H12DSG-Q-CPU6 (For A+ Server Only)
  A+ Products  Motherboards   [ H12DSG-Q-CPU6 ]
H12DSG-Q-CPU6
Key Features
1. Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
2. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
3. 19 PCI-E 4.0 x8 SlimSAS, 1 PCI-E 4.0/SATA3 x4 hybrid SlimSAS
4. 4 SATA3 and 4 NVMe via SlimSAS
5. Integrated IPMI 2.0 + KVM with dedicated LAN
6. ASPEED AST2600 BMC with IPMI/RedFish support
7. 2 USB 3.0 ports via I/O board

Links & Resources
Tested Memory List
Tested HDD List
Tested AOC List
Motherboard Manual
Update Your BIOS
IPMI Firmware
Download the Latest Drivers and Utilities
Download Driver CD


Product SKUs
MBD-H12DSG-Q-CPU6
  • H12DSG-Q-CPU6 (for server SKUs only)
 
Physical Stats
Form Factor
  • Proprietary
Dimensions
  • 17.32" x 11.8" (44cm x 30cm)
 
Processor/Chipset
CPU
  • Dual AMD EPYC™ 7003/7002 Series Processors
    (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
  • Socket SP3
Cores
  • Up to 64 Cores
Chipset
  • System on Chip
 
System Memory
Memory Capacity
  • 32 DIMM slots
  • Supports up to 8TB Registered ECC DDR4 3200MHz SDRAM
  • 8-channel memory bus
  • For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
Memory Type
  • DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
DIMM Sizes
  • 8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
 
On-Board Devices
SATA
  • 4 SATA3 (6 Gbps) ports via SlimSAS
IPMI
  • Support for Intelligent Platform Management Interface v. 2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2600 BMC
Network Controllers
  • N/A
Graphics
  • ASPEED AST2600 BMC
 
Input / Output
SATA
  • 4 SATA3 (6 Gbps) ports via SlimSAS
LAN
  • 1 RJ45 dedicated IPMI port via I/O board (AOM-PIO-i2XT)
USB
  • 2 USB 3.0 ports via I/O Board (AOM-PIO-i2XT)
VGA
  • 1 VGA port via I/O board (AOM-PIO-i2XT)
Others
  • 1 COM port via I/O Board (AOM-PIO-i2XT)
  • 4 internal NVMe (PCI-E 4.0 x4) ports via 2 SlimSAS (PCIE 4.0 x8)
  • TPM 2.0 header
 
Expansion Slots
PCI-Express
  • 19 PCI-E 4.0 x8 SlimSAS
  • 1 PCI-E 4.0 x4/SATA3 x4 hybrid SlimSAS
Chassis (Optimized for H12DSG-Q-CPU6)
2U
  • SC228GTS-R2K21P
 
Server(s) (with H12DSG-Q-CPU6)
Models(s)
 
System BIOS
BIOS Type
  • AMI 256Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 6.2
  • USB Keyboard Support
  • SMBIOS 3.1.1
 
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
 
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +3.3V, +3.3V, +5V, +5V standby, +12V
  • CPU switching voltage regulator
  • VBAT
FAN
  • Controlled via Fan Board (AOM-228G-FAN)
  • Up to 4 fan status tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 4x Fan modules via FAN Board (AOM-228G-FAN)
  • I²C Temperature Sensing Logic
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
 
Operating Environment / Compliance
Environmental Specifications
  • Operating Temperature:
       10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
Retail Pack List
  Part Number Qty Description
H12DSG-Q-CPU6 MBD-H12DSG-Q-CPU6 -O 1 H12DSG-Q-CPU6 Motherboard
Optional Parts List
  Part Number Qty Description
TPM security module AOM-TPM-9655V - TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF;
AOM-TPM-9665V - TPM 2.0 module with Infineon 9665, RoHS/REACH,PBF;

Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
Page Viewed: