SuperServer AS -2015CS-TNR (Complete System Only)

Integrated Board: H13SSW
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Key Applications

  • Web Server, Firewall Application
  • Data Center Optimized, Value IaaS
  • Cloud Computing, Compact Server
  • DNS & Gateway Servers, Firewall Application
  • CDN, Edge Nodes

Key Features

  1. Single 4th Generation AMD EPYC™ 9004 Series Processors
  2. 12 DIMM slots up to 3TB 3DS ECC RDIMM DDR5-4800MHz 
  3. 2 PCI-E 5.0 x16 FHFL
    2 PCI-E 5.0 x16 FHHL
  4. Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
  5. 12x 3.5/2.5" hot-swap hybrid NVMe/SATA/SAS drive bays
  6. 3 heavy duty fans with optimal fan speed control, 1 air shroud
  7. 1200W redundant Titanium level 100-240Vac and 200-240 Vdc power supplies
    (*Full redundancy based on configuration and application load)
  8. 2 On-board PCI-E 3.0 x2 M.2 NVMe 80mm/110mm (Boot)
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Specifications Resources Parts List
Specifications
Product SKUs
A+ Server AS -2015CS-TNR (Black front & sliver body)
Motherboard
Super H13SSW
Processor
CPU
  • Single Socket SP5
  • 4th Generation AMD EPYC™ 9004 Series Processor
  • Support CPU TDP up to 360W *
  • (Support CPU cTDP up to 400W)
Cores
  • Up to 96C/192T
Note
  • *Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
System Memory
Memory
  • Memory Capacity: 12 DIMM slots
  • Up to 3TB: 3DS ECC Registered RDIMM, DDR5-4800MHz
  • Memory Type: 4800MHz ECC DDR5 RDIMM (3DS) Up to 256GB of memory
Note
  • For optimal performance AMD recommends full memory population
Memory Voltage
  • 1.1 V
Error Detection
  • Corrects single-bit errors Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset
  • System on Chip
Network Connectivity
  • Via Slim-AIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 port(s) (2 rear)
Video
  • 1 VGA port(s)
Serial Port
  • 1 COM Port(s) (1 rear)
System BIOS
BIOS Type
  • AMI 32MB SPI FLASH ROM
BIOS Features
  • ACPI 6.4
  • Plug and Play (PnP)
  • SMBIOS 3.5 or later
  • UEFI 2.8
  • USB Keyboard support
Management
Software
  • IPMIView for Linux/ Windows
  • IPMICFG
  • SSM
  • SPM
  • SUM
  • Watch Dog
  • SuperDoctor® 5
Power Configurations
  • Power-on mode control for AC power loss recovery
  • ACPI Power Management
PC Health Monitoring
Voltage
  • System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-LA26TS-R1K23AWP1
Dimensions and Weight
Height
  • 3.5" (89mm)
Width
  • 17.2" (437mm)
Depth
  • 25.5" (648mm)
Package
  • 11.4" (H) x 26.7" (W) x 34.5" (D)
Weight
  • Net Weight: 33 lbs (15 kg)
  • Gross Weight: 59 lbs (26.76 kg)
Available Color
  • Black front & sliver body
Front Panel
Buttons
  • Power On/Off
  • Universal Information (UID)
LEDs
  • Drive activity
  • Network activity
  • Power status
  • Universal Information (UID)
Expansion Slots
PCI-Express (PCI-E)
  • 2 Gen5 x16 FHFL slot(s)
  • 2 Gen5 x16 FHHL slot(s)
  • 2 PCI-E 5.0 x16 AIOM Slot slot(s)
Drive Bays / Storage
Hot-swap
  • 12x 3.5" hot-swap NVMe/SATA/SAS drive bays (12x 3.5" NVMe hybrid; 12x 3.5" NVMe dedicated)
M.2
  • 2x NVMe (PCIe Gen 3x2, Boot drive only)
  • M-Key, 2280/22110
System Cooling
Fans
  • 3x 8cm heavy duty fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud(s)
Power Supply
1U 800W/ 860W Redundant Power Supply
Dimension

(W x H x L)
  • 54.5 x 40.25 x 322 mm
AC Input
  • 800W: 100-127Vac / 9A-7.5A / 50-60Hz
  • 860W: 200-240Vac / 6A-4.5A / 50-60Hz
+12V
  • Max: 66.6A / Min: 0A (100Vac-127Vac)
  • Max: 71.6A / Min: 0A (200Vac-240Vac)
5V SB
  • Max: 4A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Platinum Level Certified94%+   Platinum Level

 


  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
Note
  • Operating Temperature based on configurations


Resources
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-H13SSW

CSE-LA26TS-R1K23AWP1
1

1
Super H13SSW Motherboard

2U Chassis
Backplane BPN-NVME5-LA26A-S12 1 2U 12-Slot 3.5" SATA3/SAS3/NVMe5 Hybrid Backplane
Cable CBL-MCIO-1227EQS4 1 [NR]MCIO X8/STR+pTab to SlimSAS X4/STR+pTab,27CM,32AWG,RoHS
CBL-MCIO-1243S4Y 1 [NR] (MCIO x8 to 2 SlimSAS x4), STR, 43cm, 85Ohm, RoHS,RoHS
CBL-MCIO-1339M5R 4 [NR] MCIO x8 (STR to RA),39CM,32AWG,RoHS
CBL-PWCD-0160-IS 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,16AWG,RoHS/REACH
Riser Card RSC-D2-666G5 1 2U LHS DCO Riser card with three PCI-E 5.0 X16 slots,HF,
RSC-D2R-666G5 1 2U RHS DCO Riser card with three PCI-E 5.0 X16 slots,HF,
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0083P 1 2U Passive CPU Heat Sink for AMD Socket SP5 Processors, RoHS
*Power Supply PWS-1K23A-1R 2 AC-DC 1200W, Titanium Level, Redundancy, 1U, PMBUS 1.2, +12V/+5Vsb, 336x76x40 mm,HF,RoHS/REACH
*Power Distributor PDB-PT826-S4824 1 Based on PDB-PT826-8824 to add 2pcs 8pin for option support
*Fan FAN-0206L4 3 80x80x38 mm, 13.5K RPM, Middle Cooling Fan for 2U and above Servers
*Drive Tray(s) MCP-220-00184-0B 12 Black gen-9 tool-less cost-effective 3.5
MCP-290-82607-0N 1 826B/216B rear dummy cover for 2 X 2.5
*Rear Window MCP-240-00170-0N 1 2U X12 WIO rear window for SCLA26
*Rail Set MCP-290-00053-0N 1 Rail set, quick/quick, default for 2,3U 17.2";W
*Air Shroud MCP-310-82619-0B 1 Sponge air Block sets for CSE-826B and LA26-AW
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
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