SuperServer SYS-221H-TN24R (Complete System Only)

SYS-221H-TN24R Main SYS-221H-TN24R Angle SYS-221H-TN24R Top SYS-221H-TN24R Front SYS-221H-TN24R Rear
Integrated Board: X13DEM
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Key Applications

  • Virtualization
  • Software-defined Storage
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server

Key Features

  1. Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors
  2. 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800
  3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards
  4. Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. 24x 2.5" hot-swap NVMe/SATA/SAS drive bays;
    2x internal M.2 NVMe/SATA drive slots;
    Optional RAID support via storage add-on card
  6. 4 heavy duty hot-swap fans with optimal fan speed control
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Specifications Resources Parts List
Specifications
Product SKUs
SuperServer SYS-221H-TN24R
Motherboard
Super X13DEM
Processor
CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
  • Supports up to 350W TDP CPUs (Liquid Cooled)​
GPU
Max GPU Count
  • Up to 4 double-width or 4 single-width GPU(s)
Supported GPU
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • PCIe
System Memory
Memory
  • Memory Capacity: 32 DIMM slots
  • Up to 8TB: 32x 256 GB DRAM
  • Memory Type: 4800MHz ECC DDR5
Memory Voltage
  • 1.1 V
Error Detection
  • ECC
On-Board Devices
SATA
  • SATA3 (6Gbps); RAID 0/1/5/10 support
NVMe
  • NVMe; RAID 0/1/5/10 support (Intel® VROC RAID Key required)
Chipset
  • Intel® C741
Network Connectivity
  • 2x 1GbE BaseT with Intel® i350-AM2 (optional)
  • 4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional)
  • 2x 10GbE BaseT with Intel® X550-AT2 (optional)
  • 2x 10GbE SFP+ with Intel® X710-BM2 (optional)
  • 4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
  • 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
  • 2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
  • 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)
  • 2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 Dedicated BMC LAN port
USB
  • 2 USB 2.0 port(s) (2 rear)
Video
  • 1 VGA port(s)
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
Management
Software
Power Configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-HS219-R1K63P
Dimensions and Weight
Height
  • 3.5" (88.9mm)
Width
  • 17.2" (437mm)
Depth
  • 29.9" (760mm)
Package
  • 10.4" (H) x 23.8" (W) x 43.6" (D)
Weight
  • Net Weight: 40 lbs (18.2 kg)
  • Gross Weight: 66 lbs (30 kg)
Available Color
  • N/A
Front Panel
Buttons
  • Power On/Off 
  • UID button
LEDs
  • HDD activity
  • LAN1 activity
  • Power
  • System information
Expansion Slots
PCI-Express (PCIe)
  • 4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s)
  • 4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s)
Note
  • For 16 NVMe configurations, PCIe slots 1,2 and AIOM slot A2 cannot be used.
  • For 24 NVMe configurations, PCIe slots 1,2,5,6 and AIOM slot A2 cannot be used.
Drive Bays / Storage
Hot-swap
  • 24x 2.5" hot-swap NVMe/SATA/SAS drive bays (NVMe, SATA, or SAS support requires additional parts. Please see the Optional Parts list.)
M.2
  • 2 M.2 NVMe OR 2 M.2 SATA3
  • M-Key, 2280/2210
System Cooling
Fans
  • 4x 8cm heavy duty fans with optimal fan speed control
Air Shroud
  • 2 Air Shroud(s)
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
2x 1600W Redundant Titanium Level power supplies
Dimension

(W x H x L)
  • 73.5 x 40 x 265 mm
AC Input
  • 1000W: 100-127Vac / 50-60Hz
  • 1600W: 200-240Vac / 50-60Hz
  • 1600W: 200-240Vdc / 50-60Hz (for CQC only)
+12V
  • Max: 83.3A / Min: 0A (100Vac-127Vac)
  • Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB
  • Max: 3.5A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level94%+   Titanium Level

 

  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)


Resources
Component Options
AIOM MatrixCPU ListCompatible GPU ListDrive OptionsNVMe OptionsTested AOC ListTested M.2 ListTested Memory
Documentation
ManualsQuick Reference Guide
Software
BIOS DownloadBMC DownloadDrivers & UtilitiesOS Certification
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X13DEM

CSE-HS219-R1K63P 		1

1 		Super X13DEM Motherboard

2U Chassis
Add-on Card / Module AOM-HS119-IO-P 1 Hyper IO Board,RoHS
Backplane BPN-NVME5-HS219N-S24 1 NVMe Gen5 24-slot direct-attached backplane, support NVMe Gen5/SAS4/SAS3/SATA HDD/SSDs.,RoHS
Cable CBL-GNZ5-1307 1 GNZ4C+ X16 (STR to STR),G5,7CM,85 Ohm,RoHS
CBL-PWEX-1142-40 1 MicroHi,(2x4 to 2x4),PH3.0,40CM,8A/pin,18AWG,RoHS
CBL-PWEX-1142-60 1 MicroHi,(2X4 to 2X4) P3.0,60CM,8A/pin,18AWG,RoHS
CBL-SAST-1225LP 1 SlimlineLP x8 (LE) to SlimlineLP x8 (RA),30CM,75/85/100,
CBL-CDAT-0676-66 1 [NR] FRONT CNTL,20 TO 20 PIN,PH0.5, FFC,FLAT,66CM,STD
CBL-PWCD-0160-IS 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,16AWG,RoHS/REACH
Drive Tray(s) MCP-220-00196-0B 24 Metallic black gen-3 hot-swap 2.5 NVMe tool-less tray
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0088P 2 2U Passive CPU HS for X13 Intel Eagle Stream Platform
*Power Supply PWS-1K63A-1R 2 1U 1000W/1600W redundant single output power supply with inp
*Front Panel FPB-FP826-T 1 Chassis front control board for SC826
*Fan FAN-0209L4-1 OR 4 80x80x38 mm, 13.5K RPM, Middle Cooling Fan for 2U Hyper-S Systems
FAN-0223L4 80x80x38 mm, 13.5K RPM Exhaust Fan for 2U Hyper-S(HS219),RoH
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
2nd AIOM/OCP NIC 3.0 Slot Refer to User's Manual - AIOM slot A2 kit
Cable Management Arm + Rail Set MCP-290-00168-0N + MCP-290-11901-0N - 7.5" cable management arm + 41" long ball-bearing rail set
Drive Bay Configuration Options Refer to User's Manual - Drive bay configuration options for NVMe, SAS, or SATA support
Drive Tray Label LBL-0968 - Pack of 4 "NVMe" labels for hot-swap drive tray
Global Services & Support OSNBD3/2/1 - Silver Level, 3/2/1-year onsite NBD SLA
OS4HR3/2/1 - Gold Level, 3/2/1-year onsite 24x7x4 SLA
SMSAD3/2/1 - Bronze Level, 3/2/1-year 3BD SLA
PCIe Slot Configuration Options Refer to User's Manual - PCIe slot configuration options to enable PCIe slots 1-8
Rail Set MCP-290-21103-0N 1 21.65" ball-bearing rail set for Hyper servers
MCP-290-11903-0N • (included in the system ) 1 30.5" ball-bearing rail set for Hyper servers
MCP-290-11902-0N 1 35.25" ball-bearing rail set for Hyper servers
MCP-290-11901-0N 1 41" ball-bearing rail set for Hyper servers
Software SFT-DCMS-Single 1 DataCenter Management Package (per node license)
Trusted Platform Module Options AOM-TPM-9672V-O 1 SPI capable vertical TPM 2.0
AOM-TPM-9672V-FIPS-O 1 AOM-TPM-9672V-FIPS TPM 2.0 support FIPS
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