SuperServer SSG-221E-NE324R (Complete System Only)

SSG-221E-NE324R Main SSG-221E-NE324R Angle SSG-221E-NE324R Top SSG-221E-NE324R Front SSG-221E-NE324R Rear SSG-221E-NE324R Opt
Integrated Board: X13DSF-A
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Key Applications

  • Software-defined Storage
  • In-Memory Computing
  • Data Intensive HPC
  • Private & Hybrid Cloud
  • NVMe Over Fabrics Solution

Key Features

  1. Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP.
  2. Supports 32 DIMMs with 2DPC, up to 8TB memory capacity with 32 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory
  3. Two PCIe 5.0 x16 slots & two PCIe x8 slots and two AIOM connectors (OCP 3.0 SFF compliant)
  4. 24x hot-swap E3.S (7.5mm) NVMe drive bays
  5. Redundant Titanium 2000W Power Supplies
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Specifications Resources Parts List
Specifications
Product SKUs
SuperServer SSG-221E-NE324R (Silver)
Motherboard
Super X13DSF-A
Processor
CPU
Note
  • Supports 145W - 350W TDP CPUs (Air Cooled)
System Memory
Memory
  • Memory Capacity: 32 DIMM slots
  • Up to 8TB: 32x 256 GB DRAM
  • Memory Type: 4800MHz ECC DDR5 RDIMM;LRDIMM
On-Board Devices
Chipset
  • Intel® C741
Network Connectivity
  • Via AIOM
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 7 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-236E3-R2K08P
Dimensions and Weight
Height
  • 3.5" (89.8mm)
Width
  • 17.2" (438.4mm)
Depth
  • 30.8" (789.9mm)
Package
  • 10" (H) x 26.5" (W) x 43.25" (D)
Weight
  • Net Weight: 55 lbs (24.95 kg)
  • Gross Weight: 77 lbs (34.93 kg)
Available Color
  • Silver
Expansion Slots
PCI-Express (PCIe)
  • 1 PCIe 5.0 x8 FH slot(s)
  • 1 PCIe 5.0 x16 FH slot(s)
  • 1 PCIe 5.0 x8 AIOM slot(s)
  • 1 PCIe 5.0 x16 AIOM slot(s)
Drive Bays / Storage
Hot-swap
  • 24x E3.S Hot-swap NVMe (1T) drive slots
M.2
  • 2x PCIe 3.0 (Hybrid NVMe or SATA3)
  • M-Key, 2280 and 22110
System Cooling
Fans
  • 8 Heavy Duty 8cm Fan(s)
Power Supply
2000W Redundant Titanium Level power supplies
Dimension

(W x H x L)
  • 73.5 x 40 x 203 mm
AC Input
  • 1000W: 100-127Vac / 50-60Hz
  • 1800W: 200-220Vac / 50-60Hz
  • 1980W: 220-230Vac / 50-60Hz
  • 2000W: 220-240Vac / 50-60Hz (for UL only)
  • 2000W: 230-240Vac / 50-60Hz
  • 2000W: 230-240Vdc / 50-60Hz (for China only)
+12V
  • Max: 83A / Min: 0A (100Vac-127Vac)
  • Max: 150A / Min: 0A (200Vac-220Vac)
  • Max: 165A / Min: 0A (220Vac-230Vac)
  • Max: 166A / Min: 0A (230Vac-240Vac)
12V SB
  • Max: 3.5A
Output Type
  • Backplanes (gold finger)
Certification Titanium Level94%+   Titanium Level

 

  [ Test Report ]
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
       8% to 90% (Non-Condensing)
  • Non-operating Relative Humidity:
       5% to 95% (Non-Condensing)


Resources
Component Options
AIOM MatrixCPU ListNVMe OptionsTested AOC ListTested M.2 ListTested Memory
Software
BIOS DownloadBMC DownloadDrivers & Utilities
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X13DSF-A

CSE-236E3-R2K08P 		1

1 		Super X13DSF-A Motherboard

2U Chassis
Add-on Card / Module AOM-DSF-IO-P 1 AOM BMC LAN/VGA/USB/COM IO Board
Backplane BPN-E3S5-236N 2 2U 12-slot PCIe Gen5 hot swappable EDSFF E3.S backplane,RoHS
BPN-SAS3-826TQ-B2B 1 2-port 2U SAS3 12Gbps backplane, support up to 2x 2.5-inch SAS3/SATA3 HDD/SSD
Cable CBL-MCIO-1422LO5Y 12 [NR] MCIO x8 LE to 2 ORTHO x4 1C,22cm,30AWG,RoHS
CBL-PWEX-1100-25 1 MicroFit 2x2F/PH3.0 to 1x4F/PH5.08,25cm,10A/pin,16AWG,R
CBL-PWEX-1142B-45 2 MicroHi (2x4F to 2x4F), PH3.0, 45cm, 8.5A/p,18#,RoHS
CBL-SAST-1215X-85 1 SlimSAS (x8 to x8),STR,XMap,15cm,32#,85 Ohm,RoHS
CBL-SAST-1280QT4S2-100 1 SlimSASx4 STR to 4xSATA w/2SB,80CM,100Ohm,RoHS
Air Shroud MCP-310-23601-0N 1 SC236ES Air Shroud (CPU &DIMM) modular for X13DSF-A
Software SFT-OOB-LIC 1 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0088P 2 2U Passive CPU HS for X13 Intel Eagle Stream Platform
*Power Supply PWS-2K08A-1R 2 1U 2000W 100-240VAC Titanium Ultra power supply 73.5x40x203mm
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
Network Cards AOC-SGP-I2 - Standard LP 2-port GbE, Intel 82575
AOC-S40G-I2Q - Standard LP 2-port 40GbE controller, Intel Fortville XL710
AOC-S25G-M2S - Standard LP, 2x 25GbE SFP28, Mellanox ConnectX-4 LX EN
More - AOC Compatibility Matrix (Select Storage & Generation)
Power Cord CBL-PWCD-0579-1 - Power Cord Type IEC (C14 to C13) 6 ft (14AWG), 15A, 250V
CBL-PWCD-0300-IS - PWCD,US,IEC60320 C14 TO C13,6FT,18AWG,RoHS/REACH
CBL-PWCD-0579 - Power Cord Type IEC (C14 to C13) 6 ft (14AWG), 15A, 250V
TPM AOM-TPM-9670V-S-O 1 TPM 2.0, vertical form factor, provisioned for server
AOM-TPM-9671V-S-O 1 TPM 1.2, vertical form factor, provisioned for server
Storage SuperServer SSG-221E-NE324R (Complete System Only ) Coming Soon