SuperServer SYS-821GE-TNHR (Complete System Only)

DP Intel 8U System with NVIDIA HGX H100 8-GPU and Rear I/O

SYS-821GE-TNHR Main SYS-821GE-TNHR Angle SYS-821GE-TNHR Top SYS-821GE-TNHR Top1 SYS-821GE-TNHR Front SYS-821GE-TNHR Rear
Integrated Board: X13DEG-OAD
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Key Applications

  • High Performance Computing
  • AI/Deep Learning Training
  • Industrial Automation, Retail
  • Healthcare
  • Conversational AI
  • Business Intelligence & Analytics
  • Drug Discovery
  • Climate and Weather Modeling
  • Finance & Economics

Key Features

  1. 5th/4th Gen Intel®  Xeon® Scalable processor support
  2. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
  3. 8 PCIe Gen 5.0 X16 LP
    2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional)
  4. Flexible networking options
  5. 2 M.2 NVMe for boot drive only
    16x 2.5" Hot-swap  NVMe drive bays (12x by default, 4x optional)
    3x 2.5" Hot-swap  SATA drive bays
    Optional: 8x 2.5" Hot-swap  SATA drive bays
  6. 10 heavy duty fans with optimal fan speed control
  7. Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level
    6x 3000W (4+2) Redundant Power Supplies, Titanium Level
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SYS-821GE-TNHR
Specifications Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-821GE-TNHR
Motherboard
Super X13DEG-OAD
Processor
CPU
Core Count
  • Up to 64C/128T; Up to 320MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
  • Supports up to 385W TDP CPUs (Liquid Cooled)​
GPU
Max GPU Count
  • Up to 8 onboard GPU(s)
Supported GPU
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • NVIDIA® NVLink® with NVSwitch™
Certification
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices
Chipset
  • Intel® C741
Network Connectivity
  • 2 RJ45 10GbE with Intel® X550-AT2 (optional)
  • 2 SFP28 25GbE with Broadcom® BCM57414 (optional)
  • 2 RJ45 10GbE with Intel® X710-AT2 (optional)
  • View AOC Options
NVMe
Input / Output
Video
  • 1 VGA port(s)
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
  • 8+4 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 8U Rackmount
Model
  • CSE-GP801TS
chassisWeight
  • Net Weight: 166 lbs (75.3 kg)
  • Gross Weight: 225 lbs (102.1 kg)
Dimensions and Weight
Height
  • 14" (355.6 mm)
Width
  • 17.2" (437 mm)
Depth
  • 33.2" (843.28 mm)
Package
  • 29.5" (H) x 27.5" (W) x 51.2" (D)
Weight
  • Gross Weight: 225 lbs (102.1 kg)
  • Net Weight: 166 lbs (75.3 kg)
Available Color
  • Black front & silver body
Front Panel
LED
  • Hard drive activity LED
  • Network activity LEDs
  • Power status LED
  • System Overheat & Power Fail LED
Buttons
  • Power On/Off button
  • System Reset button
Expansion Slots
PCI-Express (PCIe) Configuration
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 15 bay(s)
    • 12 front hot-swap 2.5" NVMe drive bay(s)
    • 3 front hot-swap 2.5" SATA drive bay(s)
  • Option A: Total 19 bay(s)
    • 12 front hot-swap 2.5" NVMe drive bay(s)
    • 4 front hot-swap 2.5" NVMe* drive bay(s)
    • 3 front hot-swap 2.5" SATA drive bay(s)
  • (*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)
  • View Drive Options
M.2
System Cooling
Fans
  • 10 heavy duty fans with optimal fan speed control
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate (optional)
Power Supply
6x 3000W Redundant Titanium Level power supplies
Dimension (WxHxL)
  • 106.5 x 82.1 x 245.5 mm
+12V
  • Max: 91.66A / Min: 0A (200Vac-240Vac)
12V SB
  • Max: 3A / Min: 0A
AC Input
  • 3000W: 0240Vdc / 50-60Hz (for CQC only)
  • 2880W: 200-207Vac / 50-60Hz
  • 3000W: 207-240Vac / 50-60Hz
Output Type
  • Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
8x Power Supply optional parts PWS-3K06G-2R 2 AC-DC 3000W, Titanium efficiency, DC output: 54Vdc/45A
8x SATA optional sets CBL-GNZ2-1221MTS4 1 GenZ 2C+2 mount holes to SlimSAS x8,21cm,31AWG,RoHS
MCP-220-00147-0B • 5 Black gen-3 hot-swap 2.5" Tool-less HDD tray (clip design)
Side expention sets AOM-DP801-PCIE-P 1 NIC Riser board(After Mid-Plane) for Delta-Next GPU System,RoHS
AOM-DP801-SW-P 1 NIC adaptor board with PLX switch for Delta-Next GPU system,RoHS
CBL-PWEX-1142B-40 1 MicroHi(2x4 to 2x4), PH3.0, 40cm, 8.5A/p, 18AWG, RoHS
CBL-MCIO-1255M5 • 4 MCIO x8 (STR to STR),55CM,30AWG,RoHS
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