SuperServer SYS-211SE-31D

Key Applications

  • Multi-Access Edge Computing
  • Flex-RAN, Open-RAN vBBU
  • Telecom DRAN, CRAN, and Edge Core Application
  • Enterprise Edge Computing

Key Features

Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single Socket E (LGA-4677) 5th Gen Intel® Xeon®/4th Gen Intel® Xeon Scalable processors (per node)
  2. 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s; R-DIMM / R-DIMM 3DS (per node)
  3. 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node)
  4. 2 NVMe M.2 2280/22110 (per node)
  5. 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node)
  6. Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
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Specifications Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-211SE-31D
Motherboard
Super X13SEED-F
Processor (per Node)
CPU
Core Count
  • Up to 52C/104T; Up to 97.5MB Cache
Note
  • Supports 85W - 300W TDP CPUs (Air Cooled)*
  • *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.​
System Memory (per Node)
Memory
  • Slot Count: 8 DIMM slots/1 Channels
  • Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1 V
On-Board Devices (per Node)
Chipset
  • Intel® C741
Network Connectivity
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN
  • 1 RJ45 GbE LAN port (shared with IPMI)
Video
  • 1 VGA port(s)
Serial Port
  • 1 COM Port(s) (1 COM)
Others
  • 1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable)
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-SE201-R2K06P
Note
  • 16.9” (430mm) chassis depth
  • Front access IO design, and tool less serviceability
  • Three front hot-swappable nodes with single CPU socket and 8 DIMM design
Dimensions and Weight
Height
  • 3.5" (88mm)
Width
  • 17.7" (449mm)
Depth
  • 16.9" (430mm)
Package
  • 9.5" (H) x 29.5" (W) x 23.2" (D)
Weight
  • Net Weight: 55.1 lbs (25 kg)
  • Gross Weight: 70.6 lbs (32 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off 
  • UID button
LEDs
  • LAN1 activity
  • Power status
  • System information
Expansion Slots (per Node)
PCI-Express (PCIe)
Drive Bays / Storage (per Node)
Drive Bays
  • N/A
M.2
System Cooling
Air Shroud
  • 3 Air Shroud(s)
Fans
  • 12x 8cm heavy duty fans with optimal fan speed control 40x56mm Fan(s)
Power Supply
2000W Redundant power supplies
Total Output Power
Dimension

(W x H x L)
  • 73.5 x 40 x 265 mm
+12V
  • Max: 166.6A
12V SB
  • Max: 4A
Operating Environment
Environmental Spec.
  • Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
Note
  • Operating Temperature (CPU TDP up to 300W) : Continuous 0°C to 35°C (32°F to 95°F)
  • Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 40°C (32°F ~ 104°F), Short term -5°C ~ 55°C (23°F ~ 131°F)


Resources & Downloads
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X13SEED-F

CSE-SE201-R2K06P
3

1
Super X13SEED-F Motherboard

2U Chassis
Add-on Card / Module AOM-BPN-SE3N-P 1 Backplane for SuperEdge 2U3N,RoHS
Cable CBL-0218L 3 11.5CM KVM/SUVI 36PIN TO 9PIN/15PIN/2USB
CBL-PWEX-1058 2 48VDC input power cable for PWS-2K03D-1R, 4M, 8AWG,RoHS
Riser Card RSC-W-66G5 3 1U LHS WIO Riser card with two PCIe 5.0 X16 slots,HF,R
RSC-WR-6G5 3 1U RHS WIO Riser card with one PCIe 5.0 X16 slot,HF,Ro
Software SFT-OOB-LIC 3 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P1046V 3 1U Prop. Passive HS for Intel B13 Blade Series
*Power Supply PWS-2K06F-1R 2 2000W 1U -48Vdc single output Redundancy power supply
*Power Distributor PDB-PT201-DSG 2 Super Edge pass through board support Ultra powers up to 6KW
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
Optional sliding rail kit MCP-290-00144-1N - 2U fixed rail set, quick release, default for 2,3U 17.6"W, 26.5"-33.5" D
TPM security module AOM-TPM-9670V - SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
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