SuperStorage 6019P-ACR12L

  Products  Systems   SuperStorage   [ 6019P-ACR12L ]







Integrated Board
Super X11DDW-NT


Views: | Angled View | Top View |

| Front View | Rear View |



Key Features

• High Density Storage

• Object Storage 1U

• Scale-out Storage

• Ceph / Hadoop

• Big Data Analytics


1. Dual Socket P (LGA 3647) support

    2nd Gen. Intel® Xeon® Scalable

    processors (Cascade Lake/Skylake)
2. 12 DIMMs; up to 3TB 3DS ECC

    DDR4-2933MHz RDIMM/LRDIMM,

    Supports Intel® Optane™ DCPMM††
3. 2 PCI-E 3.0 x16 slots,

    1 PCI-E 3.0 x8 LP slot,

    1 PCI-E 3.0 x4 NVMe M.2 slot
4. 12 Hot-swap 3.5" SAS3/SATA3, 4 Hot-

    swap 2.5" 7mm NVMe/SATA drive bays
5. 2x 10GBase-T ports via Intel C622
6. IPMI 2.0 + KVM with Dedicated LAN
7. 1 VGA, 4 USB 3.0 (rear)
8. Internal Cable Arm
9. 600W Redundant Power Supplies

    Platinum Level Certified


 Drivers & Utilities   BIOS   IPMI   Tested Memory  Tested M.2 List   NVMe Options   Manuals    OS Certification Matrix    Drive Options 


Product SKUs
SSG-6019P-ACR12L
  • SuperStorage 6019P-ACR12L (Black)
 
Motherboard


Super X11DDW-NT
 
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake),

    Dual UPI up to 10.4GT/s
  • Support CPU TDP up to 205W†††
Cores
  • Up to 28 Cores
Note BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors

††† 205W CPU support for high performance up to 32°C. 75W-165W CPU support from 10°C ~ 35°C.
 
System Memory
Memory Capacity
  • 12 DIMM slots
  • Up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM††
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro

†† Cascade Lake only. Contact your Supermicro sales rep for more info.
 
On-Board Devices
Chipset
  • Intel® C622 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
SAS
  • Broadcom 3224 SAS3 IT mode controller
Network Controllers
  • Dual LAN with 10GBase-T from Intel C622
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video
  • ASPEED AST2500 BMC
 
Input / Output
LAN
  • 2 RJ45 10GBase-T LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 4 USB 3.0 ports (rear)
  • 2 USB 2.0 ports (front)
Video
  • 1 VGA port
TPM
  • 1 TPM Header
 
System BIOS
BIOS Type
  • UEFI 256Mb
 
Management
Software
Power Configurations
  • ACPI / APM Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-802TS-R606WBP
 
Dimensions and Weight
Width
  • 17.6" (447mm)
Height
  • 1.7" (43mm)
Depth
  • 37.40" (950mm)**
Weight
  • Net Weight: 65 lbs (29.5 kg)
  • Gross Weight: 80 lbs (36.3 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • System Reset button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
 
Expansion Slots
PCI-Express
  • 2 PCI-E 3.0 x16 slots
  • 1 PCI-E 3.0 x8 LP slot
  • 1 PCI-E 3.0 x4 NVMe M.2 slot
 
Drive Bays
Hot-swap
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays
  • 4 Hot-swap 2.5" 7mm NVMe/SATA drive bays
 
System Cooling
Fans
  • 6x 40x40x56mm 20.5K-17.6K RPM Counter-rotating fans
 
Power Supply with Power Distributor
600W Redundant Power Supplies with PMBus
Total Output Power
  • 600W
Dimension

(W x H x L)
  • 54.5 x 40 x 220 mm
Input
  • 100-240V, 50-60Hz, 7.5-3.5A
+12V
  • Max: 50A / Min: 0.5A
+5Vsb
  • Max: 3A / Min: 0A
Output Type
  • Gold Finger Connector Mating with Molex 45984-4343
Certification Platinum Level Certified    Platinum Certified

  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:

       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:

       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:

       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:

       5% to 95% (non-condensing)


See Parts List



Parts List - (Items Included)
 

Part Number

Qty

Description

Motherboard / Chassis MBD-X11DDW-NT

CSE-802TS-R606WBP
1

1
Super X11DDW-NT Motherboard

1U Chassis
Add-on Card / Module AOM-S3224-L-P 1 Mezzanine SAS 3224 I/O Controller,HF,RoHS
Backplane BPN-NVME3-802N-S4 1 4-Port Hybrid Backplane Supports 4 x 2.5
Backplane BPN-SAS3-802A 3 4-Port Backplane Supports 4x3.5
Backplane BPN-SAS3-802A-1 3 4-Port Backplane Supports 4 x 3.5" SATA3/SAS3 HDD,HF,RoHS
Cable 1 CBL-0174L 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,14AWG,15A,125V,RoHS/REACH
Cable 2 CBL-PWCD-0174-IS 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,14AWG,RoHS/REACH
Cable 3 CBL-PWEX-1056 1 BPN PWR,2P/P3.0 to 3P/P3.0, 12V, 60CM,18AWG, 6A/pin, -20~80C, RoHS
Cable 4 CBL-SAST-0830 4 OcuLink v 1.0,INT,PCIe NVMe SSD,Passive Latch, 80
Cable 5 CBL-SAST-0831 1 OcuLink v 1.0,INT,PCIe NVMe SSD, Passive Latch, to MiniSAS 95CM,32AWG
Cable 6 CBL-SAST-1018 1 SLIMLINE SAS, INT,Passive Latch,166CM, 160CM, 154CM, power 160CM CABLE KIT
Parts MCP-150-00015-0B 2 Rubber pad, 3.0mm H, 10x10mm
Riser Card RSC-R1UW-2E16 1 1U LHS WIO Riser card with two PCI-E x16 slots
Riser Card RSC-R1UW-E8R 1 1U RHS WIO Riser card with one PCI-E x8 slot
Heatsink / Retention SNK-P0067PS 2 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
* Power Supply PWS-606P-1R 2 1U 600W Redundant Short Depth High Efficiency Power Supply
* Power Distributor PDB-PT802-8824 1 1U Power Distributor Board for SC802 support up to 800W.,RoH
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.




Optional Parts List
  Part Number Qty Description
Network Card(s) AOC-SGP-i2

AOC-SGP-i4

AOC-SG-i2

AOC-SG-i4

AOC-STG-b4S

AOC-STGN-i2S

AOC-STGN-i1S

AOC-STG-i2T

AOC-STG-i2
-

-

-

-

-

-

-

-

-
Standard LP, 2x GbE RJ45, PCI-E x4, Intel® i350AM2

Standard LP, 4x GbE RJ45, PCI-E x4, Intel® i350

Standard LP, 2x GbE RJ45, PCI-E x4, Intel® 82575EB

Standard LP, 4x GbE RJ45, PCI-E x4, Intel® 82576EB

Standard LP, 4x 10GbE SFP+, PCI-E x8, Broadcom® BCM57840S

Standard LP, 2x 10GbE SFP+, PCI-E x8, Intel® 82599ES

Standard LP, 1x 10GbE SFP+, PCI-E x8, Intel® 82599ES

Standard LP, 2x 10GbE RJ45, PCI-E x8, Intel® X540

Standard LP, 2x 10GbE CX4, PCI-E x8, Intel® 82598EB
Global Services & Support OS4HR3/2/1

OSNBD3/2/1
-

-
3/2/1-year onsite 24x7x4 service

3/2/1-year onsite NBD service
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Hide Parts List



* Redundant Power supply supported on configurations up to 600W, >600W configurations dual/balanced mode is utilized.

* 205W processor supported with 20.5K RPM fans installed.

** System depth 37.4" from Rack ear to chassis rear end.

Information in this document is subject to change without notice.

Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.