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SuperServer 1029P-N32R (Complete System Only)

Super Micro Computer, Inc.
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  Products   Systems   [ 1029P-N32R ]





Integrated Board
X11DPS-RE
X11DPS-RE
Coming Soon

Key Features
  - High Throughput Ingest
  - High Density Hot Storage
  - HPC / Data Analytics
  - Media/Video Streaming
  - Content Delivery Network (CDN)
  - Big Data Top of Rack Storage

1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    3 UPI up to 10.4GT/s
2. Up to 3TB ECC RDIMM, up to
    DDR4-2666MHz; 24 DIMM slots
3. 2 PCI-E 3.0 x16 Low-profile slots
4. Dual Drawer/Tray with a total
    of 32 NVMe 2.5" SSDs
5. 2x 10GBase-T LAN ports
6. Built in Intel QAT for Crypto/Compression
7. 8x 40x56mm PWM fans
8. 1600W Redundant Power Supplies
    Platinum Level

Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 4 DIMMs and 4 NVMe). Please contact your Supermicro sales rep for special requirements.

 Drivers & Utilities   BIOS   IPMI   Tested Memory
 Tested M.2 List   NVMe Options   Manuals    OS Certification Matrix  

Product SKUs
SYS-1029P-N32R
  • SuperServer 1029P-N32R (Black)
 
Motherboard

Super X11DPS-RE
 
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • Intel® Xeon® Scalable Processors,
    3 UPI up to 10.4GT/s
  • Support CPU TDP up to 140W
Cores
  • Up to 22 Cores with Intel® HT Technology
 
System Memory
Memory Capacity
  • 24 DIMM slots
  • Up to 3TB ECC RDIMM, DDR4 up to 2666MHz
Memory Type
  • 2666/2400/2133MHz ECC DDR4 SDRAM
 
On-Board Devices
Chipset
  • Intel® C627 chipset
Network Connectivity
  • Intel® X550 Dual Port 10GBase-T
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
  • ASPEED AST2500 BMC
 
Input / Output
LAN
  • 2 RJ45 10GBase-T ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
Video
  • 1 VGA port
Serial Header
  • 1 COM port (header)
 
System BIOS
BIOS Type
  • AMI 32Mb SPI Flash ROM
 
Management
Software
Power Configurations
  • ACPI / APM Power Management
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-136HTS-R1K69P-U2
 
Dimensions and Weight
Height
  • 1.7" (43mm)
Width
  • 17.26" (438mm)
Depth
  • 35.95" (913mm)
Weight
  • Net Weight: 58 lbs (26.3kg)
  • Gross Weight: 93 lbs (42.2kg)
 
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power LED
  • Hard drive activity LED
  • Network activity LEDs
  • System Overheat LED / Fan fail LED /
    UID LED
 
Expansion Slots
PCI-Express
  • 2 PCI-E 3.0 x16 Low-profile slots
M.2
  • M.2 Interface: 2 PCI-E 3.0 x2, RAID 0, 1
  • M.2 Form Factor: 2260/2280/22110
  • M.2 Key: M-Key
 
Drive Bays
Hot-swap
  • Dual Drawer/Tray with a total of 32 NVMe 2.5" SSDs
 
System Cooling
Fans
  • 8x 40x56mm PWM fans
 
AC/DC240V Input Redundant Power Supply
1000 / 1600W 1U Redundant Power Supply
Total Output Power
  • 1000W / 1600W
Dimension
(W x H x L)
  • 73.5 x 40 x 185 mm
Input
  • 100 -- 127Vac / 13.8A / 47-63Hz
  • 200 -- 240Vac / 9.6A / 47-63Hz
  • 200 -- 240Vdc / 8.5A (CCC Only)
+12V
  • Max: 83A / Min: 0A (1000W)
  • Max: 132A / Min: 0A (1600W)
12Vsb
  • Max: 2.1A / Min: 0A
Output Type
  • Gold Finger
Certification Platinum Level Certified    UL/cUL/CB/BSMI/CE/CCC/BIS/KC
  Platinum Certified
 
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 30°C (50°F ~ 86°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

See Parts List

Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.