Key Applications / Features
- Mission-critical applications
- High Availability Storage Appliance Platform
Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
3. 2 PCI-E 3.0 x16 slots4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN5. 4 Hot-swap 2.5" SATA3 drive bays6. 2 SuperDOM onboard or optional
2 M.2 carrier7. Up to 1000W Redundant Power Supplies Titanium Level (96%)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡, Dual UPI up to 10.4GT/s
Support CPU TDP 70-145W (Consult with SYS PM for higher CPU TDP Supports)
Cores
Up to 28 Cores
Note
*Processors ending N or S are optimized for networking and storage applications. Customer need POC their application and observe any thermal throttling before large deployment.
Note
‡
BIOS version 3.2
or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
(per Node)
Memory Capacity
16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Memory Type
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note
† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
On-Board Devices (per Node)
Chipset
Intel® C621 chipset
SATA
SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
Barebones and Complete System must have at least one
SIOM
card installed per node
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
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Titanium Level
