H11DSU-iN (For A+ Server Only)

AMD, AMD Motherboard, AMD EPYC, EPYC 7000, EPYC, SocketSP3, SocketSP3
A+ Products Motherboards [ H11DSU-iN ]
H11DSU-iN
Key Features
1. Dual AMD EPYC™ 7001/7002* Series Processors (*AMD EPYC 7002 series drop-in
support requires board revision 2.x)
2. 4TB Registered ECC DDR4 2666MHz SDRAM in 32 DIMMs
8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs (Board revision 2.x required)
3. Expansion slots:
WIO:
 1 PCI-E 3.0 x32 Left Riser Slot
 1 PCI-E 3.0 x16 Right Riser Slot
Ultra:
 1 PCI-E 3.0 x40 Far Right Riser Slot
4. 14 SATA3, 2 SATA DOM, 4 NVMe
5. Integrated IPMI 2.0 + KVM with dedicated LAN
6. ASPEED AST2500 BMC graphics
7. Up to 5 USB 3.0 ports
(2 rear + 2 via header + 1 Type A)
8. 8 4-pin PWM Fan & Speed control

Links & Resources
Tested Memory List
Tested HDD List
Tested M.2 List
Tested AOC List
Motherboard Manual
Update Your BIOS
IPMI Firmware
Download the Latest Drivers and Utilities
Download Driver CD
OS Compatibility


Product SKUs
MBD-H11DSU-iN
  • H11DSU-iN
Physical Stats
Form Factor
  • Proprietary Ultra/WIO
Dimensions
  • 17" x 17" (43.2cm x 43.2cm)
Processor/Chipset
CPU
  • Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required)
  • Socket SP3
Cores
  • Up to 32 Cores
  • Up to 64 Cores (Board revision 2.x required)
Chipset
  • System on Chip
System Memory
Memory Capacity
  • 32 DIMM sockets
  • Supports up to 4TB Registered ECC DDR4 2666MHz SDRAM in 32 DIMMs
  • Supports up to 8TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required)
  • 8-channel memory bus
Memory Type
  • DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
  • DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required)
DIMM Sizes
  • 4GB, 8GB, 16GB, 32GB, 64GB, 128GB, 256GB* (*Board revision 2.x required)
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
SATA
  • SATA3 (6 Gbps)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2500 BMC
Network Controllers
  • Provided via Ultra Riser Card
VGA
  • ASPEED AST2500 BMC
Input / Output
SATA
  • 14 SATA3 (6 Gbps) ports
LAN
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 5 USB 3.0 ports (2 rear + 2 via header + 1 Type A)
VGA
  • 1 VGA port
Others
  • 1 COM port (rear)
  • 2 SATA DOM power connector
  • 4 NVMe
  • TPM 2.0 header
Expansion Slots
PCI-Express
  • WIO:
    1 PCI-E 3.0 x32 Left Riser Slot
    1 PCI-E 3.0 x16 Right Riser Slot
  • Ultra:
    1 PCI-E 3.0 x40 Far Right Riser Slot
Server(s) ( with H11DSU-iN )
Model(s)
System BIOS
BIOS Type
  • AMI 128Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 5.1
  • USB Keyboard Support
  • SMBIOS 3.1.1
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +12V, +3.3V, +5V, +5V standby, 3.3V standby
  • VBAT
  • CPU switching voltage regulator
FAN
  • Up to 8-fan status tachometer monitoring
  • Up to eight 4-pin fan headers
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 8x Fan connectors
  • I2C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
Operating Environment / Compliance
Environmental Specifications
  • Operating Temperature:
    10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
    -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)
Optional Parts List
Part Number Qty Description
TPM security module AOM-TPM-9655V - TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF;
AOM-TPM-9665V - TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF;

Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
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