SuperServer SYS-210SE-31A

Key Applications

  • Multi-Access Edge Computing
  • Flex-RAN, Open-RAN vBBU
  • Telecom DRAN, CRAN, and Edge Core Application
  • Enterprise Edge Computing

Key Features

Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processor (per node)
  2. 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM (per node)
  3. 2 PCI-E Gen4 x16 FHHL slot and 1 PCI-E Gen4 x16 HHHL slot (per node)
  4. 2 NVMe M.2 2280/22110 (per node)
  5. 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node)
  6. Front-access 2000W AC Redundant Power Supplies (per system)
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Specifications Resources Parts List
Specifications
Product SKUs
SuperServer SYS-210SE-31A (Silver)
Motherboard
Super X12SPED-F
Processor (per Node)
CPU
  • Single Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
  • Support CPU TDP 85-270W
  • Please contact Supermicro Technical Support for supporting conditions of high power (TDP >205W) processors.
Cores
  • Up to 32C/64T; Up to 48MB Cache
System Memory (per Node)
Memory
  • Memory Capacity: 8 DIMM slots
  • Memory Type: 3200MHz ECC DDR4 RDIMM/LRDIMM
Memory Voltage
  • 1.2 V
Error Detection
  • ECC
On-Board Devices (per Node)
Chipset
  • Intel® C621A
Network Connectivity
  • 1x 1GbE BaseT port(s)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN
  • 1 RJ45 GbE LAN port (Shared NIC
Video
  • 1 VGA port(s)
Serial Port
  • 1 COM Port(s) (1 COM)
Others
  • 1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable)
Management
Software
  • SuperDoctor® 5
  • IPMI 2.0
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-SE201-R2K07P
Note
  • 16.9” (430mm) chassis depth
  • Front access IO design, and tool less serviceability
  • Three front hot-swappable nodes with single CPU socket and 8 DIMM design
Dimensions and Weight
Height
  • 3.5" (88mm)
Width
  • 17.7" (449mm)
Depth
  • 16.9" (430mm)
Package
  • 9.5" (H) x 29.5" (W) x 23.2" (D)
Weight
  • Net Weight: 55.1 lbs (25 kg)
  • Gross Weight: 70.6 lbs (32 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off 
  • UID button
LEDs
  • LAN1 activity
  • Power status
  • System information
Expansion Slots (per Node)
PCI-Express (PCI-E)
  • 2 PCIe 4.0 x16 FHHL, 1 PCIe 4.0 x16 LP
Drive Bays / Storage (per Node)
Drive Bays
  • N/A
M.2
  • 2 M.2 NVMe
  • M-Key, 2280/22110
System Cooling
Air Shroud
  • 3 Air Shroud(s) Air Shroud(s)
Fans
  • 12x 8cm heavy duty fans with optimal fan speed control 40x56mm Fan(s)
Power Supply
2000W Redundant AC 100-240V Power Supply
Dimension

(W x H x L)
  • 73.5 x 40 x 265 mm
AC Input
  • 1000W: 100-127Vac / 9A-12A / 50-60Hz
  • 1800W: 200-220Vac / 9.8A-10A / 50-60Hz
  • 2000W: 220-240Vac / 10A-11A / 50-60Hz
+12V
  • Max: 83A / Min: 0A (100Vac-127Vac)
  • Max: 150A / Min: 0A (200Vac-220Vac)
  • Max: 166A / Min: 0A (220Vac-240Vac)
Certification    

  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
Note
  • Operating Temperature (CPU TDP up to 270W) : Continuous0°C to 35°C (32°F to 95°F)
  • Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 35°C (32°F ~ 95°F), Short term -5°C ~ 55°C (23°F ~ 131°F)


Resources
Parts List
Standard Parts (Parts Included)
Part Number Qty Description
Motherboard / Chassis MBD-X12SPED-F

CSE-SE201-R2K07P
3

1
Super X12SPED-F Motherboard

2U Chassis
Add-on Card / Module AOM-BPN-SE3N-P 1 Backplane for SuperEdge 2U3N,RoHS
Cable CBL-0218L 1 11.5CM KVM/SUVI 36PIN TO 9PIN/15PIN/2USB
Riser Card RSC-W-66G4 3 1U LHS WIO Riser card with two PCI-E 4.0 x16 slots,HF,RoHS
RSC-WR-6 3 1U RHS WIO Riser card with one PCI-E 4.0 x16 slot,HF,RoHS
Software SFT-OOB-LIC 3 License key for enabling OOB BIOS management
Heatsink / Retention SNK-P0077V 3 X12 ICX/CPX CPU Heatsink (78x113x25.5mm), VC Base, Cu Fin
*Power Supply PWS-2K07F-1R 2 1U 2000W 90-264Vac/47-63Hz, wide DC input 180Vdc-300Vdc, 12V
*Power Distributor PDB-PT201-DSG 2 Super Edge pass through board support Ultra powers up to 6KW
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.
Optional Parts List
Part Number Qty Description
Optional sliding rail kit MCP-290-00144-1N - 2U fixed rail set, quick release, default for 2,3U 17.6"W, 26.5"-33.5" D
TPM security module AOM-TPM-9670V - SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
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