SuperServer SYS-211TP-HPTR

SYS-211TP-HPTR Main SYS-211TP-HPTR Angle SYS-211TP-HPTR Node SYS-211TP-HPTR Front SYS-211TP-HPTR Rear
Integrated Board: X13SET-PT

Key Applications

  • Multi-Access Edge Computing
  • Flex-RAN, Open-RAN vBBU
  • Telecom DRAN, CRAN, and Edge Core Application
  • Enterprise Edge Computing

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processor (per node)
  2. Intel® C741 Chipset
  3. 8 DIMMs; Up to 2TB ECC DDR5-4800: R-DIMM/R-DIMM 3DS (per node
  4. 2 PCIe Gen5 x16 HHHL slot (per node)
  5. 2 NVMe M.2 2280 / 25110 (per node)
    Front hot-swappable 2.5” HDD/SSD tray (6 tray per node)
  6. 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
  7.  1+1 Redundant 2000W AC Power Supplies (per system)
  8. Intel® X710 Dual port 10G SFP+ onboard
Specifications Resources Parts List
Product SKUs
SuperServer SYS-211TP-HPTR (Silver)
Super X13SET-PT
Processor (per Node)
Core Count
  • Up to 40C/80T; Up to 82.5MB Cache per CPU
  • Supports 85W - 270W TDP CPUs (Air Cooled)
System Memory (per Node)
  • Memory Capacity: 8 DIMM slots
  • Up to 2TB: 8x 256 GB DDR5-4800MHz ECC R-DIMM/R-DIMM 3DS
  • Memory Type: 4800MHz ECC DDR5 R-DIMM / R-DIMM 3DS
Memory Voltage
  • 1.1 V
Error Detection
  • ECC
On-Board Devices (per Node)
  • SATA3 (6Gbps)
  • Intel® C741
Network Connectivity
  • 2x 10GbE SFP+ with Intel® X710-BM2
Input / Output (per Node)
  • 1 RJ45 Dedicated IPMI LAN port
  • 2x 10 GbE SFP+ (LAN1 shared with IPMI)
  • 2 USB 3.2  Gen1 port(s) (2 USB)
  • 1 VGA port(s)
  • SFP+  LAN1 shared with IPMI
System BIOS
  • AMI 256MB SPI Flash
BIOS Features
  • ACPI Power Management 6.4
  • PCI firmware 4.0
  • Riser Card audio detection support
  • RTC (Real Time Clock) Wakeup
  • SMBIOS 3.5 or later
  • SPI dual/quad speed support
  • UEFI 2.9
  • Trusted Platform Module (TPM) 2.0
PC Health Monitoring
  • Monitors for CPU Cores, Chipset Voltages, Memory
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Form Factor
  • 2U Rackmount
  • CSE-217HQ+-R2K04BP4
Dimensions and Weight
  • 3.5" (88mm)
  • 17.25" (438mm)
  • 28.75" (730mm)
  • 9.8" (H) x 20.7" (W) x 38" (D)
  • Net Weight: 70 lbs (31.8 kg)
  • Gross Weight: 90 lbs (40.8 kg)
Available Color
  • Silver
Front Panel
  • Power On/Off button
  • UID button
  • Network activity LED
  • Power status LED
  • System information (overheat/UID) LED
Expansion Slots (per Node)
PCI-Express (PCIe)
  • 2 PCIe 5.0 x16 LP slot(s)
Drive Bays / Storage (per Node)
  • 6x 2.5" hot-swap SATA drive bays
  • 2 M.2 NVMe
  • M-Key, 2280/25110
System Cooling
Air Shroud
  • 4 Air Shroud(s)
  • 4x 8cm heavy duty fans with optimal fan speed control 80x80x38mm  Fan(s)
Power Supply
2000W Redundant Titanium Level power supplies

(W x H x L)
  • 76 x 40 x 336 mm
AC Input
  • 1000W: 100-127Vac / 50-60Hz
  • 1800W: 200-220Vac / 50-60Hz
  • 2000W: 200-240Vac / 50-60Hz (for UL/cUL only)
  • 1980W: 220-230Vac / 50-60Hz
  • 2000W: 230-240Vac / 50-60Hz
  • Max: 83.3A / Min: 0A (100Vac-127Vac)
  • Max: 150A / Min: 0A (200Vac-220Vac)
  • Max: 166.7A / Min: 0A (200Vac-240Vac) (for UL/cUL only)
  • Max: 165A / Min: 0A (220Vac-230Vac)
  • Max: 166.7A / Min: 0A (230Vac-240Vac)
  • Max: 1A / Min: 0A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level94%+   Titanium Level


  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
  • Non-operating Temperature:
       0°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X13SET-PT


Super X13SET-PT Motherboard

2U Chassis
Backplane BPN-ADP-6SATA3P 4 Backplan adapter card; 6SATA ports,RoHS/REACH,PBF
BPN-SAS3-217HQ3 1 2U 4-Node TwinPro Backplane for 6x2.5� SAS3/SATA3 HDD/SDD
Cable CBL-PWCD-0900 2 PWCD,US/EU/Canada/China/Australia,IEC60320 C14 TO C13,4FT,17
Parts MCP-150-00015-0B 4 Rubber pad, 3.0mm H, 10x10mm
Riser Card RSC-P-6G5 4 1U LHS TwinPro Riser card with one PCIe 5.0 X16 slot,HF,
RSC-PR-6G5 4 1U RHS TwinPro Riser card with one PCIe 5.0 X16 slot,HF
Software SFT-OOB-LIC 4 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0087V 4 1U Passive CPU VC HS for X13 Intel Eagle Stream Platform
*Power Supply PWS-2K04A-1R 2 AC-DC 2000W, Titanium Level, Redundancy, 1U, PMBus 1.2, +12V/+5Vsb, 360x76x40mm,HF,RoHS/REACH
*Power Distributor PDB-PT217-H2412 1 2U support redundancy input powers up to 2.6KW for Twin seri
*Fan FAN-0183L4 4 80x80x38 mm, 16.5K RPM, Non-hot-swappable Middle Cooling Fan for X11 Twin Pro, X10 and X11 Big Twin Series Servers
*Drive Tray(s) MCP-220-00047-0B 24 Black gen 3rd hot-swap 2.5inch HDD tray
*Rail Set MCP-290-00053-0N 1 Rail set, quick/quick, default for 2,3U 17.2"W
*Fan Holder MCP-320-21701-0N 2 Twin Pro fan holder (hold 2 80x38 fans),RoHS/REACH
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
TPM security module AOM-TPM-9670H-FIPS-O 1 AOM-TPM-9670H-FIPS supporting FIPS 140-2,RoHS
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