SuperServer ASG-2115S-NE332R (Complete System Only)

ASG-2115S-NE332R Main ASG-2115S-NE332R Angle ASG-2115S-NE332R Top ASG-2115S-NE332R Top1 ASG-2115S-NE332R Front ASG-2115S-NE332R Rear
Integrated Board: H13SSF
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Key Applications

  • Software-defined Storage
  • In-Memory Computing
  • Data Intensive HPC
  • Private & Hybrid Cloud
  • NVMe Over Fabrics Solution

Key Features

  1. Single Socket SP5 AMD EPYC™ 9004 Series processors. Up to 350W TDP.
  2. Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory
  3. Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant)
  4. 32x hot-swap E3.S (7.5mm) NVMe drive bays
  5. Redundant Titanium 2000W Power Supplies
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Specifications Resources Parts List
Specifications
Product SKUs
A+ Server ASG-2115S-NE332R (Silver)
Motherboard
Super H13SSF
Processor
CPU
Note
  • Supports 200W - 350W TDP CPUs (Air Cooled)
System Memory
Memory
  • Memory Capacity: 24 DIMM slots
  • Up to 4TB: 16x 256 GB DRAM
  • Up to 6TB: 24x 256 GB DRAM
  • Memory Type: 4800MHz ECC DDR5 RDIMM;LRDIMM
Memory Voltage
  • 1.1 V
Error Detection
  • ECC
On-Board Devices
Chipset
  • System on Chip
Network Connectivity
  • Via AIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 4 USB 3.0 port(s) (2 front; 2 rear)
Video
  • 1 VGA port(s)
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 4+1 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-236E3-R2K08P
Dimensions and Weight
Height
  • 3.5" (89.8mm)
Width
  • 17.2" (438.4mm)
Depth
  • 30.8" (789.9mm)
Package
  • 10" (H) x 26.5" (W) x 43.25" (D)
Weight
  • Net Weight: 55 lbs (24.95 kg)
  • Gross Weight: 77 lbs (34.93 kg)
Available Color
  • Silver
Expansion Slots
PCI-Express (PCIe)
  • 2 PCIe 5.0 x16 FH slot(s)
  • 2 PCIe 5.0 x16 AIOM slot(s)
Drive Bays / Storage
Hot-swap
  • 32x E3.S Hot-swap NVMe (1T/2T) drive slots
M.2
  • 2x PCIe 3.0 (NVMe slots)
  • M-Key, 2280 and 22110
System Cooling
Fans
  • 4 Heavy Duty 8cm Fan(s)
Power Supply
2000W Redundant Titanium Level power supplies
Dimension

(W x H x L)
  • 73.5 x 40 x 203 mm
AC Input
  • 1000W: 100-127Vac / 50-60Hz
  • 1800W: 200-220Vac / 50-60Hz
  • 1980W: 220-230Vac / 50-60Hz
  • 2000W: 220-240Vac / 50-60Hz (for UL only)
  • 2000W: 230-240Vac / 50-60Hz
  • 2000W: 230-240Vdc / 50-60Hz (for China only)
+12V
  • Max: 83A / Min: 0A (100Vac-127Vac)
  • Max: 150A / Min: 0A (200Vac-220Vac)
  • Max: 165A / Min: 0A (220Vac-230Vac)
  • Max: 166A / Min: 0A (230Vac-240Vac)
12V SB
  • Max: 3.5A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level94%+   Titanium Level

 

  [ Test Report ]
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (Non-Condensing)
  • Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)


Resources
Component Options
AIOM MatrixTested AOC ListTested Memory
Software
BIOS DownloadBMC Download
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-H13SSF

CSE-236E3-R2K08P 		1

1 		Super H13SSF Motherboard

2U Chassis
Add-on Card / Module AOM-DSF-IO-P 1 AOM BMC LAN/VGA/USB/COM IO Board
Backplane BPN-E3S5-236N 2 2U 12-slot PCIe Gen5 hot swappable EDSFF E3.S backplane,RoHS
BPN-SAS3-826TQ-B2B 1 2-port 2U SAS3 12Gbps backplane, support up to 2x 2.5-inch SAS3/SATA3 HDD/SSD
Cable CBL-PWEX-1100-25 1 MicroFit 2x2F/PH3.0 to 1x4F/PH5.08,25cm,10A/pin,16AWG,R
CBL-PWEX-1142B-45 2 MicroHi (2x4F to 2x4F), PH3.0, 45cm, 8.5A/p,18#,RoHS
CBL-SAST-1215X-85 1 SlimSAS (x8 to x8),STR,XMap,15cm,32#,85 Ohm,RoHS
CBL-SAST-1280QT4S2-100 1 SlimSASx4 STR to 4xSATA w/2SB,80CM,100Ohm,RoHS
Air Shroud MCP-310-23602-0N 1 SC236ES Air Shroud (CPU &DIMM) modular for H13SSF
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P2083P 1 2U Passive EVAC CPU HS for H13 Hyper-U Series Servers
*Power Supply PWS-2K08A-1R 2 1U 2000W 100-240VAC Titanium Ultra power supply 73.5x40x203mm
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
Network Cards More - AOC Compatibility Matrix (Select Storage & Generation)
AOC-SGP-I2 - Standard LP 2-port GbE, Intel 82575
AOC-S40G-I2Q - Standard LP 2-port 40GbE controller, Intel Fortville XL710
AOC-S25G-M2S - Standard LP, 2x 25GbE SFP28, Mellanox ConnectX-4 LX EN
Power Cord CBL-PWCD-0300-IS - PWCD,US,IEC60320 C14 TO C13,6FT,18AWG,RoHS/REACH
CBL-PWCD-0579 - Power Cord Type IEC (C14 to C13) 6 ft (14AWG), 15A, 250V
CBL-PWCD-0579-1 - Power Cord Type IEC (C14 to C13) 6 ft (14AWG), 15A, 250V
TPM AOM-TPM-9671V-S-O 1 TPM 1.2, vertical form factor, provisioned for server
AOM-TPM-9670V-S-O 1 TPM 2.0, vertical form factor, provisioned for server
Storage A+ Server ASG-2115S-NE332R (Complete System Only ) Coming Soon