16, HF, RoHSket, HF, RoHS
AOC-MCX516A-CCAT - Mellanox ConnectX-5 EN network interface card, 100GbE dual-port QSFP28, PCIe3.0 x16, tall bracket, HF, RoHS
AOC-MCX555A-ECAT - Mellanox ConnectX-5 VPI adapter card, EDR IB (100Gb/s) and 100GbE, single-port QSFP28, PCIe3.0 x16, tall bracket, HF, RoHS
AOC-MCX556A-ECAT - Mellanox ConnectX-5 VPI adapter card, EDR IB (100Gb/s) and 100GbE, dual-port QSFP28, PCIe3.0 x16, tall bracket, HF, RoHS
TPM Security Module AOM-TPM-9670V 1 SPI capable vertical TPM 2.0 provisioned for client,RoHS
Global Services & Support OS4HR3/2/1
3/2/1-year onsite 24x7x4 service
3/2/1-year onsite NBD service
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Hide Parts List

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