SuperServer 6029TR-HTR

  Products  Systems   [ 6029TR-HTR ]









Integrated Board
Super X11DPT-L


Views: | Angled View | Node View |

| Front View | Rear View |



Key Features

  - HPC

  - Data Center

  - Enterprise Server

  - Finanical Analysis

  - Mission-critical applications



Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support

    2nd Gen. Intel® Xeon® Scalable

    processors (Cascade Lake/Skylake)
2. 8 DIMMs; up to 2TB 3DS ECC

    DDR4-2933MHz RDIMM/LRDIMM
3. 1 PCI-E 3.0 x16 (LP) slot
4. Dedicated IPMI 2.0 LAN
5. 3 Hot-swap 3.5" SATA3 drive bays
6. 2 SATA DOM + 1 SATA/NVMe

    M.2 (22110/2280)
7. Up to 1600W Redundant Power Supplies

    Titanium Level (96%)


 Drivers & Utilities   BIOS   IPMI   Tested Memory  Tested M.2 List   Manuals    OS Certification Matrix    Quick-References Guide  Drive Options   Network Card (AOC) Matrix


Product SKUs
SYS-6029TR-HTR
  • SuperServer 6029TR-HTR (Black)
 
Motherboard (Four per System)


Super X11DPT-L
 
Processor/Cache (per Node)
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake),

    Dual UPI up to 10.4GT/s
  • Support CPU TDP 70-140W
Cores
  • Up to 22 Cores
Note BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
 
System Memory (per Node)
Memory Capacity
  • 8 DIMM slots
  • Up to 2TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro

 
On-Board Devices (per Node)
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5 support
Network Controllers
  • Intel® C621 chipset
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output (per Node)
SATA
  • 3 SATA3 (6Gbps) ports
LAN
  • 2 RJ45 Gigabit Ethernet LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports total (rear)
VGA
  • 1 VGA port
Serial Port / Header
  • 1 COM Port (1 rear)
Others
  • TPM 2.0 Header
 
System BIOS
BIOS Type
  • AMI 32Mb SPI Flash ROM with UEFI
 
Management
Software
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-827HQ-R1K68BP3
 
Dimensions and Weight
Width
  • 17.25" (438mm)
Height
  • 3.47" (88mm)
Depth
  • 28.5" (724mm)
Weight
  • Gross Weight: 73.5 lbs (33.34kg)
  • Net Weight: 52.1 lbs (23.63kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
 
Expansion Slots (per Node)
PCI-Express
  • 1 PCI-E 3.0 x16 Low-profile slot
 
Drive Bays / Storage (per Node)
Hot-swap
  • 3 Hot-swap 3.5" SATA3 HDD trays
Others
  • 2 SATA DOM
  • 1 PCI-E 3.0 x4 NVMe or 1 SATA M.2 (22110/2280) support via BPN-ADP-6SATA3M2-1UL



    * M.2 and SuperDOM are for OS boot
 
System Cooling
Fans
  • 4x 8cm heavy duty PWM fans with optimal fan speed controlled
 
Power Supply (76mm Width)
1600W 1U Redundant Power Supplies with PMBus
Total Output Power
  • 800W: 100 – 140Vac
  • 1600W: 180 – 240Vac
Dimension

(W x H x L)
  • 76 x 40.4 x 336 mm
Input
  • 100-140Vac / 10-7A / 50-60Hz
  • 180-240Vac / 11-8A / 50-60Hz
+12V
  • Max: 67A / Min: 0A (100-140Vac)
  • Max: 133A / Min: 0A (180-240Vac)
+5Vsb
  • Max: 1A / Min: 0A
Output Type
  • 27 Pairs Gold Finger Connector
Certification Titanium Level Certified96%  Titanium Level

  [ Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:

       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:

       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:

       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:

       5% to 95% (non-condensing)


See Parts List



Parts List - (Items Included)
 

Part Number

Qty

Description

Motherboard / Chassis MBD-X11DPT-L

CSE-827HQ-R1K68BP3
4

1
Super X11DPT-L Motherboard

2U Chassis
Backplane BPN-ADP-6SATA3M2-1UL 4 6 x SATA3 with 6Gb/s,onboard 1 x M.2 . 22x80 mm and 22x110 mm,HF,RoHS
Backplane BPN-SAS2-827HQ2 1 2U 12-Port 4-Node 6Gbps Backplane Supports 3x3.5
Cable 1 CBL-PWCD-0900 2 PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17AWG
Air Shroud MCP-310-82722-0B 4 SC827HQ mylar air shroud for on MBD-X11DPT-L-P
Manual MNL-2163-QRG 1 6029TR-HTR Quick Reference Guide
Riser Card RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention SNK-P0067PS 4 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0067PSM 4 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Power Supply PWS-1K68A-1R 2 1U 1600W Redundant Titanium Power Supply 76mm width 27Pair,PBF
FAN 1 FAN-0162L4 4 80x80x38 mm, 13.5K RPM, HCP, LMV, and LPC Cooling Fan,RoHS/REACH




Optional Parts List
  Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
Hot-swap 3.5" to 2.5" Hard Disk Drive Tray MCP-220-00043-0N - Black Hot-swap gen 4 3.5" to 2.5" HDD tray
Global Services & Support OS4HR3/2/1

OSNBD3/2/1
-

-
3/2/1-year onsite 24x7x4 service

3/2/1-year onsite NBD service
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Hide Parts List



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