X11DSF-E

24 DIMMs
NVMe
3 UPI

Key Features


  1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
    Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
  2. Intel® C627
  3. Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;
    Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
  4. 1 PCI-E 3.0 x32 Left Riser Slot,
    2 PCI-E 3.0 x4 (Low Profile),
    4 PCI-E 3.0 x16
  5. Dual LAN with 10GBase-T with Intel® X550
  6. Intel® C627 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  7. 1 VGA D-Sub Connector port



Resources
Specifications
Product SKUs
MBD-X11DSF-E
  • X11DSF-E
 
Physical Stats
Form Factor
  • Proprietary
Dimension
  • 16.337" x 17" (41.5cm x 43.18cm)
 
Processor
CPU
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
  • Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Note
  • *2933 MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
 
System Memory
Memory Capacity
  • 24 DIMM slots
  • Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz
  • Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type
  • 2666/2400/2133MHz ECC 3DS DDR4 LRDIMM, RDIMM
DIMM Sizes
  • LRDIMM: 64GB, 128GB
  • RDIMM: 32GB, 64GB, 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
 
On-Board Devices
Chipset
  • Intel® C627
SATA
  • Intel® C627 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
  • ASPEED AST2500
Network Controllers
  • Dual LAN with 10GBase-T with Intel® X550
 
Input / Output
USB
  • 3 USB 3.2 Gen1 port(s) (2 via header; 1 type A)
  • 2 USB 3.0 port(s) (2 rear)
Video Output
  • 1 VGA D-Sub Connector port(s)
Serial Port
  • 1 COM Port(s) (1 header)
DOM
  • 2 SuperDOM (Disk on Module) port with build power
TPM
  • 1 TPM Header
Expansion Slots
PCI-E
  • 1 PCI-E 3.0 x32 Left Riser Slot,
  • 2 PCI-E 3.0 x4 (Low Profile),
  • 4 PCI-E 3.0 x16
 
System BIOS
BIOS Type
  • AMI UEFI
 
Management
Software
  • SuperDoctor® 5, NMI, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, IPMI2.0, Watchdog, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support
System Management Software
  • IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
 
PC Health Monitoring
Voltage
  • VBAT, Monitors CPU voltages, Chipset Voltage, +5V standby, +5V, +3.3V, +12V, +1.8V, +1.5V, Memory Voltages
LED
  • UID/Remote UID
  • CPU / System Overheat LED
FAN
  • 8x 4-pin fan headers (up to 8 fans)
  • Fan speed control
  • Pulse Width Modulated (PWM) fan connectors
  • Overheat LED indication
  • 8x fans with tachometer monitoring
Other Features
  • WOL, UID, System level control, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, Chassis intrusion detection, RoHS, Halogen Free, Intel® QuickAssist Technology, Innovation Engine
 
Operating Environment
Operating Temperature Range
  • 10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non Operating Relative Humidity Range
  • 5% - 95% (non-condensing)
Parts List
Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11DSF-E 1 X11DSF-E Motherboard
Optional Parts List
Name Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
Server (Optimized for X11DSF-E)
Server Name
SSG-1029P-NES32R
X11DSF-E (For SuperServer Only)