2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
4 PCIe 3.0 x16, 1 PCIe 3.0 x32 Riser Slot M.2 Interface: 1 PCIe 3.0 x4 M.2 Form Factor: 2242, 2260, 2280 M.2 Key: M-Key M.2 type: SATA and NVMe
Dual LAN with 10GBase-T with Intel® X540 10GbE Controller
SpecificationsResourcesParts List
Specifications
Product SKUs
MBD-X11DGQ
Physical Stats
Form Factor
Proprietary
Dimension
12.9" x 16.9" (32.77cm x 42.93cm)
Processor
CPU
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Note
*2933 MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
*2933 MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
Memory Capacity
12 DIMM slots
Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
